GB2220956B - Ultrafine wires made of copper alloy and semiconductor devices using same - Google Patents
Ultrafine wires made of copper alloy and semiconductor devices using sameInfo
- Publication number
- GB2220956B GB2220956B GB8911485A GB8911485A GB2220956B GB 2220956 B GB2220956 B GB 2220956B GB 8911485 A GB8911485 A GB 8911485A GB 8911485 A GB8911485 A GB 8911485A GB 2220956 B GB2220956 B GB 2220956B
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper alloy
- same
- semiconductor devices
- wires made
- ultrafine wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 229910052748 manganese Inorganic materials 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 229910052711 selenium Inorganic materials 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 229910052717 sulfur Inorganic materials 0.000 abstract 1
- 229910052714 tellurium Inorganic materials 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
Abstract
An ultrafine copper alloy wire, comprising (a) a base material composed essentially of an oxygen-free copper containing not higher than 1.0 ppm in total of at least one member selected from the group consisting of S, Se and Te and balance copper, and (b) at least one alloy element selected from the group consisting of Si, Al, Cr, Fe, Mn, Ni, P, Sn and Zn in a total amount in the range of 1.0 to 500 ppm, and a semiconductor device comprising a bonding wire made of the ultrafine copper alloy wire.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63121477A JPH01291435A (en) | 1988-05-18 | 1988-05-18 | Extrafine copper alloy wire for semiconductor device and semiconductor device |
JP63121476A JPH01290231A (en) | 1988-05-18 | 1988-05-18 | Semiconductor device and copper allow extremely fine wire therefor |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8911485D0 GB8911485D0 (en) | 1989-07-05 |
GB2220956A GB2220956A (en) | 1990-01-24 |
GB2220956B true GB2220956B (en) | 1991-07-17 |
Family
ID=26458835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8911485A Expired - Fee Related GB2220956B (en) | 1988-05-18 | 1989-05-18 | Ultrafine wires made of copper alloy and semiconductor devices using same |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR900019209A (en) |
DE (1) | DE3916168A1 (en) |
GB (1) | GB2220956B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4304878A1 (en) * | 1992-02-21 | 1993-08-26 | Furukawa Electric Co Ltd | |
DE102004010040A1 (en) * | 2004-03-02 | 2005-09-15 | Norddeutsche Affinerie Ag | Copper wire and method and apparatus for making a copper wire |
US8610291B2 (en) * | 2006-08-31 | 2013-12-17 | Nippon Steel & Sumikin Materials Co., Ltd. | Copper alloy bonding wire for semiconductor device |
SG178063A1 (en) * | 2009-07-30 | 2012-03-29 | Nippon Steel Materials Co Ltd | Bonding wire for semiconductor |
WO2017221434A1 (en) | 2016-06-20 | 2017-12-28 | 日鉄住金マイクロメタル株式会社 | Bonding wire for semiconductor device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2073250A (en) * | 1980-04-09 | 1981-10-14 | Amax Inc | Copper alloys with small amounts of manganese and selenium |
GB2210061A (en) * | 1985-03-27 | 1989-06-01 | Mitsubishi Metal Corp | Copper wire for bonding a semiconductor device |
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1989
- 1989-05-18 KR KR1019890006633A patent/KR900019209A/en not_active IP Right Cessation
- 1989-05-18 GB GB8911485A patent/GB2220956B/en not_active Expired - Fee Related
- 1989-05-18 DE DE3916168A patent/DE3916168A1/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2073250A (en) * | 1980-04-09 | 1981-10-14 | Amax Inc | Copper alloys with small amounts of manganese and selenium |
GB2210061A (en) * | 1985-03-27 | 1989-06-01 | Mitsubishi Metal Corp | Copper wire for bonding a semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
KR900019209A (en) | 1990-12-24 |
GB8911485D0 (en) | 1989-07-05 |
DE3916168A1 (en) | 1989-11-30 |
GB2220956A (en) | 1990-01-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19980518 |