GB2220161A - Soldering iron stand with automatic bit cleaning - Google Patents

Abstract

A stand for electrically heated soldering irons incorporates a heat resistant pocket 2 containing solder and flux, in which the hot bit 1 of the iron rests between soldering operations. The bit is thus kept free of oxidising residues of solder and flux, removing the necessity for cleaning of the bit between each soldering operation. <IMAGE>

Description

SOLDERING IRON STAND WITIS AUTOMATIC BIT CLEANING.

This invention relates to soldering iron stands for electrically heated irons in which the stands have built-in means of maintaining the iron tips free of solder and flux degraded residues.

Good adhesion of solder require the use of flux, applied to the iron. The flux degrades and the solder oxidizes, requiring both residues to be cleaned from the iron by wiping. For fine precision work the cleaning must be repeated between each soldering operation. Many soldering stands have hot surfaces and allow solder spillage.

According to the present invention a soldering iron stand Fig 1 is provided in which the iron tip 1 rests in a ceramic pocket 2 which is of low thermal conductivity and good thermal shock resistance. The ceramic pocket contains solder 3 and flux 4 which surrounds the iron tip and prevents oxidation except at the surface of the solder. When the iron is withdrawn from the pocket it is ready for instant use without being cleaned. The solder and flux applied to the iron at each operation is sufficient to renew the solder and flux in the pocket.

Some oxidised residue forms and is withdrawn by the upper part of the iron tip, leaving the tip clean. However it is desirable to minimise the residue especially when the iron is left on for long periods between operations. This can be achieved by the following techniques alone or in combination: a. use a pocket whose internal diameter is close to that of the iron tip so that the oxidising surface is small.

b. use a larger diameter pocket and charge the pocket with solder whose melting point is higher than the solder being used. This creates a very thin layer of low temperature solder next to the iron, and the remainder is semi-molten and has a low oxidation rate.

c. use high temperature fluxes whose degradation rate is low and which protect the solder surface from oxidisation for longer periods.

Because the amount of solder in the pocket is small and the conductivity of the pocket low, it can be heated from ambient to liquid solder temperature in seconds and will remain liquid between operations.

The requirement for low thermal conductivity and good thermal shock resistance up to 400or can be met by a number of materials but cordierite and low expansion porcelain are preferred.

The pocket has a wide mouth 5 which eases entry of the tip, reduces spillage and splashes and, together with insulation 6 reduces the external temperature of the stand.

Claims (4)

1. A soldering iron stand for electrically heated soldering irons which is characterised by the incorporation of a low conductivity thermal shock resistant pocket containing solder and flux for the hot stowage between soldering operations of the soldering iron tip.

2. A pocket as in claim 1 in which the diameter of the pocket is a close but loose fit on the soldering iron tip.

3. A pocket as in claim 1 in which the solder in the pocket has a higher melting point than the solder being used for soldering.

4. A pocket as in claim 1 in which the solder in the pocket has a melting point between 2200C and 4000C.

4 A pocket as in claim 1 or claims 1 and 2 or claims 1 and 3 or claims 1 and 4 in which the mouth is extended in the shape of a funnel.