GB2161107A - Method and apparatus for cold runner transfer molding - Google Patents

Method and apparatus for cold runner transfer molding Download PDF

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Publication number
GB2161107A
GB2161107A GB08508320A GB8508320A GB2161107A GB 2161107 A GB2161107 A GB 2161107A GB 08508320 A GB08508320 A GB 08508320A GB 8508320 A GB8508320 A GB 8508320A GB 2161107 A GB2161107 A GB 2161107A
Authority
GB
United Kingdom
Prior art keywords
block
runner
cavities
mold
mold apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB08508320A
Other versions
GB2161107B (en
GB8508320D0 (en
Inventor
Ricardus Henricus Joh Fierkens
Ireneus Johannes Theodorus Pas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Semiconductor Materials Fico Tooling BV
Advanced Semiconductor Materials America Inc
Original Assignee
Advanced Semiconductor Materials Fico Tooling BV
Advanced Semiconductor Materials America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Materials Fico Tooling BV, Advanced Semiconductor Materials America Inc filed Critical Advanced Semiconductor Materials Fico Tooling BV
Publication of GB8508320D0 publication Critical patent/GB8508320D0/en
Publication of GB2161107A publication Critical patent/GB2161107A/en
Application granted granted Critical
Publication of GB2161107B publication Critical patent/GB2161107B/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/27Sprue channels ; Runner channels or runner nozzles
    • B29C45/2756Cold runner channels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/46Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/57Exerting after-pressure on the moulding material
    • B29C45/572Exerting after-pressure on the moulding material using movable mould wall or runner parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00Use of unspecified macromolecular compounds as moulding material
    • B29K2101/10Thermosetting resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Insulating (14) and optionally cooling means (16) are provided so that the mold runnerblock (10, 12) is kept sufficiently cool to prevent curing of the plastic molding compound therein. By the addition of a plunger (16A) near the gate of the mold, a quasi-continuous molding operation may be effected. Local preheating by element (18) of the molding material at the gate locale may be used to liquefy a feedstock which has travelled through the cold-runners in powdered form. <IMAGE>

Description

SPECIFICATION Method and apparatus for cold runner transfer molding Background of the Invention 1. Field of the Invention This invention relates generally to the transfer molding of multiple plastic objects, and, more particularly, to the transfer molding of multiple plastic-encapsulated semiconductor devices.
2. Description of the Prior Art In the transfer molding of a multiplicity of plastic devices in a multi-cavity metallic mold, the prior art practice was to provide a multicavity metallic mold comprising separable top and bottom mold portions including a plurality of cavities for the objects to be molded as well as a plurality of runners comprising a distribution system for feeding the molding compound to each of the individual cavities. The runners typically terminate in a common cull or gate area used to source the plastic molding compound to the plurality of cavities. The top and bottom mold halves are held together in a press, and the assembly is heated so that the molding material will cure.The plastic molding material, which is usually in powder form, is pressed or pelletized so that it may be pretreated in a portion of the mold assembly to put it in a liquid or semi-liquid form. A plunger is used to force the heated molding compound under very light pressure into the runner system of the mold for distribution to each of the plurality of object cavities in the multi-cavity mold.
Among the disadvantages of the type of transfer molding system described above are included the fact that molding compound must be pelletized to a size commensurate with the volume of the cavities and runners in the mold to be used. The resulting often rather large plug of plastic molding compound then may require a substantial time for preheating. Since the runners are in the mold halves along with the object cavities, the heated mold halves also set up or cure the plastic mold compound in the cavities as well as the object cavities. This may result in a substantial waste of plastic depending on the relative volumes in the runners and the object cavities Also, because the system does not admit of continuous molding compound feeding, production throughput is limited by the batch nature of the operation.Therefore a need has existed to provide a method and mold members which permit continuous molding compound feeding, preferably from a powder form, for the transfer molding of multiple small objects in a heated multi-cavity mold.
Summary of the Invention In accordance with one embodiment of this invention, it is a object of this invention to provide an improved method and apparatus for the transfer molding of small objects.
It is another object of this invention to provide an improved mold apparatus and method for the insert molding of semiconductor electronic devices and integrated circuits.
It is a further object of this invention to provide an improved method and mold apparatus to permit the substantially continuous feeding of plastic mold compound into a multi-cavity mold.
It is still another object of this invention to provide an improved method and mold apparatus to obviate the necessity of pelletizing the plastic molding compound.
In accordance with a preferred embodiment of the present invention, the runner portions of a multi-cavity mold are thermally insulated from the metallic mold cavities to permit feeding of a stream of molding compound directly to the gate portions of the mold, without curing the plastic in the runner portion of the mold.
According to another embodiment of this invention, cooling is provided for the runner portion of a molding system to prevent curing of the plastic molding compound in the runner system.
According to yet another embodiment of this invention, plastic molding compound is distributed via runners sufficiently cold to prevent curing of the material until it reaches the cull/gate portion of the molding system, where a plunger and local heating are provided to feed liquid molding compound under pressure to the mold cavities.
The foregoing and other objects, features, and advantages of this invention will be aparent from the following, more particular, description of the preferred embodiments of the invention, as illustrated in the accompany drawing.
Brief Description of the Figures Figure 1 is a cross-sectional view of the object cavities and cold-runner system of a stationary mold apparatus according to the present invention.
Figure 2 is a cross-sectional view of a coldrunner mold apparatus including a plunger for use in a system where mold portions are transferred in and out of a mold station in a semi-continuous process.
The Specification Referring now to Fig. 1, there is illustrated a top half 4 (and the bottom half 2) of a mold suitable for the formation of insert-molded semiconductor electronic pakages comprising lead frames 8 partially surrounded by plastic bodies 6. The mold separates along the partline between upper mold portion 4 and low mold portion 2 to permit extraction of the finished molded plastic objects. Both mold halves are formed from a thermally conductive metallic material, such as stainless steel. Over top mold portion 4 are additional metallic members 10 and 12 forming a portion of a runner 20 for supplying the plastic molding compound to the lead frame cavities of the mold. The vertical portion of the runner 20 is formed by a block 15 having a tapered orifice. The runner blocks 10 and 12 contain numerous runners 20 to feed a plurality of cavities in the cavity block.Each of the plurality of runners 20 is supplied from a central reservoir of plastic molding material.
Each runner 20 is insulated from the top and bottom mold portions 4 and 2 by thermally insulating material 14 to maintain the temperature of the runner at no more than about 80 C while the top and bottom mold portions are heated to about 1 70 C. An insert heating element 18 provides a hot tip for maintaining the temperature in the cull/gate area at about 1 85 C to facilitate the heating of the plastic mold compound in the portions of the stream just prior to the entry to the object cavities holding the insert lead frames 8. Passages 16 allow for the passage of coolant to keep the orifice block 15 at a sufficiently low temperature to prevent liquefication and/or curing of the stream of molding compound in the runner 20.The partline between the runner block portions 10 and 12 allows them to be separated to clean out the runner if required. Either pressure or vacuum may be applied at the extremities (not shown) of the horizontal portion of the channel 20 so that the plastic molding compound may be supplied to the mold cavities at the onset of the molding cycle and the excess withdrawn after the cavities have been filled with liquefied material.
Referring now to Fig. 2, there is illustrated in cross-section a portion of a mold apparatus similar to that shown by Fig. 1. Top and bottom mold halves 4 and 2 have multiple cavities for the formation of bodies 6 about metallic insets 8. Runner block portions 10 and 12 of the mold apparatus contain a runner 20 for the provision of a stream of plastic molding compound to the mold cavities. The mold appratus in Fig. 2 differs from that in Fig. 1 in that the runner block portion 10 is maintained at a cooler temperature than top mold 4 by the provision of both insulating material 14 and passages 1.6 for the flow of coolant. In this way the runner block may be maintained at about 80 C while the cavity block is maintained at about 1 70 C for a much longer period of time than the apparatus of Fig. 1.Thus a more nearly automatic or continuous molding process may be effected by removal of only the bottom portion 2 of the cavity block together with the molded objects after each transfer cycle is completed.
The runner block stays cool, and plunder 16A in its downward position prevents passage of plastic material through the orifice. After the lower cavity block portion 2 has been replaced, plunger 1 6A is raised and then lowered again to force the desired amount of plastic material into the caivty block, where it is heated and liquefied by the hot tip element 18, which is maintained at about 185"C. The plunger 16 comprising plastic ring/tip portions 17 seats in the oridice to maintain high pressure during the curing portion of the cycle.
With the apparatus shown by either of Figs.
1 or 2, the insulating and/or cooling means keep the temperature of the runner block sufficiently low that curing does not take place in the runner block. It is also possible to keep the temperature of the runner block sufficiently low that there is substantially no melting of the plastic material, in which case the feedstock may be unpelletized plastic molding compound.
While the invention has been particularly shown and described with respect to preferred embodiments thereof, it will be understood by those skilled in the art that the foregoing and other changes in form and details may be made therein without departure from the spirit and scope of the invention.

Claims (14)

1. A mold apparatus for transfer molding a plurality of small objects, comprising in combination: a cavity block comprising a plurality of object cavities; a runner block comprising a plurality of runner means for supplying plastic molding material to said cavities, and insulating means between said runner block and said cavity block for maintaining said runner block at a sufficiently low temperature to inhibit curing of said plastic molding material in said runner block.
2. The mold apparatus of Claim 1, further including cooling means for said runner block to inhibit curing of said plastic molding material in said runner block.
3. The mold apparatus of Claim 1, further including local heating means within said cavity block for heating said plastic molding material before it enters said cavities.
4. A mold apparatus for the transfer molding of a plurality of small objects, comprising, in combination; a cavity block; a plurality of cavities in said cavity block; gate means for each of said cavities for admitting plastic molding material to said cavity; a runner block insulated from said cavity block; a plurality of runners in said runner block; and plunger means for admitting plastic molding material from said each of said plurality of runners into said plurality of mold cavities and for maintaining said plastic material under high pressure in said cavities.
5. The mold apparatus of Claim 4, further comprising cooling means for maintaining the temperature of said runner block at a substantially lower value than said cavity block.
6. The mold apparatus of Claim 4, further including localized heating means proximate said gate means for heating said plastic molding material prior to its passage into said mold cavities.
7. The mold apparatus according to Claim 4, wherein said plunger rings comprise plastic tip sealing means.
8. The mold apparatus according to Claim 5, wherein said insulating means and said cooling means substantially prevent curing of said plastic molding material in said runner means.
9. The mold apparatus of Claim 5, where said insulating means and said cooling means substantially prevent liquefication of said plastic molding material in said runner means.
10. The mold apparatus according to Claim 4, where said cavity block and said runner block comprise separate and detachable members.
11. A method for transfer molding a plurality of small objects in multiple cavities in a heated cavity block comprising supplying plastic molding material to said cavities through a plurality of runners in a runner block while maintaining the temperature of said runner block substantially below that of said cavity block.
12. A mold apparatus for the transfer molding of a plurality of small objects substantially as hereinbefore described with reference to and as illustrated in the accompanying drawings.
13. The method for transfer molding a plurality of small objects substantially as hereinbefore described with reference to and as illustrated in the accompanying drawings.
14. Objects manufactured on apparatus or in accordance with the method as claimed in any one of the preceding claims.
GB08508320A 1984-07-06 1985-03-29 Method and apparatus for cold runner transfer molding Expired GB2161107B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62862184A 1984-07-06 1984-07-06

Publications (3)

Publication Number Publication Date
GB8508320D0 GB8508320D0 (en) 1985-05-09
GB2161107A true GB2161107A (en) 1986-01-08
GB2161107B GB2161107B (en) 1988-03-02

Family

ID=24519651

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08508320A Expired GB2161107B (en) 1984-07-06 1985-03-29 Method and apparatus for cold runner transfer molding

Country Status (5)

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JP (1) JPS6120718A (en)
DE (1) DE3524161A1 (en)
FR (1) FR2567064A1 (en)
GB (1) GB2161107B (en)
NL (1) NL8501268A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2198386A (en) * 1986-09-29 1988-06-15 Alan Harper Injecting resin
WO2007025331A1 (en) * 2005-08-29 2007-03-08 Romar Engineering Pty Ltd Injection device for a cold runner block

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3811814C2 (en) * 1988-04-08 1994-08-25 Siemens Ag Injection molding device for quartz-filled plastic material
JPH0350413U (en) * 1989-09-21 1991-05-16
JP2511759Y2 (en) * 1989-10-02 1996-09-25 三菱マテリアル株式会社 Injection mold
EP2266776A1 (en) * 2009-06-27 2010-12-29 Bayer MaterialScience AG Method and device for producing thick-walled plastic components, in particular optical components
WO2017170168A1 (en) * 2016-03-31 2017-10-05 テルモ株式会社 Injection molding apparatus

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US3591897A (en) * 1968-11-01 1971-07-13 Osley & Whitney Inc Runnerless mold for automated injection-molding of thermoset materials
GB1397908A (en) * 1972-08-29 1975-06-18 Uniroyal Ag Transfer moulding apparatus
GB1411837A (en) * 1972-12-18 1975-10-29 Gen Tire & Rubber Co Transfer moulding
US4089926A (en) * 1976-09-20 1978-05-16 Taylor Don A Injection molding method and apparatus
EP0013154A1 (en) * 1978-12-21 1980-07-09 Occidental Chemical Corporation Method of and apparatus for runnerless injection-compression molding thermosetting materials
GB2083402A (en) * 1980-09-11 1982-03-24 Daniels Engineering Ltd Moulding machines

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FR1546977A (en) * 1967-01-26 1968-11-22 Eckert & Ziegler Gmbh Mold for molding machines
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EP0010887A1 (en) * 1978-10-16 1980-05-14 Hooker Chemicals & Plastics Corp. Method of plunger molding and plunger molding apparatus having temperature controlled runner and sprue portions
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Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3591897A (en) * 1968-11-01 1971-07-13 Osley & Whitney Inc Runnerless mold for automated injection-molding of thermoset materials
GB1397908A (en) * 1972-08-29 1975-06-18 Uniroyal Ag Transfer moulding apparatus
GB1411837A (en) * 1972-12-18 1975-10-29 Gen Tire & Rubber Co Transfer moulding
US4089926A (en) * 1976-09-20 1978-05-16 Taylor Don A Injection molding method and apparatus
EP0013154A1 (en) * 1978-12-21 1980-07-09 Occidental Chemical Corporation Method of and apparatus for runnerless injection-compression molding thermosetting materials
GB2083402A (en) * 1980-09-11 1982-03-24 Daniels Engineering Ltd Moulding machines

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2198386A (en) * 1986-09-29 1988-06-15 Alan Harper Injecting resin
WO2007025331A1 (en) * 2005-08-29 2007-03-08 Romar Engineering Pty Ltd Injection device for a cold runner block

Also Published As

Publication number Publication date
FR2567064A1 (en) 1986-01-10
NL8501268A (en) 1986-02-03
GB2161107B (en) 1988-03-02
DE3524161A1 (en) 1986-01-23
JPS6315892B2 (en) 1988-04-06
GB8508320D0 (en) 1985-05-09
JPS6120718A (en) 1986-01-29

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PCNP Patent ceased through non-payment of renewal fee

Effective date: 19960329