GB2137425A - Shape retaining flexible electric circuit board and method of manufacture thereof - Google Patents
Shape retaining flexible electric circuit board and method of manufacture thereof Download PDFInfo
- Publication number
- GB2137425A GB2137425A GB08408263A GB8408263A GB2137425A GB 2137425 A GB2137425 A GB 2137425A GB 08408263 A GB08408263 A GB 08408263A GB 8408263 A GB8408263 A GB 8408263A GB 2137425 A GB2137425 A GB 2137425A
- Authority
- GB
- United Kingdom
- Prior art keywords
- printed circuit
- circuit board
- electrically conductive
- substrate
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title description 10
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 10
- 239000003365 glass fiber Substances 0.000 claims description 7
- 229920000728 polyester Polymers 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 238000009738 saturating Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000004080 punching Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 5
- 230000014759 maintenance of location Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 239000003351 stiffener Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/057—Shape retainable
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
A printed circuit board composed of a polymer-impregnated nonwoven web substrate (12) laminated to electrically conductive sheets (14) can be manufactured in a process similar to that used for rigid or hard-board printed circuit boards. The printed circuit boards are flexible in the sense that they can be bent to any desired multiplanar shape and will retain that shape after installation. <IMAGE>
Description
SPECIFICATION
Shape retaining flexible electric circuit and method of manufacture thereof
This invention relates to the field of flexible printed circuit boards. More particularly, this invention relates to flexible printed circuit boards having a fiber reinforced substrate which can be conventionally manufactured or processed like rigid printed circuit board or hardboard but thereafter is bendable to retain any desired multiplanar shape.
The process for manufacturing rigid printed circuit board or hardboard is well known in the art. The hardboard is produced in a panel form with the particular circuitry being etched, plated, screened or stamped thereon. Rigid printed circuit board of this type must necessarily only be used for single-plane hardboard applications since any bending would result in cracking and/or breaking.
In order to connect single-plane hardboardsto other hardboards within the electronic device, expensive multiboard interconnections must be utilized. These interconnectors add both to the parts costs and labor costs as well as increasing the complexity of a given installation.
Conventional flexible printed circuits (e.g. plastic substrates with circuit patterns thereon) do not solve the above problems associated with hardboard use.
Flexible printed circuits which are used effectively as wiring harnesses or in other applications are not suitable for fixed, multiplanar application. This is due, to the fact that such flexible printed circuits do not assume and retain permanent shaped or molded configurations. Also because although a flexible printed circuit board may take on a multiplanar shape, its lack of plasticity and the inherent "memory" property of its flexible plastic components may cause the flexible circuit board to revert to its original configuration. This movement can interfere with other internal parts of the electronic device.
Further, when flexible printed circuits are connected to electronic systems, expensive connectors are needed which are especially adapted for flexible circuit board interconnections. Finally, unlike hardboard devices, when used as a fixed wiring part, flexible circuits require the use of extra stiffeners in order to support the mounting of heavy components.
In accordance with the present invention, there is provided a printed circuit material comprising a substrate material made of a nonwoven web impregnated with a polymer, at least one sheet of electrically conductive material laminated to at least one side of said substrate, said electrically conductive sheet having a thickness of between 0,015 mm to 0,07 mm and said laminate of nonwoven substrate material and electrically conductive material being capable of being formed into permanent multiplanar shape.
The printed circuit board is produced in sheet form and can be etched and/or stamped out to any desired shape using conventional hardboard processing techniques. Thereafter, the unique properties of the present embodiment allow the printed circuit board to be formed into a predetermined three dimensional shape and thereafter mounted into electonic equipment. The formed printed circuit board will neither bend nor crack and has sufficient stiffness to retain its shape after installation.
The manufacturing process of the present embodi- ment includes forming a nonwoven web substrate of polyester and glass fibers, impregnating and saturating the web with an epoxy solution, and thereafter drying the web to drive off any solvent. The dry, tacky web is then laminated on one or both sides with sheets of copper to form a sheet of printed circuit board material. As in hardboard material, the sheet can be etched, punched, drilled or blanked out to form any desired circuits and configurations and finally, the stamped configurations can be formed or bent for multiplanar configurations.
Accordingly, there is provided a novel and improved flexible printed circuit and material which will have sufficient rigidity so that it can be manufactured by conventional hardboard processes, and which is flexible enough to be easily formed or bent into multiplanar shapes which will be retained.
The improved flexible printed circuit element has sufficient plasticity to allow retention of its formed shape.
There is also provided a flexible printed circuit board wherein the mounting of heavy components is possible without the use of extra stiffeners.
Other objects and advantages of the present invention will be apparent to and understood by those skilled in the art from the following detailed description and drawings of a preferred embodiment.
Referring now to the drawings, wherein like elements are numbered alike in the several Figures.
Figure 1 is a partial exploded perspective view of a flexible printed circuit board in accordance with the present embodiment;
Figure 2 is a side elevation view of the flexible printed circuit board of Figure 1;
Figure 3 is a top plan view of the flexible printed circuit board of Figure 1;
Figure 4 is a side view of the flexible printed circuit board of Figure 1 bent into a " S " shape;
Figure 5 is a perspective view of the flexible printed circuit board of Figure 4; Figure 6 is a flow diagram representing the manufacturing steps employed in the practice of the present embodiment;
Figure 7 is a top plan view of the printed circuit board of Figure 1 etched to desired circuit shapes on a production sheet;
Figure 8 is a top plan view of the printed circuit boards of Figure 7 punched from the production sheet; and
Figure 9 is a perspective view of the printed circuit boards of Figure 8 shaped to a multiplanar configuration.
Referring first to Figures 1 and 2, the flexible printed circuit board 10 of the present embodiment is shown. The printed circuit board 10 includes a fiber reinforced substrate 12 laminated between electrically conductive sheets 14. In this preferred embodiment, the substrate 12 is made of a non woven blend of polyester and glass fibers forming a web. This nonwoven web is thereafter saturated with a polymer such as epoxy resin thus forming a polymer impregnated nonwoven web. The substrate thickness may generally be in the range of 0,25 mm to 1,60 mm but preferably is 0,38 mm to 0,76 mm.
The substrate is preferably laminated between sheets of copper ranging in thickness from 0,015 mm to 0,76 mm, preferably 0,035 mm thickness (28,35 g copper). Although 28,35 g copper (0,035 mm) may be preferred, 56,7 g copper (0,070 mm) and 14g copper (0,018 mm) may be utilized for some applications. The construction could also be one sheet of copper 14 laminated to one side of substrate 12.
Although the materials in the above described laminates are not new in the art, in the sense that composites of nonwoven substrate laminated to one or two sheets of copper are known, the particular dimensioning detailed above is new and is critical to the present embodiment and constitutes the flexible printed circuit board of the present embodiment as a new product having new and novel features for certain desired and needed applications.
Laminates of nonwoven substrate ranging in thickness from 0,10 mm to 0,25 mm bonded to 28,35 g or 56,7 g copper have been used for conventional flexible prined circuit boards. However, in accordance with the present embodiment the unique combination of the polymer impregnated web and copper together with the dimensioning and composition as described above, provides a printed circuit board which can be bent and formed into permanent multiplanar shape without cracking or creasing of the substrate or of the copper. The multiplanar bent circuit board will then retain its bent or formed shape when the forming forces are removed therefrom. The bends should be curved (forming distinct radii) since sharp creases may break the copper and/or craze the substrate.When thicker 56,7 g ( 0,07 mm) copper is used, the bends should have a larger radius to guard against damage to both the substrate and the copper. The radius should be about 6,35 mm for a laminate of 0,38 mm substrate and 28,35 g copper, and should increase for thicker laminates. The bending or forming can be done at room temperature although there may be some advantages in precise shape retention in forming at elevated temperatures.
Referring now to Figures 4 and 5, a flexible printed circuit board 10 of the present embodiment is shown after it has been bent into an "S" shape and is ready to be mounted into electronic equipment. Thus, what would have taken a multiplicity of parts with the use of conventional hardboard devices and corresponding interconnectors, requires only one part with the utilization of the present embodiment.
Note that although only a one piece conventional flexible circuit board could have been substituted for the "S" shaped configuration shown in Figures 4 and 5, the enumerated problems discussed earlier would nonetheless be present.
The process for manufacture along with an illustrated example of a practical, relatively complicated application of the flexible circuit board of the present embodiment is shown in Figures 6 through 9.
Referring to Figure 6, the flow diagram representing the manufacturing steps is shown. As already discussed, the substrate 12 of a nonwoven blend of polyester and glass fibers is formed in a conventional manner in step A. Thereafter this web is saturated with a polymer (usually an epoxy resin) in step B followed by a drying step C whereby any excess solvent from the saturation step is removed. The substrate 12 is then laminated to conductive sheets (usually copper) in step D forming flat sheets of circuit board 20. Referring now both to step E and to
Figure 7, the circuit board sheets 20 are then etched in the usual manner to form any desired shape and electrical circuit configuration 22. These shapes 22 are then punched, drilled or blanked out as shown in
Figure 8 in step F to form a geometrically shaped flat planar printed circuit board element 24.
Steps A through Fin Figure 6 comprise the well known, inexpensive and conventional manufacturing process for producing rigid or hardboard printed circuit boards. The further processing of the present method and the novel and improved element of the present embodiment is shown in Figure 9 and step G wherein the punched printed circuit boards of Figure 8 are bent or formed into multiplanar or other shapes. These shaped circuit boards are then easily placed into the desired equipment without the use of expensive multiboard interconnections or fear of non-retention of the installation shape. The present embodiment is especially well suited for those applications involving automatic insertion of components.
The forming or bending may be at room temperature or at elevated temperature, and it may be done manually or by machine. Once the circuit element is formed, it retains its shape, which is of crucial importance in the present embodiment. It has been determined that the shape retention is the result of the interaction and relationship between the thickness of copper 14 and substrate 12, and the combined characteristics of these laminated materials.
Thus, the printed circuit board of the present embodiment is a formable or bendable circuit element which essentially combines some of the advantages of both rigid and flexible printed circuit board materials including:
(1) the ability to process in sheet form, which is useful to hardboard manufacturers who conventionally process in this manner;
(2) heavy components may be mounted on the relatively rigid structurewithoutthe use of extra stiffeners as are required with conventional flexible printed circuit boards;
(3) the present embodiment can be terminated and connected into the rest of an electronic system using conventional printed circuit board connectors, and does not require the expensive connectors associated with flexible boards; ;
(4) like flexible printed circuit boards, the ability to conform to the shape of the space available and to bend circuitry around corners; and
(5) like hardboard,the ability to retain its shape after installation.
Claims (23)
1. A printed circuit material comprising a substrate material made of a nonwoven web impregnated with a polymer, at least one sheet of electrically conductive material laminated to at least one side of said substrate, said electrically conductive sheet having a thickness of between 0,015 mm to 0,07 mm and said laminate of nonwoven substrate material and electrically conductive material being capable of being formed into permanent multiplanar shape.
2. A printed circuit material as claimed in claim 1, wherein said substrate has a thickness of between 0,25 mm and 1,6 mm and said nonwoven web is made of a combination of polyester fibers and glass fibers.
3. A printed circuit material as claimed in claims 1 or 2, wherein said polymer is an epoxy resin.
4. A printed circuit material as claimed in claim 2 wherein said substrate has a thickness of between 0,38 mm to 0,76 mm.
5. A printed circuit material as claimed in claim 1 wherein said sheet of electrically conductive material has a thickness of 0,035 mm.
6. A printed circuit material as claimed in any one of claims 1 to 5 wherein said sheet of electrically conductive material is copper.
7. A printed circuit material as claimed in any one of claims 1 to 5, including two sheets of electrically conductive material laminated to opposite sides of said substrate.
8. A printed circuit material as claimed in any one of claims 1 to 7 wherein said nonwoven web is made of a combination of polyesterfibers and glass fibers.
9. A method of forming a semi-rigid flexible printed circuit board, including the steps of forming a sheet of nonwoven web substrate material, saturating and thereby impregnating said nonwoven web with a polymeric solution, drying off any extra solvent left by said polymeric solution from said nonwoven web, laminating one or both sides of said nonwoeven web with electrically conductive sheets, etching said electrically conductive laminated sheets to form a plurality of geometric patterns, punching said etched laminated sheet into desired shapes, and bending said punched and said etched laminated sheets into multiplanar configurations.
10. A method of forming a printed circuit board as claimed in claim 9 wherein said nonwoven web is made of a combination of polyester and glass fibers.
11. A method of forming a printed circuit board as claimed in claims 9 or 10 wherein said polymer is an epoxy resin.
12. A method of forming a printed circuit board as claimed in claim 9 wherein said substrate has a thickness of between 0,38 mm to 0,76 mm.
13. A method of forming a printed circuit board as in claim 9 wherein said sheet of electrically conductive material has a thickness of 0,035 mm.
14. A method of forming a printed circuit board as claimed in any one of claims 9 to 13 wherein said sheet of electrically conductive material is copper.
15. A printed circuit board comprising a subs65 trate material made of a nonwoven web impregnated with a polymer, at least one circuit pattern of electrically conductive material laminated to at least one side of said substrate, said laminate of substrate material and electrically conductive material being formed in a shape retaining multiplanar configuration.
16. A printed circuit board as claimed in claim 15 wherein said nonwoven web is made of a combination of polyester and glass fibers.
17. A printed circuit board as claimed in claim 15 wherein said polymer is an epoxy resin.
18. A printed circuit board as claimed in claim 15 wherein said substrate has a thickness of between 0,38 mm to 0,76 mm.
19. A printed circuit board as claimed in claim 15 wherein said sheet of electrically conductive material has a thickness of 0,035 mm.
20. A printed circuit board as claimed in any one of claims 15 to 19 wherein said sheet of electrically conductive material is copper.
21. A printed circuit material substantially as hereinbefore described with reference to and as illustrated in the accompanying drawings.
22. A method of forming a printed circuit board substantially as hereinbefore described with reference to and as illustrated in the accompanying drawings.
23. A printed circuit board substantially as hereinbefore described with reference to and as illustrated in the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US48091483A | 1983-03-31 | 1983-03-31 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8408263D0 GB8408263D0 (en) | 1984-05-10 |
| GB2137425A true GB2137425A (en) | 1984-10-03 |
| GB2137425B GB2137425B (en) | 1987-06-17 |
Family
ID=23909869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08408263A Expired GB2137425B (en) | 1983-03-31 | 1984-03-30 | Shape retaining flexible electric circuit board and method of manufacture thereof |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS59184587A (en) |
| CA (1) | CA1212180A (en) |
| DE (1) | DE3411973A1 (en) |
| FR (1) | FR2543780B1 (en) |
| GB (1) | GB2137425B (en) |
| IT (1) | IT1196065B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4913955A (en) * | 1987-06-05 | 1990-04-03 | Shin-Kobe Electric Machinery Co., Ltd. | Epoxy resin laminate |
| EP0652692A1 (en) * | 1993-11-06 | 1995-05-10 | Philips Patentverwaltung GmbH | Printed circuit board |
| EP1768471A1 (en) * | 2004-06-23 | 2007-03-28 | Hitachi Chemical Co., Ltd. | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
| WO2012024578A3 (en) * | 2010-08-19 | 2012-04-12 | Apple Inc. | Portable electronic device |
| US8391010B2 (en) | 2010-08-19 | 2013-03-05 | Apple Inc. | Internal frame optimized for stiffness and heat transfer |
| US8477492B2 (en) | 2010-08-19 | 2013-07-02 | Apple Inc. | Formed PCB |
| US8515113B2 (en) | 2010-08-19 | 2013-08-20 | Apple Inc. | Composite microphone boot to optimize sealing and mechanical properties |
| US8634204B2 (en) | 2010-08-19 | 2014-01-21 | Apple Inc. | Compact folded configuration for integrated circuit packaging |
| WO2022128775A1 (en) * | 2020-12-14 | 2022-06-23 | Koninklijke Philips N.V. | Method and systems for cold forming features on flex circuits |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3641342A1 (en) * | 1986-12-03 | 1988-06-09 | Huels Troisdorf | LAYER COMPRESSION MADE OF FIBER REINFORCED, CROSSLINKED POLYPROPYLENE |
| US4974121A (en) * | 1987-05-29 | 1990-11-27 | Fuji Xerox Co., Ltd. | Wiring module |
| DE4423893C2 (en) * | 1994-07-07 | 1996-09-05 | Freudenberg Carl Fa | Flat gasket with flexible circuit board |
| DE19650154C2 (en) * | 1996-12-04 | 1999-06-10 | Lemfoerder Metallwaren Ag | Switching device for a transmission of a motor vehicle with a printed circuit board equipped with sensors, light-emitting diodes, processes and other electronic components and method for producing a curved printed circuit board for use in such a switching device |
| US8427379B2 (en) | 2010-08-19 | 2013-04-23 | Apple Inc. | Modular material antenna assembly |
| US9602914B2 (en) | 2010-08-27 | 2017-03-21 | Apple Inc. | Porting audio using a connector in a small form factor electronic device |
| US9287627B2 (en) | 2011-08-31 | 2016-03-15 | Apple Inc. | Customizable antenna feed structure |
| US9406999B2 (en) | 2011-09-23 | 2016-08-02 | Apple Inc. | Methods for manufacturing customized antenna structures |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1191909A (en) * | 1967-10-16 | 1970-05-13 | Westinghouse Electric Corp | Flexible Flame-Retardant Foil-Clad Laminates and Method of Manufacture |
| GB1200387A (en) * | 1967-11-06 | 1970-07-29 | Cincinnati Milling Machine Co | Copper clad plastic panel |
| GB1475031A (en) * | 1975-01-18 | 1977-06-01 | Marconi Co Ltd | Curved rigid printed circuit boards |
| GB1486372A (en) * | 1974-01-07 | 1977-09-21 | Minnesota Mining & Mfg | Metal-clad dielectric sheeting |
| GB2061989A (en) * | 1979-10-26 | 1981-05-20 | Castall Inc | Insulating boards for printed circuits |
| GB2109166A (en) * | 1981-11-06 | 1983-05-25 | Tba Industrial Products Ltd | Printed circuit boards |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1665852A1 (en) * | 1967-01-20 | 1971-01-28 | Siemens Ag | Process for the production of curved electrical circuit boards |
| DE2003982A1 (en) * | 1969-02-03 | 1970-08-06 | Cincinnati Milling Machine Co | Copper-clad plastic sheet and method for producing the same |
| JPS5227189B1 (en) * | 1970-07-08 | 1977-07-19 | ||
| JPS52149361A (en) * | 1976-06-08 | 1977-12-12 | Casio Computer Co Ltd | Method of producing flexible printed circuit board |
| US4103102A (en) * | 1976-07-01 | 1978-07-25 | Bell Telephone Laboratories, Incorporated | Reinforced flexible printed wiring board |
| JPS5599789A (en) * | 1979-01-26 | 1980-07-30 | Matsushita Electric Works Ltd | Material for printed circuit and method of fabricating same |
| JPS5649473A (en) * | 1979-09-28 | 1981-05-06 | Iwai Kikai Kogyo Kk | Double sealed valve |
-
1984
- 1984-03-22 FR FR848404441A patent/FR2543780B1/en not_active Expired - Fee Related
- 1984-03-28 CA CA000450650A patent/CA1212180A/en not_active Expired
- 1984-03-29 IT IT20307/84A patent/IT1196065B/en active
- 1984-03-30 DE DE19843411973 patent/DE3411973A1/en not_active Ceased
- 1984-03-30 GB GB08408263A patent/GB2137425B/en not_active Expired
- 1984-03-31 JP JP59065065A patent/JPS59184587A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1191909A (en) * | 1967-10-16 | 1970-05-13 | Westinghouse Electric Corp | Flexible Flame-Retardant Foil-Clad Laminates and Method of Manufacture |
| GB1200387A (en) * | 1967-11-06 | 1970-07-29 | Cincinnati Milling Machine Co | Copper clad plastic panel |
| GB1486372A (en) * | 1974-01-07 | 1977-09-21 | Minnesota Mining & Mfg | Metal-clad dielectric sheeting |
| GB1475031A (en) * | 1975-01-18 | 1977-06-01 | Marconi Co Ltd | Curved rigid printed circuit boards |
| GB2061989A (en) * | 1979-10-26 | 1981-05-20 | Castall Inc | Insulating boards for printed circuits |
| GB2109166A (en) * | 1981-11-06 | 1983-05-25 | Tba Industrial Products Ltd | Printed circuit boards |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4913955A (en) * | 1987-06-05 | 1990-04-03 | Shin-Kobe Electric Machinery Co., Ltd. | Epoxy resin laminate |
| EP0652692A1 (en) * | 1993-11-06 | 1995-05-10 | Philips Patentverwaltung GmbH | Printed circuit board |
| EP1768471A1 (en) * | 2004-06-23 | 2007-03-28 | Hitachi Chemical Co., Ltd. | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
| EP1768471A4 (en) * | 2004-06-23 | 2007-08-08 | Hitachi Chemical Co Ltd | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
| US7947332B2 (en) | 2004-06-23 | 2011-05-24 | Hitachi Chemical Company, Ltd. | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
| WO2012024578A3 (en) * | 2010-08-19 | 2012-04-12 | Apple Inc. | Portable electronic device |
| US8391010B2 (en) | 2010-08-19 | 2013-03-05 | Apple Inc. | Internal frame optimized for stiffness and heat transfer |
| US8477492B2 (en) | 2010-08-19 | 2013-07-02 | Apple Inc. | Formed PCB |
| US8515113B2 (en) | 2010-08-19 | 2013-08-20 | Apple Inc. | Composite microphone boot to optimize sealing and mechanical properties |
| US8634204B2 (en) | 2010-08-19 | 2014-01-21 | Apple Inc. | Compact folded configuration for integrated circuit packaging |
| WO2022128775A1 (en) * | 2020-12-14 | 2022-06-23 | Koninklijke Philips N.V. | Method and systems for cold forming features on flex circuits |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2543780B1 (en) | 1990-02-23 |
| JPS59184587A (en) | 1984-10-19 |
| DE3411973A1 (en) | 1984-10-11 |
| IT8420307A0 (en) | 1984-03-29 |
| CA1212180A (en) | 1986-09-30 |
| FR2543780A1 (en) | 1984-10-05 |
| IT1196065B (en) | 1988-11-10 |
| GB2137425B (en) | 1987-06-17 |
| GB8408263D0 (en) | 1984-05-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19970330 |