GB2085481B - Improved copper conductor inks - Google Patents

Improved copper conductor inks

Info

Publication number
GB2085481B
GB2085481B GB8131323A GB8131323A GB2085481B GB 2085481 B GB2085481 B GB 2085481B GB 8131323 A GB8131323 A GB 8131323A GB 8131323 A GB8131323 A GB 8131323A GB 2085481 B GB2085481 B GB 2085481B
Authority
GB
United Kingdom
Prior art keywords
copper conductor
improved copper
conductor inks
inks
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8131323A
Other versions
GB2085481A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/280,917 external-priority patent/US4376725A/en
Application filed by RCA Corp filed Critical RCA Corp
Priority to GB8131323A priority Critical patent/GB2085481B/en
Publication of GB2085481A publication Critical patent/GB2085481A/en
Application granted granted Critical
Publication of GB2085481B publication Critical patent/GB2085481B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0089—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with other, not previously mentioned inorganic compounds as the main non-metallic constituent, e.g. sulfides, glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
GB8131323A 1980-10-17 1981-10-16 Improved copper conductor inks Expired GB2085481B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8131323A GB2085481B (en) 1980-10-17 1981-10-16 Improved copper conductor inks

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB8033564 1980-10-17
US06/280,917 US4376725A (en) 1980-10-17 1981-07-06 Conductor inks
GB8131323A GB2085481B (en) 1980-10-17 1981-10-16 Improved copper conductor inks

Publications (2)

Publication Number Publication Date
GB2085481A GB2085481A (en) 1982-04-28
GB2085481B true GB2085481B (en) 1985-01-09

Family

ID=27261035

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8131323A Expired GB2085481B (en) 1980-10-17 1981-10-16 Improved copper conductor inks

Country Status (1)

Country Link
GB (1) GB2085481B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3135035A1 (en) * 1981-09-04 1983-03-24 Degussa Ag, 6000 Frankfurt MATERIAL FOR ELECTRICAL CONTACTS AND METHOD FOR THE PRODUCTION THEREOF
US4623482A (en) * 1985-10-25 1986-11-18 Cts Corporation Copper conductive paint for porcelainized metal substrates
US4808770A (en) * 1986-10-02 1989-02-28 General Electric Company Thick-film copper conductor inks

Also Published As

Publication number Publication date
GB2085481A (en) 1982-04-28

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19931016