GB2067354B - Mounting for a sc device - Google Patents
Mounting for a sc deviceInfo
- Publication number
- GB2067354B GB2067354B GB8100012A GB8100012A GB2067354B GB 2067354 B GB2067354 B GB 2067354B GB 8100012 A GB8100012 A GB 8100012A GB 8100012 A GB8100012 A GB 8100012A GB 2067354 B GB2067354 B GB 2067354B
- Authority
- GB
- United Kingdom
- Prior art keywords
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4822—Beam leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/864—Transit-time diodes, e.g. IMPATT, TRAPATT diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8100012A GB2067354B (en) | 1980-01-09 | 1981-01-02 | Mounting for a sc device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8000678 | 1980-01-09 | ||
GB8100012A GB2067354B (en) | 1980-01-09 | 1981-01-02 | Mounting for a sc device |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2067354A GB2067354A (en) | 1981-07-22 |
GB2067354B true GB2067354B (en) | 1984-04-18 |
Family
ID=26274079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8100012A Expired GB2067354B (en) | 1980-01-09 | 1981-01-02 | Mounting for a sc device |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2067354B (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2517884A1 (en) * | 1981-12-09 | 1983-06-10 | Thomson Csf | SEMICONDUCTOR DEVICE WITH LOW PARASITE CAPACITY PROVIDED WITH EXTERNAL CONNECTIONS TAKEN BY MEANS OF BEAMS AND METHOD OF MANUFACTURING SUCH A DEVICE |
FR2517883A1 (en) * | 1981-12-09 | 1983-06-10 | Thomson Csf | SEMICONDUCTOR DEVICE WITH LOW PARASITE CAPACITY PROVIDED WITH EXTERNAL CONNECTIONS TAKEN WITH BEAMS |
FR2520931B1 (en) * | 1982-02-02 | 1986-12-12 | Thomson Csf | COLLECTIVE PROCESS FOR MANUFACTURING MICROWAVE DIODES WITH BUILT-IN ENCAPSULATION AND DIODES OBTAINED THEREBY |
FR2538616B1 (en) * | 1982-12-28 | 1986-01-24 | Thomson Csf | METHOD FOR THE COLLECTIVE MANUFACTURE OF MICROWAVE DIODES WITH INCORPORATED ENCAPSULATION AND DIODES THUS OBTAINED |
DE3675611D1 (en) * | 1985-08-31 | 1990-12-20 | Licentia Gmbh | METHOD FOR PRODUCING A SEMICONDUCTOR BODY CONTACTED ON TWO SIDES. |
DE3718684A1 (en) * | 1987-06-04 | 1988-12-22 | Licentia Gmbh | SEMICONDUCTOR BODY |
EP0316799B1 (en) * | 1987-11-13 | 1994-07-27 | Nissan Motor Co., Ltd. | Semiconductor device |
FR2628569B1 (en) * | 1988-03-08 | 1990-11-09 | Thomson Hybrides Microondes | INTEGRATED MICROWAVE CIRCUIT AND MANUFACTURING METHOD THEREOF |
US5280194A (en) * | 1988-11-21 | 1994-01-18 | Micro Technology Partners | Electrical apparatus with a metallic layer coupled to a lower region of a substrate and metallic layer coupled to a lower region of a semiconductor device |
DE4209983A1 (en) * | 1992-03-27 | 1993-09-30 | Daimler Benz Ag | Semiconductor component mfr. esp. IMPATT diode prodn. - producing component, housing and connection contacts in integrated construction from and on semiconductor substrate |
US5403729A (en) * | 1992-05-27 | 1995-04-04 | Micro Technology Partners | Fabricating a semiconductor with an insulative coating |
US5521420A (en) * | 1992-05-27 | 1996-05-28 | Micro Technology Partners | Fabricating a semiconductor with an insulative coating |
US5656547A (en) * | 1994-05-11 | 1997-08-12 | Chipscale, Inc. | Method for making a leadless surface mounted device with wrap-around flange interface contacts |
JPH10508430A (en) * | 1994-06-09 | 1998-08-18 | チップスケール・インコーポレーテッド | Manufacturing resistors |
-
1981
- 1981-01-02 GB GB8100012A patent/GB2067354B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2067354A (en) | 1981-07-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |