GB2030779B - Manufacture of flexible printed circuits - Google Patents

Manufacture of flexible printed circuits

Info

Publication number
GB2030779B
GB2030779B GB7838301A GB7838301A GB2030779B GB 2030779 B GB2030779 B GB 2030779B GB 7838301 A GB7838301 A GB 7838301A GB 7838301 A GB7838301 A GB 7838301A GB 2030779 B GB2030779 B GB 2030779B
Authority
GB
United Kingdom
Prior art keywords
manufacture
flexible printed
printed circuits
circuits
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7838301A
Other versions
GB2030779A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems Electronics Ltd
Original Assignee
Marconi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Co Ltd filed Critical Marconi Co Ltd
Priority to GB7838301A priority Critical patent/GB2030779B/en
Publication of GB2030779A publication Critical patent/GB2030779A/en
Application granted granted Critical
Publication of GB2030779B publication Critical patent/GB2030779B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
GB7838301A 1978-09-27 1978-09-27 Manufacture of flexible printed circuits Expired GB2030779B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB7838301A GB2030779B (en) 1978-09-27 1978-09-27 Manufacture of flexible printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7838301A GB2030779B (en) 1978-09-27 1978-09-27 Manufacture of flexible printed circuits

Publications (2)

Publication Number Publication Date
GB2030779A GB2030779A (en) 1980-04-10
GB2030779B true GB2030779B (en) 1982-10-13

Family

ID=10499937

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7838301A Expired GB2030779B (en) 1978-09-27 1978-09-27 Manufacture of flexible printed circuits

Country Status (1)

Country Link
GB (1) GB2030779B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5972152A (en) * 1997-05-16 1999-10-26 Micron Communications, Inc. Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
US6687969B1 (en) 1997-05-16 2004-02-10 Micron Technology, Inc. Methods of fixturing flexible substrates and methods of processing flexible substrates
DE19855715A1 (en) * 1998-12-03 2000-09-28 Leuze Electronic Gmbh & Co Arrangement for processing a circuit board
EP1198161B1 (en) * 2000-10-10 2006-06-21 Morton International, Inc. Method for securing and processing thin film materials
EP1333708A4 (en) * 2001-07-19 2008-08-13 Toray Industries Circuit board, circuit board-use member and production method therefor and method of laminating fexible film
JP3585904B2 (en) 2002-11-01 2004-11-10 株式会社 大昌電子 Jig for holding and transporting
GB0326537D0 (en) * 2003-11-14 2003-12-17 Koninkl Philips Electronics Nv Flexible devices
WO2008109412A1 (en) * 2007-03-02 2008-09-12 Raytheon Company Method for fabricating electrical circuitry on ultra-thin plastic films
TWI419091B (en) * 2009-02-10 2013-12-11 Ind Tech Res Inst Appratus for a transferrable flexible electronic device and method for fabricating a flexible electronic device
CN107889364A (en) * 2017-11-21 2018-04-06 江门市浩远电子科技有限公司 A kind of FPC processing fixing device

Also Published As

Publication number Publication date
GB2030779A (en) 1980-04-10

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee