GB202112862D0 - Electrical component - Google Patents

Electrical component

Info

Publication number
GB202112862D0
GB202112862D0 GBGB2112862.4A GB202112862A GB202112862D0 GB 202112862 D0 GB202112862 D0 GB 202112862D0 GB 202112862 A GB202112862 A GB 202112862A GB 202112862 D0 GB202112862 D0 GB 202112862D0
Authority
GB
United Kingdom
Prior art keywords
electrical component
electrical
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB2112862.4A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xaar Technology Ltd
Original Assignee
Xaar Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xaar Technology Ltd filed Critical Xaar Technology Ltd
Priority to GBGB2112862.4A priority Critical patent/GB202112862D0/en
Publication of GB202112862D0 publication Critical patent/GB202112862D0/en
Ceased legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261Processes for packaging MEMS devices
    • B81C1/00269Bonding of solid lids or wafers to the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261Processes for packaging MEMS devices
    • B81C1/00333Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00Assembling of devices or systems from individually processed components
    • B81C3/002Aligning microparts
    • B81C3/005Passive alignment, i.e. without a detection of the position of the elements or using only structural arrangements or thermodynamic forces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00Forming microstructural systems
    • B81C2203/01Packaging MEMS
    • B81C2203/0172Seals
    • B81C2203/019Seals characterised by the material or arrangement of seals between parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00Forming microstructural systems
    • B81C2203/05Aligning components to be assembled
    • B81C2203/052Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus
    • B81C2203/054Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus using structural alignment aids, e.g. spacers, interposers, male/female parts, rods or balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
GBGB2112862.4A 2021-09-09 2021-09-09 Electrical component Ceased GB202112862D0 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GBGB2112862.4A GB202112862D0 (en) 2021-09-09 2021-09-09 Electrical component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB2112862.4A GB202112862D0 (en) 2021-09-09 2021-09-09 Electrical component

Publications (1)

Publication Number Publication Date
GB202112862D0 true GB202112862D0 (en) 2021-10-27

Family

ID=78149275

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB2112862.4A Ceased GB202112862D0 (en) 2021-09-09 2021-09-09 Electrical component

Country Status (1)

Country Link
GB (1) GB202112862D0 (en)

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)