GB201808836D0 - Multiple i/o circuit board for immersion-cooled electronics - Google Patents

Multiple i/o circuit board for immersion-cooled electronics

Info

Publication number
GB201808836D0
GB201808836D0 GBGB1808836.9A GB201808836A GB201808836D0 GB 201808836 D0 GB201808836 D0 GB 201808836D0 GB 201808836 A GB201808836 A GB 201808836A GB 201808836 D0 GB201808836 D0 GB 201808836D0
Authority
GB
United Kingdom
Prior art keywords
immersion
circuit board
cooled electronics
electronics
cooled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB1808836.9A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iceotope Ltd
Original Assignee
Iceotope Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iceotope Ltd filed Critical Iceotope Ltd
Priority to GBGB1808836.9A priority Critical patent/GB201808836D0/en
Publication of GB201808836D0 publication Critical patent/GB201808836D0/en
Priority to TW108117244A priority patent/TW202004408A/en
Priority to PCT/GB2019/051443 priority patent/WO2019229421A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
GBGB1808836.9A 2018-05-30 2018-05-30 Multiple i/o circuit board for immersion-cooled electronics Ceased GB201808836D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GBGB1808836.9A GB201808836D0 (en) 2018-05-30 2018-05-30 Multiple i/o circuit board for immersion-cooled electronics
TW108117244A TW202004408A (en) 2018-05-30 2019-05-20 Multiple I/O circuit board for immersion-cooled electronics
PCT/GB2019/051443 WO2019229421A1 (en) 2018-05-30 2019-05-24 Multiple i/o circuit board for immersion-cooled electronics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1808836.9A GB201808836D0 (en) 2018-05-30 2018-05-30 Multiple i/o circuit board for immersion-cooled electronics

Publications (1)

Publication Number Publication Date
GB201808836D0 true GB201808836D0 (en) 2018-07-11

Family

ID=62812350

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB1808836.9A Ceased GB201808836D0 (en) 2018-05-30 2018-05-30 Multiple i/o circuit board for immersion-cooled electronics

Country Status (3)

Country Link
GB (1) GB201808836D0 (en)
TW (1) TW202004408A (en)
WO (1) WO2019229421A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN217319340U (en) * 2022-03-10 2022-08-30 上海轮廓科技有限公司 A storage box and 3D printer for 3D printer

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5305184A (en) * 1992-12-16 1994-04-19 Ibm Corporation Method and apparatus for immersion cooling or an electronic board
US7961475B2 (en) * 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
WO2010130993A2 (en) 2009-05-12 2010-11-18 Iceotope Limited Cooled electronic system
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
GB2518869B (en) * 2013-10-03 2016-12-28 Valeo Powertrain Energy Conv As Electronic enclosure device

Also Published As

Publication number Publication date
TW202004408A (en) 2020-01-16
WO2019229421A1 (en) 2019-12-05

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)