GB201109476D0 - Epoxy resin and copper composition - Google Patents
Epoxy resin and copper compositionInfo
- Publication number
- GB201109476D0 GB201109476D0 GBGB1109476.0A GB201109476A GB201109476D0 GB 201109476 D0 GB201109476 D0 GB 201109476D0 GB 201109476 A GB201109476 A GB 201109476A GB 201109476 D0 GB201109476 D0 GB 201109476D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- composition
- epoxy resin
- copper
- copper composition
- applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/14—Paints containing biocides, e.g. fungicides, insecticides or pesticides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Plant Pathology (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Floor Finish (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
A composition comprises an epoxy resin and copper. Typically, the epoxy resin is a two-part epoxy resin. The copper may have a particle size of 90 microns and may be present in the composition in an amount greater than the epoxy resin, such as 80%. A method of laying a coating is also claimed which comprises applying the composition to a surface and allowing it to harden. A further step of applying copper dust to the applied composition prior to hardening is also disclosed. The method may also comprise grinding off a top layer of the hardened composition so as to expose a surface having a higher concentration of copper. The composition may be applied as a floor or wall and finds particular utility in providing antimicrobial action in hospitals, e.g. against MRSA.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1109476.0A GB2491596A (en) | 2011-06-07 | 2011-06-07 | Composition containing epoxy resin and copper |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1109476.0A GB2491596A (en) | 2011-06-07 | 2011-06-07 | Composition containing epoxy resin and copper |
Publications (2)
Publication Number | Publication Date |
---|---|
GB201109476D0 true GB201109476D0 (en) | 2011-07-20 |
GB2491596A GB2491596A (en) | 2012-12-12 |
Family
ID=44343488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1109476.0A Withdrawn GB2491596A (en) | 2011-06-07 | 2011-06-07 | Composition containing epoxy resin and copper |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2491596A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2496644B (en) * | 2011-11-17 | 2016-06-22 | Altro Ltd | Non-slip coating composition |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5416551A (en) * | 1977-07-08 | 1979-02-07 | Mitsui Mining & Smelting Eng | Bactericidal plastics floor covering |
US4428989A (en) * | 1978-03-15 | 1984-01-31 | Kennecott Corporation | Anti-fouling and anti-sliming gel coat |
CA2005414C (en) * | 1988-12-19 | 1999-09-28 | Joseph M. Wentzell | Copper marine cladding composition |
US5571312A (en) * | 1992-07-28 | 1996-11-05 | Cresco Inc., Sa. | Environmentally safe epoxy adhesive-copper hull coating and method |
CA2129582A1 (en) * | 1994-07-14 | 1996-01-15 | Graham C. Andoe | Environmentally safe epoxy adhesive-copper hull coating and method |
WO2006084161A2 (en) * | 2005-02-03 | 2006-08-10 | Ralph Sacks | Anti-microbial granules |
-
2011
- 2011-06-07 GB GB1109476.0A patent/GB2491596A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB2491596A (en) | 2012-12-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |