GB1597707A - Electronic component assemblies - Google Patents

Electronic component assemblies Download PDF

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Publication number
GB1597707A
GB1597707A GB47165/77A GB4716577A GB1597707A GB 1597707 A GB1597707 A GB 1597707A GB 47165/77 A GB47165/77 A GB 47165/77A GB 4716577 A GB4716577 A GB 4716577A GB 1597707 A GB1597707 A GB 1597707A
Authority
GB
United Kingdom
Prior art keywords
electronic component
component assembly
shape recess
shape
flat surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB47165/77A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AEI Semiconductors Ltd
Original Assignee
AEI Semiconductors Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AEI Semiconductors Ltd filed Critical AEI Semiconductors Ltd
Priority to GB47165/77A priority Critical patent/GB1597707A/en
Publication of GB1597707A publication Critical patent/GB1597707A/en
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12032—Schottky diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15157—Top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)

Description

(54) ELECTRONIC COMPONENT ASSEMBLIES (71) We, AEI Semiconductors Limited, a British Company, of Carholme Road, Lincoln LNl 1 SG, do hereby declare the invention, for which we pray that a patent may be granted to us, and the method by which it is to be performed, to be particularly described in and by the following statement: This invention relates to electronic component assemblies and is particularly concerned with a mounting arrangement which facilitates the handling and use of extremely small electronic components in a relatively inexpensive and simple manner.
According to this invention, an electronic component assembly includes a body of glass or ceramic having a V-shape recess in a flat surface thereof, an electronic component mounted on one of the two inclined major faces of the V-shaped recess and electrical connection means connecting the electronic component to two conductive pads on said flat surface, one pad on each side of the V-shape recess.
Preferably, the component is a two-terminal semi-conductor device and, preferably again, the semi-condustor device is a diode.
Preferably, at least part of each of the two faces of the V-shape recess is provided with an electrically conductive layer which extends onto said flat surface to constitute a respective one of the said two pads.
Preferably again, the base of the electronic component is bonded to one of the conductive layers and is electrically connected to the other of the electrically conductive layers by means of a flexible wire link.
The invention is particularly suited for use with high frequency electronic components such as Schottky diodes. Such diodes are often required to operate at frequencies in excess of 40GHz and, in electronic component assemblies incorporating such diodes, it is important to minimise the capacitance, lead length and physical size of the assembly.
The invention is further described, by way of example, with reference to the drawing accompanying the provisional specification which shows one form of an electronic component assembly in accordance with the present invention.
Referring to the drawing, there is shown therein a body 1 of ceramic material having an upper flat surface 2 in which there has been formed a V-shape recess 3. The V-shape recess can, conveniently, be formed using an appropriately shaped grinding wheel. The V-shape recess 3 is provided with two inclined major flat faces 4 and 5 which, in the drawing, are shown having equal inclinations relative to the flat surface 2. This, however, is not essential and, in some cases, the two inclinations may be greatly different, the inclinations being chosen to most conveniently accommodate a desired electronic component. After the V-shape recess has been formed, a thin layer of chromium is evaporated onto the side faces 4 and 5 and onto the remaining areas of the flat face 2. This is followed by evaporation of a thin layer of gold onto the same surfaces and, subsequently, the thickness of the gold layer is increased by a plating process. The conductive regions 8 and 9, so formed at the surface 2, are subsequently used to mount the assembly in the circuit in which the electronic component is to be used.
It is important to electrically isolate the conductive layers on each of the two faces 4 and 5 and this can be accomplished, at this stage, by sawing lightly through the layers at the base of the V-shape recess. Alternatively, the base 10 of the V-shape recess could have been masked off by means of a thin wire, for example, prior to the evaporation of the chromium and gold.
A diode 6 is, subsequently, bonded onto the face 5 so that the base of the diode forms a strong mechanical and electrical joint with the gold surface. A thin flexible conductive wire 7 is then bonded between the upper surface of the diode 6 and the gold layer on the face 4.
If desired, the diode 6 may be provided with an inert encapsulation to protect it from the effects of the atmosphere. Typically, an encapsulation material could be an epoxy resin.
Typically, such a mounting assembly is for use with a micro-strip circuit and, in such a case, the ceramic body 1 is inverted and mounted with the conductuve pads 8 and 9 being brought into contact with appropriate conductive areas of the micro-strip circuit.
Instead of using a ceramic body, it is possible to use a glass material. Both ceramic and glass materials are highly stable and inert and are chosen so as to be electrical insulators.
Conveniently, the body 1 consists of a relatively long rectangular shape having a V-shape groove formed longitudinally along one of its flat faces. Subsequent to the formation of the electrically conductive areas of the body, the body may be sawn into short lengths, each length of which is just sufficiently long to accommodate a diode which is mounted subsequently.
The use of the V-shape recess has two important advantages. Firstly, it enables the electronic component assembly to be kept as small as possible and this is a very relevant consideration at high frequencies. Secondly, only a single machining step is required to produce the profile of the V-shaped recess, allowing production costs to be held to a minimum.
WHAT WE CLAIM IS: 1. An electronic component assembly including a body of glass or ceramic having a V-shape recess in a flat surface thereof, an electronic component mounted on one of the two inclined major faces of the V-shape recess and electrical connection means connecting the electronic component to two conductive pads on said flat surface, one pad on each side of the V-shape recess.
2. An electronic component assembly as claimed in claim 1 and wherein the component is a two-terminal semi-conductor device.
3. An electronic component assembly as claimed in claim 2 and wherein the semiconductor device is a diode.
4. An electrode component assembly as claimed in any of the preceding claims and wherein at least part of each of the two faces of the V-shape recess is provided with an electrically conductive layer which extends onto said flat surface to constitute a respective one of the said two pads.
5. An electronic component assembly as claimed in claim 4 and wherein the base of the electronic component is bonded to one of the conductive layers and is electrically connected to the other of the electrically conductive layers by means of a flexible wire link.
6. An electronic component assembly substantially as illustrated in and described with reference to the drawing accompanying the Provisional specification.
**WARNING** end of DESC field may overlap start of CLMS **.

Claims (6)

**WARNING** start of CLMS field may overlap end of DESC **. Conveniently, the body 1 consists of a relatively long rectangular shape having a V-shape groove formed longitudinally along one of its flat faces. Subsequent to the formation of the electrically conductive areas of the body, the body may be sawn into short lengths, each length of which is just sufficiently long to accommodate a diode which is mounted subsequently. The use of the V-shape recess has two important advantages. Firstly, it enables the electronic component assembly to be kept as small as possible and this is a very relevant consideration at high frequencies. Secondly, only a single machining step is required to produce the profile of the V-shaped recess, allowing production costs to be held to a minimum. WHAT WE CLAIM IS:
1. An electronic component assembly including a body of glass or ceramic having a V-shape recess in a flat surface thereof, an electronic component mounted on one of the two inclined major faces of the V-shape recess and electrical connection means connecting the electronic component to two conductive pads on said flat surface, one pad on each side of the V-shape recess.
2. An electronic component assembly as claimed in claim 1 and wherein the component is a two-terminal semi-conductor device.
3. An electronic component assembly as claimed in claim 2 and wherein the semiconductor device is a diode.
4. An electrode component assembly as claimed in any of the preceding claims and wherein at least part of each of the two faces of the V-shape recess is provided with an electrically conductive layer which extends onto said flat surface to constitute a respective one of the said two pads.
5. An electronic component assembly as claimed in claim 4 and wherein the base of the electronic component is bonded to one of the conductive layers and is electrically connected to the other of the electrically conductive layers by means of a flexible wire link.
6. An electronic component assembly substantially as illustrated in and described with reference to the drawing accompanying the Provisional specification.
GB47165/77A 1978-03-08 1978-03-08 Electronic component assemblies Expired GB1597707A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB47165/77A GB1597707A (en) 1978-03-08 1978-03-08 Electronic component assemblies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB47165/77A GB1597707A (en) 1978-03-08 1978-03-08 Electronic component assemblies

Publications (1)

Publication Number Publication Date
GB1597707A true GB1597707A (en) 1981-09-09

Family

ID=10443981

Family Applications (1)

Application Number Title Priority Date Filing Date
GB47165/77A Expired GB1597707A (en) 1978-03-08 1978-03-08 Electronic component assemblies

Country Status (1)

Country Link
GB (1) GB1597707A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0439227A1 (en) * 1990-01-23 1991-07-31 Koninklijke Philips Electronics N.V. Semiconductor device comprising a support, method of manufacturing it, and method of manufacturing the support
EP0502670A2 (en) * 1991-03-04 1992-09-09 Arthur A. Karpinski Laser diode array
EP0803949A2 (en) * 1996-04-23 1997-10-29 Compagnie Industrielle Des Lasers Cilas Laser diode device mounted on semiconducting bars

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0439227A1 (en) * 1990-01-23 1991-07-31 Koninklijke Philips Electronics N.V. Semiconductor device comprising a support, method of manufacturing it, and method of manufacturing the support
US5198886A (en) * 1990-01-23 1993-03-30 U.S. Philips Corp. Semiconductor device having a clamping support
EP0502670A2 (en) * 1991-03-04 1992-09-09 Arthur A. Karpinski Laser diode array
EP0502670A3 (en) * 1991-03-04 1992-10-28 Arthur A. Karpinski Laser diode array and method of fabrication thereof
EP0803949A2 (en) * 1996-04-23 1997-10-29 Compagnie Industrielle Des Lasers Cilas Laser diode device mounted on semiconducting bars
EP0803949A3 (en) * 1996-04-23 1998-03-04 Compagnie Industrielle Des Lasers Cilas Laser diode device mounted on semiconducting bars

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