GB1552758A - Method of fabricating a semiconduvtor device - Google Patents
Method of fabricating a semiconduvtor deviceInfo
- Publication number
- GB1552758A GB1552758A GB6177/78A GB617778A GB1552758A GB 1552758 A GB1552758 A GB 1552758A GB 6177/78 A GB6177/78 A GB 6177/78A GB 617778 A GB617778 A GB 617778A GB 1552758 A GB1552758 A GB 1552758A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconduvtor
- fabricating
- semiconduvtor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
- Bipolar Transistors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US77168277A | 1977-02-24 | 1977-02-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1552758A true GB1552758A (en) | 1979-09-19 |
Family
ID=25092629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB6177/78A Expired GB1552758A (en) | 1977-02-24 | 1978-02-16 | Method of fabricating a semiconduvtor device |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS53105983A (en) |
DE (1) | DE2806567A1 (en) |
GB (1) | GB1552758A (en) |
IT (1) | IT7819031A0 (en) |
PL (1) | PL117438B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2524707B1 (en) * | 1982-04-01 | 1985-05-31 | Cit Alcatel | METHOD OF ENCAPSULATION OF SEMICONDUCTOR COMPONENTS, AND ENCAPSULATED COMPONENTS OBTAINED |
-
1978
- 1978-01-04 IT IT7819031A patent/IT7819031A0/en unknown
- 1978-02-16 GB GB6177/78A patent/GB1552758A/en not_active Expired
- 1978-02-16 DE DE19782806567 patent/DE2806567A1/en not_active Withdrawn
- 1978-02-20 JP JP1901978A patent/JPS53105983A/en active Pending
- 1978-02-22 PL PL1978204819A patent/PL117438B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPS53105983A (en) | 1978-09-14 |
PL204819A1 (en) | 1978-11-06 |
DE2806567A1 (en) | 1978-08-31 |
IT7819031A0 (en) | 1978-01-04 |
PL117438B1 (en) | 1981-08-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |