GB1534883A - Socket and heat sink for an electronic component - Google Patents

Socket and heat sink for an electronic component

Info

Publication number
GB1534883A
GB1534883A GB4421075A GB4421075A GB1534883A GB 1534883 A GB1534883 A GB 1534883A GB 4421075 A GB4421075 A GB 4421075A GB 4421075 A GB4421075 A GB 4421075A GB 1534883 A GB1534883 A GB 1534883A
Authority
GB
United Kingdom
Prior art keywords
heat sink
socket
electronic component
component
oct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4421075A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REDPOINT Ltd
Original Assignee
REDPOINT Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by REDPOINT Ltd filed Critical REDPOINT Ltd
Priority to GB4421075A priority Critical patent/GB1534883A/en
Publication of GB1534883A publication Critical patent/GB1534883A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1534883 Two-part electrical connectors REDPOINT Ltd 25 Oct 1976 [27 Oct 1975] 44210/75 Heading H2E [Also in Division H1] An assembly for mounting an electronic component, e.g. an integrated circuit 10 of the duel in-line package type, comprises a socket 12 having receptacles for receiving conductor pins of the electronic component, a heat sink 16 having a heat transfer surface for engaging the component and a heat dissipating surface, and means on the socket for interlocking directly with means on the heat sink to mount the component therebetween. As described the heat sink 16 (Fig. 1) is provided with upstanding arms 16b, or cooling fins, and may be of aluminium which is anodized or painted black for greater radiation efficiency. The heat sink may be provided with indentations 20, which engage in and move along slots 18 in the socket 12 or vice versa so as to clamp the component therebetween. In a modification (Fig. 3), the heat sink 30 is provided with a tongue 32 on each of two opposite sides thereof which is received in a respective loop 34 in the socket 36, being bent up after assembly.
GB4421075A 1976-10-25 1976-10-25 Socket and heat sink for an electronic component Expired GB1534883A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4421075A GB1534883A (en) 1976-10-25 1976-10-25 Socket and heat sink for an electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4421075A GB1534883A (en) 1976-10-25 1976-10-25 Socket and heat sink for an electronic component

Publications (1)

Publication Number Publication Date
GB1534883A true GB1534883A (en) 1978-12-06

Family

ID=10432284

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4421075A Expired GB1534883A (en) 1976-10-25 1976-10-25 Socket and heat sink for an electronic component

Country Status (1)

Country Link
GB (1) GB1534883A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2174541A (en) * 1985-05-04 1986-11-05 Stc Plc DIL package adaptor
US4709302A (en) * 1986-12-16 1987-11-24 Thermalloy Incorporated Alignment apparatus for electronic device package
US5122480A (en) * 1990-04-30 1992-06-16 Motorola, Inc. Method for assembling a heat sink to a circuit element using a retentive spring force
EP0962123A1 (en) * 1997-10-23 1999-12-08 Thermalloy Incorporated Heat sink mounting assembly for surface mount electronic device packages
WO2004088761A1 (en) * 2003-04-02 2004-10-14 Lucea Ag Light-emitting panel

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2174541A (en) * 1985-05-04 1986-11-05 Stc Plc DIL package adaptor
GB2174541B (en) * 1985-05-04 1989-05-24 Stc Plc Dil package adaptor
US4709302A (en) * 1986-12-16 1987-11-24 Thermalloy Incorporated Alignment apparatus for electronic device package
US5122480A (en) * 1990-04-30 1992-06-16 Motorola, Inc. Method for assembling a heat sink to a circuit element using a retentive spring force
EP0962123A1 (en) * 1997-10-23 1999-12-08 Thermalloy Incorporated Heat sink mounting assembly for surface mount electronic device packages
EP0962123A4 (en) * 1997-10-23 2002-10-02 Thermalloy Inc Heat sink mounting assembly for surface mount electronic device packages
WO2004088761A1 (en) * 2003-04-02 2004-10-14 Lucea Ag Light-emitting panel

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee