GB1502036A - Voltage multiplier cascades - Google Patents
Voltage multiplier cascadesInfo
- Publication number
- GB1502036A GB1502036A GB3367276A GB3367276A GB1502036A GB 1502036 A GB1502036 A GB 1502036A GB 3367276 A GB3367276 A GB 3367276A GB 3367276 A GB3367276 A GB 3367276A GB 1502036 A GB1502036 A GB 1502036A
- Authority
- GB
- United Kingdom
- Prior art keywords
- stack
- aug
- electrically conductive
- pick
- voltage multiplier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Rectifiers (AREA)
Abstract
1502036 Semi-conductor devices SIEMENS AG 12 Aug 1976 [18 Aug 1975] 33672/76 Heading H1K A voltage multiplier cascade includes a high-voltage rectifier assembly comprising at least two rectifier elements 1 electrically connected in series via a self-supporting, mechanically stable, rigid adhesive layer 2 which is connected to an electrically conductive pick-up 3. The adhesive may comprise solder or electrically conductive lacquer. The pick-up 3, in contact with a tag 4, may be metal or highly doped semi-conductor material. A number of assemblies can be formed by dividing a stack of assembled rectangular rectifier elements into separate columns by parallel cuts parallel to the stack axis and perpendicular to the longer side of the stack. In an encapsulation process, contact tags are connected to a supporting web, Fig. 10 (not shown), which is removed after encasing the stack in synthetic plastics or glass.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19752536711 DE2536711C3 (en) | 1975-08-18 | 1975-08-18 | High voltage rectifier for high voltage cascades |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1502036A true GB1502036A (en) | 1978-02-22 |
Family
ID=5954227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3367276A Expired GB1502036A (en) | 1975-08-18 | 1976-08-12 | Voltage multiplier cascades |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5223621A (en) |
DE (1) | DE2536711C3 (en) |
FR (1) | FR2321773A1 (en) |
GB (1) | GB1502036A (en) |
IT (1) | IT1066923B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2741858A1 (en) * | 1975-08-18 | 1979-03-29 | Siemens Ag | HV rectifier prodn. system - winds conductors off reels, and diodes are soldered in place before cutting conductors to length |
US4315488A (en) * | 1978-11-13 | 1982-02-16 | Toyo Kogyo Co., Ltd. | Rotary piston engine having supercharging means |
JPS55137317A (en) * | 1979-04-12 | 1980-10-27 | Mazda Motor Corp | Supercharger for rotary piston engine |
US4758927A (en) * | 1987-01-21 | 1988-07-19 | Tektronix, Inc. | Method of mounting a substrate structure to a circuit board |
JPH0757369B2 (en) * | 1987-12-19 | 1995-06-21 | 株式会社神戸製鋼所 | Method for direct or indirect ram extrusion of tubular products using mandrel |
DE10009171B4 (en) * | 2000-02-26 | 2005-08-11 | Robert Bosch Gmbh | Power converter and its manufacturing process |
DE10258035A1 (en) * | 2002-12-12 | 2004-06-24 | Robert Bosch Gmbh | Single-phase power converter module, e.g. automobile rectifier, has auxiliary element for inhibiting connector tilt about connecting vane longitudinal axis that can be separated after module assembly |
DE102011010744A1 (en) | 2011-02-09 | 2012-08-09 | Daimler Ag | Turbine for an exhaust gas turbocharger and turbocharger with such a turbine |
-
1975
- 1975-08-18 DE DE19752536711 patent/DE2536711C3/en not_active Expired
-
1976
- 1976-07-19 FR FR7621954A patent/FR2321773A1/en active Granted
- 1976-08-06 IT IT2609376A patent/IT1066923B/en active
- 1976-08-12 GB GB3367276A patent/GB1502036A/en not_active Expired
- 1976-08-17 JP JP9811876A patent/JPS5223621A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
FR2321773B3 (en) | 1979-07-06 |
DE2536711B2 (en) | 1979-06-21 |
JPS5223621A (en) | 1977-02-22 |
DE2536711C3 (en) | 1980-02-28 |
DE2536711A1 (en) | 1977-02-24 |
FR2321773A1 (en) | 1977-03-18 |
IT1066923B (en) | 1985-03-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |