GB1484061A - Radiation sensitive composition - Google Patents
Radiation sensitive compositionInfo
- Publication number
- GB1484061A GB1484061A GB4136274A GB4136274A GB1484061A GB 1484061 A GB1484061 A GB 1484061A GB 4136274 A GB4136274 A GB 4136274A GB 4136274 A GB4136274 A GB 4136274A GB 1484061 A GB1484061 A GB 1484061A
- Authority
- GB
- United Kingdom
- Prior art keywords
- norbornene
- radiation
- polymer
- sensitive
- carboxylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0384—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the main chain of the photopolymer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
- C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
- C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
- C08G61/08—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/008—Azides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Abstract
1484061 Radiation-sensitive compositions of ring-opened polymers JAPAN SYNTHETIC RUBBER CO Ltd 23 Sept 1974 [27 Sept 1973] 41362/74 Heading C3P [Also in Division G2] Radiation-sensitive compositions comprise a ring-opened polymer of a norbornene derivative having at least one ester, nitrile, carboxyl, amide, imide, hydroxyl or carboxylic acid anhydride group or halogen atom substituent, or a hydrolysis product of the polymer; and a radiation-sensitive cross-linking agent or radiation sensitizer. The polymer may be a homopolymer or copolymer of one or more of said norbornene derivatives and may also include units derived from a cycloolefin other than cyclohexene. Radiation-sensitive azides are preferred as cross-linking agent. In examples the ring-opened polymer is derived from (1) methyl 5 - norbornene - 2 - carboxylate, (2) methyl 5-norbornene-2-carboxylate and 5-norbornene-2-nitrile, (3) N,N-dimethyl-5-norbornene 2-carboxylic acid amide, (4) dimethyl 5- norbornene-2,3-dicarboxylate, (5) the free acid form of polymer (1) obtained by acid hydrolysis, (6) methyl 5-norbornene-2-carboxylate and cyclopentane and (7) 5-norbornene-2-3-dicarboxylic acid anhydride and cyclo-octene. The compositions are suitably applied as a thin film to a metal plate or silicon wafer, imagewise exposed to radiation such as light or an electron beam, and developed with a solvent to produce resist images which have applications in printed circuits, name plates, integrated circuits and plate-making.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10875373A JPS5628257B2 (en) | 1973-09-27 | 1973-09-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1484061A true GB1484061A (en) | 1977-08-24 |
Family
ID=14492620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4136274A Expired GB1484061A (en) | 1973-09-27 | 1974-09-23 | Radiation sensitive composition |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS5628257B2 (en) |
DE (1) | DE2445395A1 (en) |
GB (1) | GB1484061A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1031879A1 (en) * | 1999-02-25 | 2000-08-30 | Shin-Etsu Chemical Co., Ltd. | Novel ester compounds, polymers, resist compositions and patterning process |
US6291131B1 (en) | 1998-08-26 | 2001-09-18 | Hyundai Electronics Industries Co., Ltd. | Monomers for photoresist, polymers thereof, and photoresist compositions using the same |
US6312865B1 (en) | 1997-12-31 | 2001-11-06 | Hyundai Electronics Industries Co., Ltd. | Semiconductor device using polymer-containing photoresist, and process for manufacturing the same |
US6369181B1 (en) | 1997-12-29 | 2002-04-09 | Hyundai Electronics Industries Co., Ltd. | Copolymer resin, preparation thereof, and photoresist using the same |
US6391518B1 (en) | 1998-07-27 | 2002-05-21 | Hyundai Electronics Industries Co., Ltd. | Polymers and photoresist compositions using the same |
US6410670B1 (en) | 1998-08-26 | 2002-06-25 | Hyundai Electronics Industries Co., Ltd. | Photoresist monomer having hydroxy group and carboxy group, copolymer thereof and photoresist composition using the same |
US6569971B2 (en) | 1998-08-27 | 2003-05-27 | Hyundai Electronics Industries Co., Ltd. | Polymers for photoresist and photoresist compositions using the same |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1489470A (en) * | 1974-07-04 | 1977-10-19 | Showa Denko Kk | Norbornene polymers |
US4440850A (en) * | 1981-07-23 | 1984-04-03 | Ciba-Geigy Corporation | Photopolymerisation process with two exposures of a single layer |
US4571375A (en) * | 1983-10-24 | 1986-02-18 | Benedikt George M | Ring-opened polynorbornene negative photoresist with bisazide |
-
1973
- 1973-09-27 JP JP10875373A patent/JPS5628257B2/ja not_active Expired
-
1974
- 1974-09-23 DE DE19742445395 patent/DE2445395A1/en not_active Withdrawn
- 1974-09-23 GB GB4136274A patent/GB1484061A/en not_active Expired
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6369181B1 (en) | 1997-12-29 | 2002-04-09 | Hyundai Electronics Industries Co., Ltd. | Copolymer resin, preparation thereof, and photoresist using the same |
US6608158B2 (en) | 1997-12-29 | 2003-08-19 | Hyundai Electronics Industries Co., Ltd. | Copolymer resin, preparation thereof, and photoresist using the same |
US6312865B1 (en) | 1997-12-31 | 2001-11-06 | Hyundai Electronics Industries Co., Ltd. | Semiconductor device using polymer-containing photoresist, and process for manufacturing the same |
US6632903B2 (en) | 1997-12-31 | 2003-10-14 | Hyundai Electronics Industries Co., Ltd. | Polymer-containing photoresist, and process for manufacturing the same |
US6391518B1 (en) | 1998-07-27 | 2002-05-21 | Hyundai Electronics Industries Co., Ltd. | Polymers and photoresist compositions using the same |
US6291131B1 (en) | 1998-08-26 | 2001-09-18 | Hyundai Electronics Industries Co., Ltd. | Monomers for photoresist, polymers thereof, and photoresist compositions using the same |
US6410670B1 (en) | 1998-08-26 | 2002-06-25 | Hyundai Electronics Industries Co., Ltd. | Photoresist monomer having hydroxy group and carboxy group, copolymer thereof and photoresist composition using the same |
US6586619B2 (en) | 1998-08-26 | 2003-07-01 | Hyundai Electronics Industries Co., Ltd. | Photoresist monomer having hydroxy group and carboxy group, copolymer thereof and photoresist composition using the same |
US6569971B2 (en) | 1998-08-27 | 2003-05-27 | Hyundai Electronics Industries Co., Ltd. | Polymers for photoresist and photoresist compositions using the same |
US6987155B2 (en) | 1998-08-27 | 2006-01-17 | Hyundai Electronics Industries Co., Ltd. | Polymers for photoresist and photoresist compositions using the same |
EP1031879A1 (en) * | 1999-02-25 | 2000-08-30 | Shin-Etsu Chemical Co., Ltd. | Novel ester compounds, polymers, resist compositions and patterning process |
US6284429B1 (en) | 1999-02-25 | 2001-09-04 | Shin-Etsu Chemical Co., Ltd. | Ester compounds, polymers, resist compositions and patterning process |
Also Published As
Publication number | Publication date |
---|---|
JPS5628257B2 (en) | 1981-06-30 |
JPS5060221A (en) | 1975-05-24 |
DE2445395A1 (en) | 1975-04-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
746 | Register noted 'licences of right' (sect. 46/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |