GB1448415A - Cured epoxy polymer - Google Patents

Cured epoxy polymer

Info

Publication number
GB1448415A
GB1448415A GB2562774A GB2562774A GB1448415A GB 1448415 A GB1448415 A GB 1448415A GB 2562774 A GB2562774 A GB 2562774A GB 2562774 A GB2562774 A GB 2562774A GB 1448415 A GB1448415 A GB 1448415A
Authority
GB
United Kingdom
Prior art keywords
bisphenol
parts
resin
mixture
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2562774A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05465376 external-priority patent/USB465376I5/en
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1448415A publication Critical patent/GB1448415A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

1448415 Epoxy resins WESTERN ELECTRIC CO Inc 10 June 1974 [11 June 1973 19 Feb 1974 1 May 1974] 25627/74 Heading C3B A cured epoxy resin comprises: (A) an adduct of two moles of the diclygidyl ether of bisphenol A and one mole of linoleic dimer acid, a diglycidyl ester of linoleic dimer acid or a mixture thereof; (B) up to 50% by wt. based on (A) of an elastomerically modified resin obtained by reacting a diglycidyl ether of bisphenol A or of bisphenol F (or mixture thereof) with a carboxyl terminated butadiene/acrylonitrile copolymer; and (C) a minor amount of a diglycidyl ether of bisphenol A or of bisphenol F (or mixture thereof). As curing agent is employed 16-60 parts by wt. of an acid anhydride per 100 parts by wt. of resin together with 0-30 parts by wt. of a dimer acid R(COOH) 2 where R is CH 2 (CH 2 ) 5 CH 2 , or a trimer acid of stoichiometric formula C 54 H 96 O 6 , (E) a polyamine in an equimolar ratio with the resin or (F) a polyamine in an equal mole ratio combined with the acid anhydride in an amount of at least 5 parts by wt. per 100 parts by wt. of the resin component. In examples compositions according to the invention are coated on epoxy-glass cloth laminates which are subsequently sensitized and further coated with an electroless copper coating and finally electroplated with copper.
GB2562774A 1973-06-11 1974-06-10 Cured epoxy polymer Expired GB1448415A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36903873A 1973-06-11 1973-06-11
US44364874A 1974-02-19 1974-02-19
US05465376 USB465376I5 (en) 1974-02-19 1974-05-01

Publications (1)

Publication Number Publication Date
GB1448415A true GB1448415A (en) 1976-09-08

Family

ID=27408900

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2562774A Expired GB1448415A (en) 1973-06-11 1974-06-10 Cured epoxy polymer

Country Status (15)

Country Link
JP (1) JPS544398B2 (en)
BR (1) BR7404745A (en)
CA (1) CA1060136A (en)
CH (1) CH603725A5 (en)
DE (1) DE2427030C3 (en)
ES (1) ES427131A1 (en)
FR (1) FR2232614B1 (en)
GB (1) GB1448415A (en)
HK (1) HK45977A (en)
IE (1) IE39796B1 (en)
IL (1) IL44997A (en)
IT (1) IT1011946B (en)
MY (1) MY7700290A (en)
NL (1) NL162118C (en)
SE (1) SE413774B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2189248A (en) * 1984-05-24 1987-10-21 Du Pont Chip-resistant paint containing epoxyester linear block oligomer
EP1506952A2 (en) * 2003-08-07 2005-02-16 Mitsubishi Gas Chemical Company, Inc. Cyclohexanetricarboxylic monoester and its use
US7323522B2 (en) 2003-08-07 2008-01-29 Mitsubishi Gas Chemical Company, Inc. Cyclohexanetricarboxylic monoester and its use
CN115926110A (en) * 2022-12-29 2023-04-07 江苏扬农锦湖化工有限公司 Modified epoxy resin and preparation method and application thereof

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53109915A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109920A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109922A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109921A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109918A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109919A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109914A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
DE69229262T2 (en) * 1992-03-16 2000-01-20 Raytheon Co., Lexington Heat transfer adhesive
JP5670048B2 (en) * 2009-12-21 2015-02-18 株式会社Ｄｎｐファインケミカル Adhesive composition and method for producing curable adhesive sheet
JP2012256872A (en) * 2011-05-12 2012-12-27 Rohm & Haas Electronic Materials Llc Adhesion promotion of metal to dielectric

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2189248A (en) * 1984-05-24 1987-10-21 Du Pont Chip-resistant paint containing epoxyester linear block oligomer
EP1506952A2 (en) * 2003-08-07 2005-02-16 Mitsubishi Gas Chemical Company, Inc. Cyclohexanetricarboxylic monoester and its use
EP1506952A3 (en) * 2003-08-07 2005-03-02 Mitsubishi Gas Chemical Company, Inc. Cyclohexanetricarboxylic monoester and its use
US7323522B2 (en) 2003-08-07 2008-01-29 Mitsubishi Gas Chemical Company, Inc. Cyclohexanetricarboxylic monoester and its use
CN1603300B (en) * 2003-08-07 2011-05-18 三菱瓦斯化学株式会社 Cyclohexanetricarboxylic monoester and its use
CN115926110A (en) * 2022-12-29 2023-04-07 江苏扬农锦湖化工有限公司 Modified epoxy resin and preparation method and application thereof

Also Published As

Publication number Publication date
IT1011946B (en) 1977-02-10
DE2427030C3 (en) 1980-08-28
MY7700290A (en) 1977-12-31
DE2427030A1 (en) 1975-01-02
CA1060136A (en) 1979-08-07
FR2232614B1 (en) 1977-09-30
JPS544398B2 (en) 1979-03-06
IE39796L (en) 1974-12-11
JPS5034094A (en) 1975-04-02
FR2232614A1 (en) 1975-01-03
CH603725A5 (en) 1978-08-31
IL44997A (en) 1977-05-31
DE2427030B2 (en) 1979-12-20
IL44997A0 (en) 1974-09-10
ES427131A1 (en) 1976-09-01
BR7404745A (en) 1976-02-17
NL7407729A (en) 1974-12-13
NL162118B (en) 1979-11-15
SE7407533L (en) 1974-12-12
IE39796B1 (en) 1979-01-03
HK45977A (en) 1977-09-16
NL162118C (en) 1980-04-15
SE413774B (en) 1980-06-23

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee