GB1446636A - Treating a printed circuit board so that the conductive areas thereof have a substantially uniform coating of solder thereon - Google Patents
Treating a printed circuit board so that the conductive areas thereof have a substantially uniform coating of solder thereonInfo
- Publication number
- GB1446636A GB1446636A GB5524773A GB5524773A GB1446636A GB 1446636 A GB1446636 A GB 1446636A GB 5524773 A GB5524773 A GB 5524773A GB 5524773 A GB5524773 A GB 5524773A GB 1446636 A GB1446636 A GB 1446636A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solder
- board
- bath
- tank
- tanks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0002—Soldering by means of dipping in a fused salt bath
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
1446636 Soldering XEROX CORP 28 Nov 1973 [1 Dec 1972 (2)] 55247/73 Heading B3R In a method of producing a uniform coating of solder on a printed circuit board, the board, coated with solder, is immersed in a heated bath of substance immiscible with the solder and is vibrated in an orbital motion within the bath which is at a temperature such that the solder on the board is flowable for at least part of the duration of the vibration, the board being then removed from the bath. In an embodiment an indexing plate carries outwardly directed arms each of which has a hook on its underside and the plate is rotatably and vertically movably mounted on a vertical shaft around which are arranged a number of tanks. A frame supporting a printed circuit board is hung on one of the hooks and the plate is indexed so that the board is lowered into each of the tanks in turn. The tanks provide (a) a phosphoric or hydrochloric acid solution dip; (b) a cold water spray; (c) a flux dip; (d) preheating to about 250‹F; (e) a solder spray and vibration in solder immiscible liquid; (f) a water rinse at 150‹F (g) a water spray rinse at 120‹F and (h) a drying air flow. In (e) the board in its frame 8, Fig. 4, is lowered between tracks 19, 20 mounted on a plate 21 supported by rods 22, 23 which extend through the wall of the tank 13 and are connected eccentrically to shafts driven by a motor 24. A bath 34 of heated solder, e.g. 63% tin-37% lead is provided in the bottom of the tank and solder is pumped by pump 26 from the bath 34 through pipes 28 providing nozzles 31 directed downwardly. A heated bath 35 of wax, e.g. polyethylene oxide wax or polyethylene glycol wax or an oil, e.g. peanut oil is provided to float above the solder bath 34. As the board is lowered into the tank 13 solder is sprayed upon both sides from the nozzles 31 and when the board reaches the bottom of the channels 19, 20 a switch is operated to cut off the spray from the nozzles. The motor 24 is energised to cause the board to be vibrated in a circular or elliptical orbital path while in the heated bath 35 for 15-20 sees. The orbital motion is stopped and the board is lifted from the tank or alternatively the orbital motion may be continued as lifting proceeds. The board may be wholly coated with solder before it is immersed in the wax bath and the tanks may be arranged in a row.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31120572A | 1972-12-01 | 1972-12-01 | |
US311206A US3893409A (en) | 1972-12-01 | 1972-12-01 | Apparatus for solder coating printed circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1446636A true GB1446636A (en) | 1976-08-18 |
Family
ID=26977779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5524773A Expired GB1446636A (en) | 1972-12-01 | 1973-11-28 | Treating a printed circuit board so that the conductive areas thereof have a substantially uniform coating of solder thereon |
Country Status (4)
Country | Link |
---|---|
CA (1) | CA984522A (en) |
FR (1) | FR2209274B1 (en) |
GB (1) | GB1446636A (en) |
NL (1) | NL7316549A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4463891A (en) * | 1981-11-18 | 1984-08-07 | Rca Corporation | Wave soldering apparatus and method |
US4469716A (en) * | 1980-09-09 | 1984-09-04 | Sinter Limited | Process for the application of solder on printed circuit boards and process for their placement in and removal from this device |
GB2151528A (en) * | 1983-12-22 | 1985-07-24 | Peter Philip Andrew Lymn | Solder leveller |
USRE32982E (en) * | 1978-04-18 | 1989-07-11 | Hollis Automation, Inc. | Mass soldering system |
GB2265101A (en) * | 1992-03-17 | 1993-09-22 | Sun Ind Coatings | Soldering apparatus and method |
US6168065B1 (en) | 1998-02-17 | 2001-01-02 | Soltec B.V. | Movable selective debridging apparatus for debridging soldered joints on printed circuit boards |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2021316A5 (en) * | 1969-09-19 | 1970-07-17 | Burroughs Corp | Finishing process for welded junctions on a - printed circuit board |
-
1973
- 1973-11-28 GB GB5524773A patent/GB1446636A/en not_active Expired
- 1973-11-30 CA CA187,043A patent/CA984522A/en not_active Expired
- 1973-12-03 NL NL7316549A patent/NL7316549A/xx not_active Application Discontinuation
- 1973-12-03 FR FR7343043A patent/FR2209274B1/fr not_active Expired
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE32982E (en) * | 1978-04-18 | 1989-07-11 | Hollis Automation, Inc. | Mass soldering system |
US4469716A (en) * | 1980-09-09 | 1984-09-04 | Sinter Limited | Process for the application of solder on printed circuit boards and process for their placement in and removal from this device |
US4463891A (en) * | 1981-11-18 | 1984-08-07 | Rca Corporation | Wave soldering apparatus and method |
GB2151528A (en) * | 1983-12-22 | 1985-07-24 | Peter Philip Andrew Lymn | Solder leveller |
US4599966A (en) * | 1983-12-22 | 1986-07-15 | Lymn Peter A P | Solder leveller |
GB2265101A (en) * | 1992-03-17 | 1993-09-22 | Sun Ind Coatings | Soldering apparatus and method |
US5361964A (en) * | 1992-03-17 | 1994-11-08 | Sun Industrial Coatings Private Limited | Soldering apparatus and method |
GB2265101B (en) * | 1992-03-17 | 1995-05-10 | Sun Ind Coatings | Soldering apparatus and method |
US6168065B1 (en) | 1998-02-17 | 2001-01-02 | Soltec B.V. | Movable selective debridging apparatus for debridging soldered joints on printed circuit boards |
Also Published As
Publication number | Publication date |
---|---|
CA984522A (en) | 1976-02-24 |
NL7316549A (en) | 1974-06-05 |
FR2209274A1 (en) | 1974-06-28 |
FR2209274B1 (en) | 1979-05-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |