GB1376785A - Method and apparatus for etching copper and copper alloys - Google Patents

Method and apparatus for etching copper and copper alloys

Info

Publication number
GB1376785A
GB1376785A GB925472A GB925472A GB1376785A GB 1376785 A GB1376785 A GB 1376785A GB 925472 A GB925472 A GB 925472A GB 925472 A GB925472 A GB 925472A GB 1376785 A GB1376785 A GB 1376785A
Authority
GB
United Kingdom
Prior art keywords
container
measurer
valve
controls
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB925472A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HOLLMULLER H
Original Assignee
HOLLMULLER H
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19712110950 external-priority patent/DE2110950A1/en
Priority claimed from DE19712140215 external-priority patent/DE2140215C2/en
Priority claimed from CH102572A external-priority patent/CH587923A5/en
Application filed by HOLLMULLER H filed Critical HOLLMULLER H
Publication of GB1376785A publication Critical patent/GB1376785A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/46Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

1376785 Liquid level control and indication; measuring density electrically H HOLLMULLER 29 Feb 1972 [8 March 1971 11 Aug 1971 21 Jan 1972] 9254/72 Headings G1H and G1N [Also in Divisions B6 and G3] An ammoniacal etching solution containing chloride ions (e.g. ammonium hydroxide and ammonium chloride) for etching copper or copper alloys is regenerated by adding controlled amounts of an ammonia-containing compound (e.g. ammonium hydroxide) and a chlorine-containing compound (e.g. hydrochloric acid), the former in an amount to maintain the pH at 8À5-10À0 and the latter in an amount corresponding to the formation of copper (I) during etching. Etching solution 5 on the way to an etching machine is passed through a container 1. A pH measurer 29 controls a valve 14 to admit ammonium hydroxide from a container 8 to the container 1, a specific gravity measurer 30 controls a valve 15 to admit water from a container 9, and a redox potential measurer 28 controls a valve 16 to admit hydrochloric acid from a container 10. The maximum liquid level 4 in the container 1 and the minimum level 27 in the containers 8, 9, 10 are maintained by means of level-control switches 6, 26, the latter controlling the supply to the containers 8, 9, 10. In another form, Fig.2 (not shown), the measurer 30 controls all the valves 14, 15, 16 and the measurer 29 controls an additional valve (33) for further addition of ammonium hydroxide. In another form, Fig.3 (not shown), the container 8 is replaced by an inlet for ammonia gas, said inlet having a valve controlled by the pH measurer, while the valves 15, 16 are controlled by the measurer 30. In another form, Fig.4 (not shown), the solution is regenerated in the etching chamber, ammonia gas and ammonium chloride being introduced through valves controlled by the measurers 29, 30 respectively. The specific gravity measurer 30 comprises a closed cylinder 54, Fig.5, having an inlet 55 and an outlet 56 for the solution, in which floats a rod-shaped float 59 having a titanium extension 61. If the specific gravity of the solution rises to an undesirable level, the extension 61 moves further away from an inductive switch 62, which opens the circuit of a relay 63, thus closing a relay switch 65 in the circuit 66 of the solenoid valve 15, to open the latter. In another form, Fig.6 (not shown), the circuit 66 controls all the valves 14, 15, 16, and the pH measurer 29 controls a changeover switch which, when the pH value drops, excludes the valve 15 from and includes the valve 33 in the circuit 66. The level-control switch 6 (or 26) comprises a housing 169, Figs.8 and 9, separated from the container 1 (or 8, 9, 10) by a disc 70 having a plurality of apertures. The housing 169 contains a float 167 in which is secured an annular magnet 168. To the bottom of the housing is secured a closed trough 71 in which is fixed a closed glass tube 75 containing an electric switch 72 which comprises a stationary contact 73 and a movable contact 74 which are normally spaced apart. When the level of the liquid in the container sinks, the magnet approaches the switch and causes the contacts to close and initiate the supply of further liquid to the container.
GB925472A 1971-03-08 1972-02-29 Method and apparatus for etching copper and copper alloys Expired GB1376785A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19712110950 DE2110950A1 (en) 1971-03-08 1971-03-08 Etching copper/copper alloys process - using a regenerative soln contg ammonium and chloride ions
DE19712140215 DE2140215C2 (en) 1971-08-11 1971-08-11 Method and system for regenerating an etching solution suitable for etching copper and copper alloys, in particular copper-clad printed circuit boards, as well as measuring device of this system
CH102572A CH587923A5 (en) 1971-03-08 1972-01-21 Etching copper/copper alloys process - using a regenerative soln contg ammonium and chloride ions

Publications (1)

Publication Number Publication Date
GB1376785A true GB1376785A (en) 1974-12-11

Family

ID=27172613

Family Applications (1)

Application Number Title Priority Date Filing Date
GB925472A Expired GB1376785A (en) 1971-03-08 1972-02-29 Method and apparatus for etching copper and copper alloys

Country Status (9)

Country Link
US (1) US3806393A (en)
JP (1) JPS5549154B1 (en)
AT (1) AT313671B (en)
BE (1) BE780292A (en)
CA (1) CA969843A (en)
FR (1) FR2128796B1 (en)
GB (1) GB1376785A (en)
IT (1) IT952925B (en)
NL (1) NL7202652A (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3951711A (en) * 1974-10-24 1976-04-20 General Dynamics Corporation System for maintaining uniform copper etching efficiency
US3999564A (en) * 1976-01-09 1976-12-28 Pesek Engineering & Mfg. Co. Continuous etching and etched material recovery system
DE2917597A1 (en) * 1979-04-30 1980-11-13 Siemens Ag METHOD FOR REGENERATING AMMONIACAL ETCH SOLUTIONS FOR ETCHING METALLIC COPPER
DE3469190D1 (en) * 1983-11-08 1988-03-10 Holzer Walter Process and apparatus for separating, for example, copper from a liquid electrolyte introduced into a pluricellular electrolyser
DE3422276A1 (en) * 1984-06-15 1985-12-19 Walter Holzer Apparatus and procedure for etching printed circuit boards
DE3345050A1 (en) * 1983-12-13 1985-06-20 Walter 7758 Meersburg Holzer METHOD FOR THE ENVIRONMENTALLY FRIENDLY ASSEMBLY OF CIRCUIT BOARDS AND DEVICE FOR EXERCISING THE WORKING METHOD
DE3936363A1 (en) * 1989-11-02 1991-05-08 Hoellmueller Maschbau H Etching unit esp. for printed copper circuit boards - in which used rinsing water is distilled to recover pure water and ammoniacal etchant to which ammonia is added prior to recycling
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
CN102321908A (en) * 2011-09-02 2012-01-18 广州市天承化工有限公司 Recycling and regenerating process method and metal copper recovery system of acid chloride etching solution

Also Published As

Publication number Publication date
IT952925B (en) 1973-07-30
CA969843A (en) 1975-06-24
BE780292A (en) 1972-07-03
FR2128796A1 (en) 1972-10-20
NL7202652A (en) 1972-09-12
AT313671B (en) 1974-02-25
US3806393A (en) 1974-04-23
JPS5549154B1 (en) 1980-12-10
FR2128796B1 (en) 1976-08-06

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee