GB1374617A - Grinding machine and method and semiconductor formed thereby - Google Patents
Grinding machine and method and semiconductor formed therebyInfo
- Publication number
- GB1374617A GB1374617A GB5937471A GB5937471A GB1374617A GB 1374617 A GB1374617 A GB 1374617A GB 5937471 A GB5937471 A GB 5937471A GB 5937471 A GB5937471 A GB 5937471A GB 1374617 A GB1374617 A GB 1374617A
- Authority
- GB
- United Kingdom
- Prior art keywords
- grinding
- chuck
- wafers
- strips
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 235000012431 wafers Nutrition 0.000 abstract 10
- 230000007246 mechanism Effects 0.000 abstract 2
- 239000012530 fluid Substances 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
1374617 Grinding SONY CORP 21 Dec 1971 [21 Dec 1970] 59374/71 Heading B3D A machine for grinding a predetermined edge contour on a workpiece, such as a semiconductor wafer 1, Fig. 3, having a round portion la and a straight portion 1a<SP>1</SP>, comprises a chuck 17 for holding a workpiece, means to rotate the chuck, and a grinding head 15 comprising a plurality of resilient grinding devices 60 attached thereto, each of the devices having an oblique grinding surface facing the chuck. The machine is used to profile the edges of the wafer to the shape shown in Fig. 5 to compensate for the non-uniform growth on the edge of the wafer when an epitaxial layer is vapour-deposited over the surface of the wafer. The machine has a frame 6, Fig. 6, formed with an oil pan 7 connected by columns 9 to a panel 8. A plate 10 which performs a circular translatory movement is supported by supports 26 which are eccentrically mounted in rotatable mechanisms 20 driven by gearing 22, 42 from a motor 43. The eccentricity of the supports is variable from zero to a maximum. The plate 10 carries two rows of holding means 11 each consisting of an air or hydraulic cylinder 12 and a holder 13. The piston of the cylinder is connected to a rod 14 for movement up-anddown, the rod being prevented from rotating. The lower end of each rod is connected to a respective grinding device 15, each device consisting of a plurality of resilient strips 60, Fig. 13, for example, stainless steel. The strips are secured by screws 64 to a head 57 on the rod 14 and are bent outwardly at their lower ends 62. The ends 62 have a curved cross-section with electro-deposited abrasive on their lower surfaces. The degree of resiliency of the strips can be varied by vertical adjustment of a ring 65. Grinding fluid is supplied to the strips through a connector 71 and tube 58. Each grinding head is disposed above a vacuum chuck for holding a wafer 1, each chuck having a head 17 provided with a number of concentric grooves 17A, Fig. 12, and radial grooves in its upper surface connected by holes 17c and a chamber 17b. The head is carried at the upper end of a hollow shaft 47 which communicates with the chamber 17b and with a fiting 55 connected to a vacuum line. The shafts 47 of the vacuum chucks are mounted in bearings 45 in the oil pan 7 and rotated by gearing 49, 53. The wafers are loaded into the machine on a magazine 73 when the rods 14 are raised, the magazine having a plurality of recessed apertures for positioning the wafers 1 above the vacuum chuck when the magazine is supported on hydraulically-operated elevators 19 which can be lowered so that the magazine is lowered leaving the wafers on the chucks so as to be held thereon by the vacuum. The wafers are rotated by the chucks, and the plate 10, and hence the grinding devices 15, moved with a circular translatory movement by the mechanism 20 so that the abrasive coated strips 62 form the desired profile on the edges of the wafers 1.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP45115467A JPS504544B1 (en) | 1970-12-21 | 1970-12-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1374617A true GB1374617A (en) | 1974-11-20 |
Family
ID=14663247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5937471A Expired GB1374617A (en) | 1970-12-21 | 1971-12-21 | Grinding machine and method and semiconductor formed thereby |
Country Status (4)
Country | Link |
---|---|
US (1) | US3834083A (en) |
JP (1) | JPS504544B1 (en) |
CA (1) | CA955061A (en) |
GB (1) | GB1374617A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113400131A (en) * | 2021-05-28 | 2021-09-17 | 力成科技(苏州)有限公司 | Edge cutting device for improving edge fragmentation of wafer |
CN113842729A (en) * | 2021-09-24 | 2021-12-28 | 南京利卡维智能科技有限公司 | Vacuum pumping mechanism for multi-shaft grinding machine and vacuum grinding method thereof |
CN114871934A (en) * | 2022-07-05 | 2022-08-09 | 靖江市苏伦工程机械有限公司 | Automatic dislocation-preventing grinding and polishing device for intelligent pin shaft production line |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55112946A (en) * | 1979-02-21 | 1980-09-01 | Matsushita Electric Ind Co Ltd | Controlling device of air flow in air conditioner |
JPS56105638A (en) * | 1980-01-26 | 1981-08-22 | Sumitomo Electric Ind Ltd | Manufacture of circular gallium arsenide wafer |
US5094037A (en) * | 1989-10-03 | 1992-03-10 | Speedfam Company, Ltd. | Edge polisher |
US5154022A (en) * | 1991-06-21 | 1992-10-13 | International Business Machines Corporation | High precision micromachining of very fine features |
JP2827885B2 (en) * | 1994-02-12 | 1998-11-25 | 信越半導体株式会社 | Semiconductor single crystal substrate and method of manufacturing the same |
US5952050A (en) * | 1996-02-27 | 1999-09-14 | Micron Technology, Inc. | Chemical dispensing system for semiconductor wafer processing |
US6860795B2 (en) * | 2001-09-17 | 2005-03-01 | Hitachi Global Storage Technologies Netherlands B.V. | Edge finishing process for glass or ceramic disks used in disk drive data storage devices |
JP4162892B2 (en) * | 2002-01-11 | 2008-10-08 | 日鉱金属株式会社 | Semiconductor wafer and manufacturing method thereof |
CN1509495A (en) * | 2002-03-14 | 2004-06-30 | ������������ʽ���� | Method for grinding rear surface of semiconductor wafer |
KR100898793B1 (en) * | 2005-12-29 | 2009-05-20 | 엘지디스플레이 주식회사 | Substrates bonding device for manufacturing of liquid crystal display |
CN111347061B (en) * | 2018-12-24 | 2021-03-30 | 有研半导体材料有限公司 | Process method for processing silicon ring |
CN113579891B (en) * | 2021-06-23 | 2022-06-07 | 福安市中虹机电技术开发有限公司 | Wafer stacking and polishing device and stacking and polishing method thereof |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1246191A (en) * | 1916-10-05 | 1917-11-13 | Dodge Brothers | Cylinder-lapping machine. |
US1634952A (en) * | 1924-08-07 | 1927-07-05 | American Optical Corp | Surfacing-machine spindle attachment |
US2074177A (en) * | 1935-04-15 | 1937-03-16 | Joseph P Graul | Abrading tool |
US2612729A (en) * | 1948-10-09 | 1952-10-07 | Walley John | Towing clayware |
US2637953A (en) * | 1950-04-17 | 1953-05-12 | Ammco Tools Inc | Cylinder surfacing tool |
US3146552A (en) * | 1961-02-14 | 1964-09-01 | Service Eng Ltd | Ceramic ware towing device |
US3065579A (en) * | 1961-08-10 | 1962-11-27 | Clark Feather Mfg Co | Cylinder honing tool |
-
1970
- 1970-12-21 JP JP45115467A patent/JPS504544B1/ja active Pending
-
1971
- 1971-12-20 CA CA130,538A patent/CA955061A/en not_active Expired
- 1971-12-21 US US00210569A patent/US3834083A/en not_active Expired - Lifetime
- 1971-12-21 GB GB5937471A patent/GB1374617A/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113400131A (en) * | 2021-05-28 | 2021-09-17 | 力成科技(苏州)有限公司 | Edge cutting device for improving edge fragmentation of wafer |
CN113842729A (en) * | 2021-09-24 | 2021-12-28 | 南京利卡维智能科技有限公司 | Vacuum pumping mechanism for multi-shaft grinding machine and vacuum grinding method thereof |
CN113842729B (en) * | 2021-09-24 | 2022-11-25 | 南京利卡维智能科技有限公司 | Vacuum pumping mechanism for multi-shaft grinding machine and vacuum grinding method thereof |
CN114871934A (en) * | 2022-07-05 | 2022-08-09 | 靖江市苏伦工程机械有限公司 | Automatic dislocation-preventing grinding and polishing device for intelligent pin shaft production line |
CN114871934B (en) * | 2022-07-05 | 2022-10-25 | 靖江市苏伦工程机械有限公司 | Automatic dislocation-preventing grinding and polishing device for intelligent pin shaft production line |
Also Published As
Publication number | Publication date |
---|---|
US3834083A (en) | 1974-09-10 |
JPS504544B1 (en) | 1975-02-20 |
CA955061A (en) | 1974-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |