GB1366608A - Target mounting device for sequential sputtering - Google Patents

Target mounting device for sequential sputtering

Info

Publication number
GB1366608A
GB1366608A GB5253172A GB5253172A GB1366608A GB 1366608 A GB1366608 A GB 1366608A GB 5253172 A GB5253172 A GB 5253172A GB 5253172 A GB5253172 A GB 5253172A GB 1366608 A GB1366608 A GB 1366608A
Authority
GB
United Kingdom
Prior art keywords
targets
target
substrates
mounting device
target mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5253172A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Materials Research Corp
Original Assignee
Materials Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US00189156A priority Critical patent/US3756939A/en
Application filed by Materials Research Corp filed Critical Materials Research Corp
Priority to GB5253172A priority patent/GB1366608A/en
Publication of GB1366608A publication Critical patent/GB1366608A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

1366608 Sputtering apparatus MATERIALS RESEARCH CORP 14 Nov 1972 52531/72 Heading C7F Several sputtering targets 6 are mounted on a turret 2 which is rotated by a tubular shaft 4 and handles 14 to align a target with substrates 29 supported on an insulated or grounded support 28, R.F. or D.C. is supplied to the targets through brushes 34, commutator 16, and hollow conductors 30, which also supply coolant. The targets may be cleaned by presputtering whilst facing the grounded surfaces of the chamber. Each target has a dark space shield 11. The substrates may be given a D.C. or R. F. bias to scrub their surfaces with argon ions. (For Figure see next page)
GB5253172A 1971-10-14 1972-11-14 Target mounting device for sequential sputtering Expired GB1366608A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US00189156A US3756939A (en) 1971-10-14 1971-10-14 Target mounting device for sequential sputtering
GB5253172A GB1366608A (en) 1972-11-14 1972-11-14 Target mounting device for sequential sputtering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5253172A GB1366608A (en) 1972-11-14 1972-11-14 Target mounting device for sequential sputtering

Publications (1)

Publication Number Publication Date
GB1366608A true GB1366608A (en) 1974-09-11

Family

ID=32188958

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5253172A Expired GB1366608A (en) 1971-10-14 1972-11-14 Target mounting device for sequential sputtering

Country Status (1)

Country Link
GB (1) GB1366608A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0537011A1 (en) * 1991-10-11 1993-04-14 The BOC Group plc Sputtering apparatus
US6113752A (en) * 1998-07-07 2000-09-05 Techno-Coat Oberflachentechnik Gmbh Method and device for coating substrate
EP1775353A1 (en) * 2005-09-15 2007-04-18 Applied Materials GmbH & Co. KG Coating apparatus and method for operating a coating apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0537011A1 (en) * 1991-10-11 1993-04-14 The BOC Group plc Sputtering apparatus
US5384021A (en) * 1991-10-11 1995-01-24 The Boc Group Plc Sputtering apparatus
US6113752A (en) * 1998-07-07 2000-09-05 Techno-Coat Oberflachentechnik Gmbh Method and device for coating substrate
EP1775353A1 (en) * 2005-09-15 2007-04-18 Applied Materials GmbH & Co. KG Coating apparatus and method for operating a coating apparatus

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee