GB1335053A - Die suitable for use in a method of applying a layer of tin or tin alloy to a copper or copper alloy wire by hot dipping and such a method using the die - Google Patents

Die suitable for use in a method of applying a layer of tin or tin alloy to a copper or copper alloy wire by hot dipping and such a method using the die

Info

Publication number
GB1335053A
GB1335053A GB5397470A GB5397470A GB1335053A GB 1335053 A GB1335053 A GB 1335053A GB 5397470 A GB5397470 A GB 5397470A GB 5397470 A GB5397470 A GB 5397470A GB 1335053 A GB1335053 A GB 1335053A
Authority
GB
United Kingdom
Prior art keywords
die
tin
copper
hot dipping
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5397470A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1335053A publication Critical patent/GB1335053A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/22—Removing excess of molten coatings; Controlling or regulating the coating thickness by rubbing, e.g. using knives, e.g. rubbing solids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

1335053 Coating a copper wire with tin by hot dipping SIEMENS AG 12 Nov 1970 [13 Nov 1969(4)] 53974/70 Heading C7F A Cu or Cu alloy wire which is coated with Sn or Sn alloy by hot dipping is passed through a die of e.g. diamond, ruby or stainless steel having recesses around its inner surface, these being between 3 and 15 recesses per m.m. of the circumference of the die. The die may be between 20 and 120 cm above the bath, and it may be heated, e.g. electrically, to 180 to 220‹C.
GB5397470A 1969-11-13 1970-11-12 Die suitable for use in a method of applying a layer of tin or tin alloy to a copper or copper alloy wire by hot dipping and such a method using the die Expired GB1335053A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1957031A DE1957031C3 (en) 1969-11-13 1969-11-13 Device for producing tin or tin alloy layers on wire made of copper or copper alloys by hot-dip tinning

Publications (1)

Publication Number Publication Date
GB1335053A true GB1335053A (en) 1973-10-24

Family

ID=5750956

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5397470A Expired GB1335053A (en) 1969-11-13 1970-11-12 Die suitable for use in a method of applying a layer of tin or tin alloy to a copper or copper alloy wire by hot dipping and such a method using the die

Country Status (9)

Country Link
US (1) US3692578A (en)
CA (1) CA935636A (en)
CH (1) CH570465A5 (en)
DE (1) DE1957031C3 (en)
ES (1) ES385491A1 (en)
FR (1) FR2069304A5 (en)
GB (1) GB1335053A (en)
SE (1) SE359320B (en)
ZA (1) ZA707658B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2842201C2 (en) * 1978-09-28 1981-12-03 Felten & Guilleaume Carlswerk AG, 5000 Köln Device for manufacturing tinned copper wires
US5472739A (en) * 1990-09-20 1995-12-05 Totoku Electric Co., Ltd. Process of producing a hot dipped wire from a base wire, with the absence of iron-based, iron oxide-based and iron hydroxide-based minute particles on surfaces of the base wire
US5472740A (en) * 1990-10-11 1995-12-05 Totoku Electric Co., Ltd. Process of producing a hot dipped wire from a base wire, with the absence of iron-based, iron oxide-based and iron hydroxide-based minute particles on surfaces of the base wire
ITMI20022672A1 (en) * 2002-12-18 2004-06-19 Paolo Agostinelli ELECTRIC CONDUCTORS.
DE102006057178A1 (en) * 2006-12-03 2008-06-05 Waldemar Hoening Ohg network
JP5221231B2 (en) * 2008-07-18 2013-06-26 日立電線株式会社 Method for producing solar cell lead wire
CN112126879B (en) * 2020-09-24 2022-12-02 鹰潭市众鑫成铜业有限公司 Tinning method of copper wire
CN113235034B (en) * 2021-05-18 2022-07-26 江西富鸿金属有限公司 Tinning stack of copper line processing usefulness

Also Published As

Publication number Publication date
ES385491A1 (en) 1975-09-16
US3692578A (en) 1972-09-19
SE359320B (en) 1973-08-27
FR2069304A5 (en) 1971-09-03
CH570465A5 (en) 1975-12-15
ZA707658B (en) 1971-10-27
DE1957031B2 (en) 1974-01-31
CA935636A (en) 1973-10-23
DE1957031A1 (en) 1971-05-19
DE1957031C3 (en) 1974-09-05

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee