GB1301285A - - Google Patents
Info
- Publication number
- GB1301285A GB1301285A GB1301285DA GB1301285A GB 1301285 A GB1301285 A GB 1301285A GB 1301285D A GB1301285D A GB 1301285DA GB 1301285 A GB1301285 A GB 1301285A
- Authority
- GB
- United Kingdom
- Prior art keywords
- wafers
- plenum chamber
- conveyer
- grooves
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 abstract 11
- 239000011248 coating agent Substances 0.000 abstract 3
- 238000000576 coating method Methods 0.000 abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 238000005188 flotation Methods 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 230000004048 modification Effects 0.000 abstract 1
- 238000012986 modification Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
- H01L21/6779—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Feeding Of Workpieces (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Formation Of Insulating Films (AREA)
- Silicon Compounds (AREA)
Abstract
1301285 Pneumatic conveyers; feeding silicon wafers INDUSTRIAL MODULAR SYSTEMS CORP 25 Nov 1969 [26 Nov 1968] 57672/69 Headings B8A and B8S [Also in Division B2] Silicon wafers w to be treated at a coating station (see Division B2) are conveyed one by one from a supply magazine 1 to a centering unit by means of a pneumatic flotation conveyer 2. The conveyer comprises a plate 56 formed with slots 58, which communicate through openings 62 with a plenum chamber 61 and in which are located T-section nozzle bars 68, Fig. 6, forming ducts 71 connected to the plenum chamber. The side faces of the nozzle bars 68 are formed with arcuate, converging grooves 73, Fig. 1, to impart horizontal movement to the wafers supported by the air passing therethrough. The grooves 73 may be so formed that the air jets passing therethrough are also inclined inwardly. In a modification, Figs. 17-19 (not shown), the duct 71 at one side of a nozzle bar is connected to one plenum chamber and the grooves 73 are inclined in one longitudinal direction whereas the duct at the other side of the bat is connected to a second plenum chamber and the grooves 73 at the other side are inclined in the opposite direction, whereby the wafers may be conveyed in either direction depending upon which plenum chamber is connected to the air supply. The wafers pass from the conveyer on to the centering unit which consists of a plate 76, Fig. 4, formed with a concave upper surface 75 and with apertures 83 communicating with a plenum chamber connected to a pulsating source of compressed air. When the wafer w reaches a position where its centre is located over the centre 77 of the plate 76, a tube 96, connected to a suction source, is raised through an aperture in the centre of the plate 76, thereby raising the centred wafer which is then transferred by a suction transfer arm Figs. 9-16 (not shown), to the coating station. The supply magazine 1 comprises a substantially U-shaped housing 11 formed with a series of vertically-spaced lips 13 for supporting individual wafers w. The magazine is releasably locked to a support which is stepped downwardly by an electrically-driven screw and nut mechanism, Fig. 3 (not shown), to place the wafers on the conveyer 2. The wafers are fed by a further flotation conveyer from the coating station to a further magazine which is stepped upwardly as each wafer is received.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US77903368A | 1968-11-26 | 1968-11-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1301285A true GB1301285A (en) | 1972-12-29 |
Family
ID=25115107
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1301285D Expired GB1301285A (en) | 1968-11-26 | 1969-11-25 | |
GB1301286D Expired GB1301286A (en) | 1968-11-26 | 1969-11-25 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1301286D Expired GB1301286A (en) | 1968-11-26 | 1969-11-25 |
Country Status (4)
Country | Link |
---|---|
US (1) | US3645581A (en) |
JP (1) | JPS549027B1 (en) |
DE (1) | DE1959093C2 (en) |
GB (2) | GB1301285A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2276150A (en) * | 1993-03-16 | 1994-09-21 | Heidelberger Druckmasch Ag | Sheet guiding in printing press |
CN113490885A (en) * | 2019-02-25 | 2021-10-08 | 应用材料公司 | Thermally stable dynamic cooling control for lithography systems |
Families Citing this family (81)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6076652A (en) | 1971-04-16 | 2000-06-20 | Texas Instruments Incorporated | Assembly line system and apparatus controlling transfer of a workpiece |
US3731823A (en) * | 1971-06-01 | 1973-05-08 | Ibm | Wafer transport system |
US3930684A (en) * | 1971-06-22 | 1976-01-06 | Lasch Jr Cecil A | Automatic wafer feeding and pre-alignment apparatus and method |
US3947236A (en) * | 1971-11-29 | 1976-03-30 | Lasch Jr Cecil A | Fluid bearing transfer and heat treating apparatus and method |
US3730595A (en) * | 1971-11-30 | 1973-05-01 | Ibm | Linear carrier sender and receiver |
US3822025A (en) * | 1973-03-16 | 1974-07-02 | Gerber Scientific Instr Co | Pressurized gas selector mechanism |
JPS501639A (en) * | 1973-05-07 | 1975-01-09 | ||
US3823836A (en) * | 1973-05-22 | 1974-07-16 | Plat General Inc | Vacuum apparatus for handling sheets |
JPS5013948U (en) * | 1973-06-01 | 1975-02-13 | ||
JPS5013949U (en) * | 1973-06-01 | 1975-02-13 | ||
US3982979A (en) * | 1973-06-28 | 1976-09-28 | Western Electric Company, Inc. | Methods for mounting an article on an adherent site on a substrate |
US3948564A (en) * | 1974-01-17 | 1976-04-06 | Gca Corporation | Fluid bearing apparatus and method utilizing selective turntable diverter structure |
US3923342A (en) * | 1974-06-10 | 1975-12-02 | Motorola Inc | Apparatus and method for handling frangible objects |
GB1513444A (en) * | 1974-09-06 | 1978-06-07 | Chemical Reactor Equip As | Pick-up devices for lifting and moving semiconductor wafers |
US3960277A (en) * | 1974-09-30 | 1976-06-01 | Flint Alan G | Mask plate handling apparatus |
US4047627A (en) * | 1974-09-30 | 1977-09-13 | Gca Corporation | Mask plate handling method |
US4009785A (en) * | 1974-10-02 | 1977-03-01 | Motorola, Inc. | Fixture and system for handling plate like objects |
US4030622A (en) * | 1975-05-23 | 1977-06-21 | Pass-Port Systems, Inc. | Wafer transport system |
US4014576A (en) * | 1975-06-19 | 1977-03-29 | International Business Machines Corporation | Article carrier |
US4024944A (en) * | 1975-12-24 | 1977-05-24 | Texas Instruments Incorporated | Semiconductor slice prealignment system |
US4062463A (en) * | 1976-05-11 | 1977-12-13 | Machine Technology, Inc. | Automated single cassette load mechanism for scrubber |
US4278366A (en) * | 1977-03-18 | 1981-07-14 | Gca Corporation | Automatic wafer processing system and method |
US4315705A (en) * | 1977-03-18 | 1982-02-16 | Gca Corporation | Apparatus for handling and treating wafers |
US4178113A (en) * | 1977-12-05 | 1979-12-11 | Macronetics, Inc. | Buffer storage apparatus for semiconductor wafer processing |
US4190015A (en) * | 1977-12-08 | 1980-02-26 | Machine Technology, Inc. | Apparatus for dispensing liquid to spinning workpieces |
US4236851A (en) * | 1978-01-05 | 1980-12-02 | Kasper Instruments, Inc. | Disc handling system and method |
US4313266A (en) * | 1980-05-01 | 1982-02-02 | The Silicon Valley Group, Inc. | Method and apparatus for drying wafers |
US4495399A (en) * | 1981-03-26 | 1985-01-22 | Cann Gordon L | Micro-arc milling of metallic and non-metallic substrates |
US4600471A (en) * | 1981-08-26 | 1986-07-15 | Integrated Automation, Limited | Method and apparatus for transport and processing of substrate with developing agent |
US4392915A (en) * | 1982-02-16 | 1983-07-12 | Eaton Corporation | Wafer support system |
US4462796A (en) * | 1982-05-19 | 1984-07-31 | Micro Component Technology, Inc. | Integrated circuit component handler movement and heating system |
US4983093A (en) * | 1982-05-24 | 1991-01-08 | Proconics International, Inc. | Wafer transfer apparatus |
DE3219502C2 (en) * | 1982-05-25 | 1990-04-19 | Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar | Device for the automatic transport of disc-shaped objects |
NL8203318A (en) * | 1982-08-24 | 1984-03-16 | Integrated Automation | DEVICE FOR PROCESSING SUBSTRATES. |
US4554814A (en) * | 1982-10-13 | 1985-11-26 | The Minster Machine Company | Air transfer system and method for a shell press |
CA1226764A (en) * | 1982-10-13 | 1987-09-15 | Arthur L. Grow | Air transfer system for a shell press |
US4502215A (en) * | 1982-12-20 | 1985-03-05 | At&T Technologies, Inc. | Feeding articles to successive stations for treatment |
US4627264A (en) * | 1983-01-03 | 1986-12-09 | The Minster Machine Company | Cam actuated ejector for a shell press |
US4513600A (en) * | 1983-01-03 | 1985-04-30 | The Minster Machine Company | Cam actuated ejector for a shell press |
US4555630A (en) * | 1983-02-28 | 1985-11-26 | Tamarack Scientific Co., Inc. | Automatic system for exposing and handling double-sided printed circuit boards |
US4539479A (en) * | 1983-02-28 | 1985-09-03 | Sheets Ronald E | Automatic apparatus and method for exposing, registering, and handling double-sided printed circuit boards |
US4534695A (en) * | 1983-05-23 | 1985-08-13 | Eaton Corporation | Wafer transport system |
JPS6074626A (en) * | 1983-09-30 | 1985-04-26 | Fujitsu Ltd | Device for plasma treatment |
JPS59171121A (en) * | 1984-01-30 | 1984-09-27 | Hitachi Ltd | Mask handling device |
US4724621A (en) * | 1986-04-17 | 1988-02-16 | Varian Associates, Inc. | Wafer processing chuck using slanted clamping pins |
US4924890A (en) * | 1986-05-16 | 1990-05-15 | Eastman Kodak Company | Method and apparatus for cleaning semiconductor wafers |
US5040484A (en) * | 1987-05-04 | 1991-08-20 | Varian Associates, Inc. | Apparatus for retaining wafers |
US4817556A (en) * | 1987-05-04 | 1989-04-04 | Varian Associates, Inc. | Apparatus for retaining wafers |
US4862578A (en) * | 1987-08-20 | 1989-09-05 | Holcomb Gregory W | Tube magazine component feeder |
DE3732113C1 (en) * | 1987-09-24 | 1988-10-20 | Convac Gmbh | Device for inline coating of compact discs |
US4815601A (en) * | 1987-09-29 | 1989-03-28 | Fluoroware, Inc. | Carrier for flat panel displays |
US4930634A (en) * | 1987-09-29 | 1990-06-05 | Fluoroware, Inc. | Carrier for flat panel displays |
US4949848A (en) * | 1988-04-29 | 1990-08-21 | Fluoroware, Inc. | Wafer carrier |
EP0385934A1 (en) * | 1989-02-27 | 1990-09-05 | SPT AG, SPANLOSE PRODUKTIONSTECHNIK i.K. | Receiving device for coils and method for storing the same |
DE3912589A1 (en) * | 1989-04-17 | 1990-10-25 | Ekkehard Ueberreiter | DEVICE FOR TESTING ELECTRONIC COMPONENTS WITH A CHARGING STATION, A TEST STATION AND AN UNLOADING STATION FOR THE COMPONENTS |
JPH0727957B2 (en) * | 1989-10-09 | 1995-03-29 | 株式会社東芝 | Semiconductor manufacturing equipment |
US5111936A (en) * | 1990-11-30 | 1992-05-12 | Fluoroware | Wafer carrier |
DE4100526A1 (en) * | 1991-01-10 | 1992-07-16 | Wacker Chemitronic | DEVICE AND METHOD FOR AUTOMATICALLY SEPARATING STACKED DISCS |
US5271706A (en) * | 1991-10-31 | 1993-12-21 | Hkm Corporation | Self-loading paper transport system |
US5788425A (en) * | 1992-07-15 | 1998-08-04 | Imation Corp. | Flexible system for handling articles |
US5432653A (en) * | 1993-06-22 | 1995-07-11 | Minnesota Mining And Manufacturing Company | Loop-shaped pneumatic drive |
US5485325A (en) * | 1994-04-04 | 1996-01-16 | Minnesota Mining And Manufacturing Company | Magazine storage system for recording strips |
US5745946A (en) * | 1994-07-15 | 1998-05-05 | Ontrak Systems, Inc. | Substrate processing system |
US5762084A (en) * | 1994-07-15 | 1998-06-09 | Ontrak Systems, Inc. | Megasonic bath |
US5548505A (en) * | 1994-07-15 | 1996-08-20 | Oktrak Systems, Inc. | Scrubber control system |
US5692873A (en) * | 1995-03-31 | 1997-12-02 | Motorola, Inc. | Apparatus for holding a piece of semiconductor |
KR100191268B1 (en) * | 1996-06-11 | 1999-06-15 | 윤종용 | Semiconductor fabricating apparatus |
US5924154A (en) * | 1996-08-29 | 1999-07-20 | Ontrak Systems, Inc. | Brush assembly apparatus |
US6039059A (en) * | 1996-09-30 | 2000-03-21 | Verteq, Inc. | Wafer cleaning system |
DE19649488A1 (en) * | 1996-11-29 | 1997-11-06 | Schott Glaswerke | Pneumatic handling or transport system and for thin glass sheet in display manufacture |
SE509367C2 (en) * | 1997-05-16 | 1999-01-18 | Cetelab Ab | Method and apparatus for handling circuits |
US6415804B1 (en) * | 1999-12-23 | 2002-07-09 | Lam Research Corporation | Bowl for processing semiconductor wafers |
US20030115214A1 (en) * | 2001-12-17 | 2003-06-19 | Nir Essar | Medical reporting system and method |
US6860947B2 (en) | 2002-07-08 | 2005-03-01 | Dimension Bond Corporation | Apparatus for simultaneously coating and measuring parts |
US6832577B2 (en) | 2002-07-08 | 2004-12-21 | Dimension Bond Corporation | Apparatus and method for simultaneously coating and measuring parts |
WO2004004926A1 (en) * | 2002-07-08 | 2004-01-15 | Dimension Bond Corporation | Apparatus and method for simultaneously coating and measuring parts |
US6998147B2 (en) * | 2002-07-08 | 2006-02-14 | Dimension Bond Corporation | Method for simultaneously coating and measuring parts |
TWI352628B (en) * | 2006-07-21 | 2011-11-21 | Akrion Technologies Inc | Nozzle for use in the megasonic cleaning of substr |
JP4751460B2 (en) * | 2009-02-18 | 2011-08-17 | 東京エレクトロン株式会社 | Substrate transfer apparatus and substrate processing system |
CN101875036A (en) * | 2009-04-30 | 2010-11-03 | 深圳富泰宏精密工业有限公司 | Rotation device |
JP5316689B1 (en) * | 2012-10-31 | 2013-10-16 | 千住金属工業株式会社 | Positioning jig and position adjusting method |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3103388A (en) * | 1963-09-10 | High speed pneumatic conveyor | ||
US2801884A (en) * | 1955-03-31 | 1957-08-06 | Nat Machinery Co | Pneumatic elevating and handling means |
US2778691A (en) * | 1955-06-07 | 1957-01-22 | Melpar Inc | Stapling machines |
US2842923A (en) * | 1956-06-18 | 1958-07-15 | Rca Corp | Light element transport apparatus |
NL281857A (en) * | 1961-08-11 | |||
US3160443A (en) * | 1962-10-23 | 1964-12-08 | Western Electric Co | Apparatus for pneumatically conveying articles |
US3222110A (en) * | 1964-03-11 | 1965-12-07 | American Tobacco Co | Cigarette transfer apparatus |
US3318640A (en) * | 1965-04-23 | 1967-05-09 | Pitney Bowes Inc | Pneumatic sheet handling apparatus and method of making same |
-
1968
- 1968-11-26 US US779033A patent/US3645581A/en not_active Expired - Lifetime
-
1969
- 1969-11-25 DE DE1959093A patent/DE1959093C2/en not_active Expired
- 1969-11-25 GB GB1301285D patent/GB1301285A/en not_active Expired
- 1969-11-25 JP JP9459169A patent/JPS549027B1/ja active Pending
- 1969-11-25 GB GB1301286D patent/GB1301286A/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2276150A (en) * | 1993-03-16 | 1994-09-21 | Heidelberger Druckmasch Ag | Sheet guiding in printing press |
FR2702749A1 (en) * | 1993-03-16 | 1994-09-23 | Heidelberger Druckmasch Ag | Device for driving a sheet |
US5497987A (en) * | 1993-03-16 | 1996-03-12 | Heidelberger Druckmaschinen Ag | Sheet-guiding device |
GB2276150B (en) * | 1993-03-16 | 1996-07-31 | Heidelberger Druckmasch Ag | Guiding apparatus for a sheet |
CN113490885A (en) * | 2019-02-25 | 2021-10-08 | 应用材料公司 | Thermally stable dynamic cooling control for lithography systems |
CN113490885B (en) * | 2019-02-25 | 2024-04-02 | 应用材料公司 | Thermally stable dynamic cooling control for lithography systems |
Also Published As
Publication number | Publication date |
---|---|
JPS549027B1 (en) | 1979-04-20 |
GB1301286A (en) | 1972-12-29 |
DE1959093C2 (en) | 1984-02-23 |
DE1959093A1 (en) | 1970-06-11 |
US3645581A (en) | 1972-02-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |