GB1301285A - - Google Patents

Info

Publication number
GB1301285A
GB1301285A GB1301285DA GB1301285A GB 1301285 A GB1301285 A GB 1301285A GB 1301285D A GB1301285D A GB 1301285DA GB 1301285 A GB1301285 A GB 1301285A
Authority
GB
United Kingdom
Prior art keywords
wafers
plenum chamber
conveyer
grooves
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1301285A publication Critical patent/GB1301285A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/6779—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Feeding Of Workpieces (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Formation Of Insulating Films (AREA)
  • Silicon Compounds (AREA)

Abstract

1301285 Pneumatic conveyers; feeding silicon wafers INDUSTRIAL MODULAR SYSTEMS CORP 25 Nov 1969 [26 Nov 1968] 57672/69 Headings B8A and B8S [Also in Division B2] Silicon wafers w to be treated at a coating station (see Division B2) are conveyed one by one from a supply magazine 1 to a centering unit by means of a pneumatic flotation conveyer 2. The conveyer comprises a plate 56 formed with slots 58, which communicate through openings 62 with a plenum chamber 61 and in which are located T-section nozzle bars 68, Fig. 6, forming ducts 71 connected to the plenum chamber. The side faces of the nozzle bars 68 are formed with arcuate, converging grooves 73, Fig. 1, to impart horizontal movement to the wafers supported by the air passing therethrough. The grooves 73 may be so formed that the air jets passing therethrough are also inclined inwardly. In a modification, Figs. 17-19 (not shown), the duct 71 at one side of a nozzle bar is connected to one plenum chamber and the grooves 73 are inclined in one longitudinal direction whereas the duct at the other side of the bat is connected to a second plenum chamber and the grooves 73 at the other side are inclined in the opposite direction, whereby the wafers may be conveyed in either direction depending upon which plenum chamber is connected to the air supply. The wafers pass from the conveyer on to the centering unit which consists of a plate 76, Fig. 4, formed with a concave upper surface 75 and with apertures 83 communicating with a plenum chamber connected to a pulsating source of compressed air. When the wafer w reaches a position where its centre is located over the centre 77 of the plate 76, a tube 96, connected to a suction source, is raised through an aperture in the centre of the plate 76, thereby raising the centred wafer which is then transferred by a suction transfer arm Figs. 9-16 (not shown), to the coating station. The supply magazine 1 comprises a substantially U-shaped housing 11 formed with a series of vertically-spaced lips 13 for supporting individual wafers w. The magazine is releasably locked to a support which is stepped downwardly by an electrically-driven screw and nut mechanism, Fig. 3 (not shown), to place the wafers on the conveyer 2. The wafers are fed by a further flotation conveyer from the coating station to a further magazine which is stepped upwardly as each wafer is received.
GB1301285D 1968-11-26 1969-11-25 Expired GB1301285A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US77903368A 1968-11-26 1968-11-26

Publications (1)

Publication Number Publication Date
GB1301285A true GB1301285A (en) 1972-12-29

Family

ID=25115107

Family Applications (2)

Application Number Title Priority Date Filing Date
GB1301285D Expired GB1301285A (en) 1968-11-26 1969-11-25
GB1301286D Expired GB1301286A (en) 1968-11-26 1969-11-25

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB1301286D Expired GB1301286A (en) 1968-11-26 1969-11-25

Country Status (4)

Country Link
US (1) US3645581A (en)
JP (1) JPS549027B1 (en)
DE (1) DE1959093C2 (en)
GB (2) GB1301285A (en)

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GB2276150A (en) * 1993-03-16 1994-09-21 Heidelberger Druckmasch Ag Sheet guiding in printing press
CN113490885A (en) * 2019-02-25 2021-10-08 应用材料公司 Thermally stable dynamic cooling control for lithography systems

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US3947236A (en) * 1971-11-29 1976-03-30 Lasch Jr Cecil A Fluid bearing transfer and heat treating apparatus and method
US3730595A (en) * 1971-11-30 1973-05-01 Ibm Linear carrier sender and receiver
US3822025A (en) * 1973-03-16 1974-07-02 Gerber Scientific Instr Co Pressurized gas selector mechanism
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US3948564A (en) * 1974-01-17 1976-04-06 Gca Corporation Fluid bearing apparatus and method utilizing selective turntable diverter structure
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GB1513444A (en) * 1974-09-06 1978-06-07 Chemical Reactor Equip As Pick-up devices for lifting and moving semiconductor wafers
US3960277A (en) * 1974-09-30 1976-06-01 Flint Alan G Mask plate handling apparatus
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US4315705A (en) * 1977-03-18 1982-02-16 Gca Corporation Apparatus for handling and treating wafers
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US4554814A (en) * 1982-10-13 1985-11-26 The Minster Machine Company Air transfer system and method for a shell press
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US4502215A (en) * 1982-12-20 1985-03-05 At&T Technologies, Inc. Feeding articles to successive stations for treatment
US4627264A (en) * 1983-01-03 1986-12-09 The Minster Machine Company Cam actuated ejector for a shell press
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US4555630A (en) * 1983-02-28 1985-11-26 Tamarack Scientific Co., Inc. Automatic system for exposing and handling double-sided printed circuit boards
US4539479A (en) * 1983-02-28 1985-09-03 Sheets Ronald E Automatic apparatus and method for exposing, registering, and handling double-sided printed circuit boards
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JPS6074626A (en) * 1983-09-30 1985-04-26 Fujitsu Ltd Device for plasma treatment
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US4724621A (en) * 1986-04-17 1988-02-16 Varian Associates, Inc. Wafer processing chuck using slanted clamping pins
US4924890A (en) * 1986-05-16 1990-05-15 Eastman Kodak Company Method and apparatus for cleaning semiconductor wafers
US5040484A (en) * 1987-05-04 1991-08-20 Varian Associates, Inc. Apparatus for retaining wafers
US4817556A (en) * 1987-05-04 1989-04-04 Varian Associates, Inc. Apparatus for retaining wafers
US4862578A (en) * 1987-08-20 1989-09-05 Holcomb Gregory W Tube magazine component feeder
DE3732113C1 (en) * 1987-09-24 1988-10-20 Convac Gmbh Device for inline coating of compact discs
US4815601A (en) * 1987-09-29 1989-03-28 Fluoroware, Inc. Carrier for flat panel displays
US4930634A (en) * 1987-09-29 1990-06-05 Fluoroware, Inc. Carrier for flat panel displays
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EP0385934A1 (en) * 1989-02-27 1990-09-05 SPT AG, SPANLOSE PRODUKTIONSTECHNIK i.K. Receiving device for coils and method for storing the same
DE3912589A1 (en) * 1989-04-17 1990-10-25 Ekkehard Ueberreiter DEVICE FOR TESTING ELECTRONIC COMPONENTS WITH A CHARGING STATION, A TEST STATION AND AN UNLOADING STATION FOR THE COMPONENTS
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US5111936A (en) * 1990-11-30 1992-05-12 Fluoroware Wafer carrier
DE4100526A1 (en) * 1991-01-10 1992-07-16 Wacker Chemitronic DEVICE AND METHOD FOR AUTOMATICALLY SEPARATING STACKED DISCS
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US5788425A (en) * 1992-07-15 1998-08-04 Imation Corp. Flexible system for handling articles
US5432653A (en) * 1993-06-22 1995-07-11 Minnesota Mining And Manufacturing Company Loop-shaped pneumatic drive
US5485325A (en) * 1994-04-04 1996-01-16 Minnesota Mining And Manufacturing Company Magazine storage system for recording strips
US5745946A (en) * 1994-07-15 1998-05-05 Ontrak Systems, Inc. Substrate processing system
US5762084A (en) * 1994-07-15 1998-06-09 Ontrak Systems, Inc. Megasonic bath
US5548505A (en) * 1994-07-15 1996-08-20 Oktrak Systems, Inc. Scrubber control system
US5692873A (en) * 1995-03-31 1997-12-02 Motorola, Inc. Apparatus for holding a piece of semiconductor
KR100191268B1 (en) * 1996-06-11 1999-06-15 윤종용 Semiconductor fabricating apparatus
US5924154A (en) * 1996-08-29 1999-07-20 Ontrak Systems, Inc. Brush assembly apparatus
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DE19649488A1 (en) * 1996-11-29 1997-11-06 Schott Glaswerke Pneumatic handling or transport system and for thin glass sheet in display manufacture
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US6415804B1 (en) * 1999-12-23 2002-07-09 Lam Research Corporation Bowl for processing semiconductor wafers
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US6860947B2 (en) 2002-07-08 2005-03-01 Dimension Bond Corporation Apparatus for simultaneously coating and measuring parts
US6832577B2 (en) 2002-07-08 2004-12-21 Dimension Bond Corporation Apparatus and method for simultaneously coating and measuring parts
WO2004004926A1 (en) * 2002-07-08 2004-01-15 Dimension Bond Corporation Apparatus and method for simultaneously coating and measuring parts
US6998147B2 (en) * 2002-07-08 2006-02-14 Dimension Bond Corporation Method for simultaneously coating and measuring parts
TWI352628B (en) * 2006-07-21 2011-11-21 Akrion Technologies Inc Nozzle for use in the megasonic cleaning of substr
JP4751460B2 (en) * 2009-02-18 2011-08-17 東京エレクトロン株式会社 Substrate transfer apparatus and substrate processing system
CN101875036A (en) * 2009-04-30 2010-11-03 深圳富泰宏精密工业有限公司 Rotation device
JP5316689B1 (en) * 2012-10-31 2013-10-16 千住金属工業株式会社 Positioning jig and position adjusting method

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2276150A (en) * 1993-03-16 1994-09-21 Heidelberger Druckmasch Ag Sheet guiding in printing press
FR2702749A1 (en) * 1993-03-16 1994-09-23 Heidelberger Druckmasch Ag Device for driving a sheet
US5497987A (en) * 1993-03-16 1996-03-12 Heidelberger Druckmaschinen Ag Sheet-guiding device
GB2276150B (en) * 1993-03-16 1996-07-31 Heidelberger Druckmasch Ag Guiding apparatus for a sheet
CN113490885A (en) * 2019-02-25 2021-10-08 应用材料公司 Thermally stable dynamic cooling control for lithography systems
CN113490885B (en) * 2019-02-25 2024-04-02 应用材料公司 Thermally stable dynamic cooling control for lithography systems

Also Published As

Publication number Publication date
JPS549027B1 (en) 1979-04-20
GB1301286A (en) 1972-12-29
DE1959093C2 (en) 1984-02-23
DE1959093A1 (en) 1970-06-11
US3645581A (en) 1972-02-29

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee