GB1255832A - Improvements relating to the manufacture of supports for semiconductor devices - Google Patents

Improvements relating to the manufacture of supports for semiconductor devices

Info

Publication number
GB1255832A
GB1255832A GB21401/69A GB2140169A GB1255832A GB 1255832 A GB1255832 A GB 1255832A GB 21401/69 A GB21401/69 A GB 21401/69A GB 2140169 A GB2140169 A GB 2140169A GB 1255832 A GB1255832 A GB 1255832A
Authority
GB
United Kingdom
Prior art keywords
bonded
particles
gold
support
impacting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB21401/69A
Other languages
English (en)
Inventor
Sydney Jackson
Joseph Bell Titterington
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferranti International PLC
Original Assignee
Ferranti PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DENDAT7006122D priority Critical patent/DE7006122U/de
Application filed by Ferranti PLC filed Critical Ferranti PLC
Priority to GB21401/69A priority patent/GB1255832A/en
Priority to DE19702017499 priority patent/DE2017499A1/de
Priority to FR7013899A priority patent/FR2045377A5/fr
Priority to NL707006122A priority patent/NL145395B/xx
Priority to GB3672271A priority patent/GB1340538A/en
Publication of GB1255832A publication Critical patent/GB1255832A/en
Priority to DE2235352A priority patent/DE2235352A1/de
Priority to GB4646772A priority patent/GB1356879A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
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    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
GB21401/69A 1969-04-26 1969-04-26 Improvements relating to the manufacture of supports for semiconductor devices Expired GB1255832A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DENDAT7006122D DE7006122U (xx) 1969-04-26
GB21401/69A GB1255832A (en) 1969-04-26 1969-04-26 Improvements relating to the manufacture of supports for semiconductor devices
DE19702017499 DE2017499A1 (de) 1969-04-26 1970-04-11 Halbleiterträger
FR7013899A FR2045377A5 (xx) 1969-04-26 1970-04-17
NL707006122A NL145395B (nl) 1969-04-26 1970-04-27 Werkwijze voor het vervaardigen van een ondersteuning voor een halfgeleiderinrichting.
GB3672271A GB1340538A (en) 1969-04-26 1971-08-04 Improvements relating to the manufacture of electrical contact-carrying members
DE2235352A DE2235352A1 (de) 1969-04-26 1972-07-19 Verfahren zur herstellung eines traegers fuer halbleiter
GB4646772A GB1356879A (en) 1969-04-26 1972-10-09 Manufacture of supports for semiconductor devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB21401/69A GB1255832A (en) 1969-04-26 1969-04-26 Improvements relating to the manufacture of supports for semiconductor devices
GB4646772A GB1356879A (en) 1969-04-26 1972-10-09 Manufacture of supports for semiconductor devices

Publications (1)

Publication Number Publication Date
GB1255832A true GB1255832A (en) 1971-12-01

Family

ID=62527852

Family Applications (2)

Application Number Title Priority Date Filing Date
GB21401/69A Expired GB1255832A (en) 1969-04-26 1969-04-26 Improvements relating to the manufacture of supports for semiconductor devices
GB4646772A Expired GB1356879A (en) 1969-04-26 1972-10-09 Manufacture of supports for semiconductor devices

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB4646772A Expired GB1356879A (en) 1969-04-26 1972-10-09 Manufacture of supports for semiconductor devices

Country Status (4)

Country Link
DE (2) DE2017499A1 (xx)
FR (1) FR2045377A5 (xx)
GB (2) GB1255832A (xx)
NL (1) NL145395B (xx)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2486725A1 (fr) * 1980-07-09 1982-01-15 Gleizes Raymond Procede et appareil de presoudage de billes de soudure sur des pattes de connexion
NL184184C (nl) * 1981-03-20 1989-05-01 Philips Nv Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.

Also Published As

Publication number Publication date
DE7006122U (xx) 1900-01-01
NL7006122A (xx) 1970-10-28
FR2045377A5 (xx) 1971-02-26
NL145395B (nl) 1975-03-17
GB1356879A (en) 1974-06-19
DE2017499A1 (de) 1970-11-05

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