GB1239634A - - Google Patents
Info
- Publication number
- GB1239634A GB1239634A GB4680068A GB1239634DA GB1239634A GB 1239634 A GB1239634 A GB 1239634A GB 4680068 A GB4680068 A GB 4680068A GB 1239634D A GB1239634D A GB 1239634DA GB 1239634 A GB1239634 A GB 1239634A
- Authority
- GB
- United Kingdom
- Prior art keywords
- envelope
- dissipation member
- bed
- heat dissipation
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB4680068 | 1968-10-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1239634A true GB1239634A (ja) | 1971-07-21 |
Family
ID=10442647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4680068A Expired GB1239634A (ja) | 1968-10-02 | 1968-10-02 |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1239634A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0104231A1 (en) * | 1982-04-05 | 1984-04-04 | Motorola, Inc. | A self-positioning heat spreader |
GB2136205A (en) * | 1983-03-09 | 1984-09-12 | Printed Circuits Int | Semiconductor chip carrier and contact array package and method of construction |
GB2154791A (en) * | 1984-02-17 | 1985-09-11 | Ates Componenti Elettron | Packaging semiconductor devices |
EP2005470A2 (en) * | 2006-04-06 | 2008-12-24 | Freescale Semiconductor, Inc. | Lead frame based, over-molded semiconductor package with integrated through hole technology (tht) heat spreader pin(s) and associated method of manufacturing |
US11229130B2 (en) | 2018-02-09 | 2022-01-18 | Zte Corporation | Heat-insulation device and electronic product |
-
1968
- 1968-10-02 GB GB4680068A patent/GB1239634A/en not_active Expired
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0104231A1 (en) * | 1982-04-05 | 1984-04-04 | Motorola, Inc. | A self-positioning heat spreader |
EP0104231A4 (en) * | 1982-04-05 | 1985-10-30 | Motorola Inc | SELF-ALIGNING HEAT SPREADING ARRANGEMENT. |
GB2136205A (en) * | 1983-03-09 | 1984-09-12 | Printed Circuits Int | Semiconductor chip carrier and contact array package and method of construction |
US4630172A (en) * | 1983-03-09 | 1986-12-16 | Printed Circuits International | Semiconductor chip carrier package with a heat sink |
GB2154791A (en) * | 1984-02-17 | 1985-09-11 | Ates Componenti Elettron | Packaging semiconductor devices |
EP2005470A2 (en) * | 2006-04-06 | 2008-12-24 | Freescale Semiconductor, Inc. | Lead frame based, over-molded semiconductor package with integrated through hole technology (tht) heat spreader pin(s) and associated method of manufacturing |
EP2005470A4 (en) * | 2006-04-06 | 2010-12-22 | Freescale Semiconductor Inc | OVER-SHAPED SEMICONDUCTOR PACKAGE WITH PICK-UP CHASSIS, WITH INTEGRATED TECHNOLOGY THERMAL DISSIPATION PICOT (S) FOR THROUGH HOLES, AND ASSOCIATED MANUFACTURING METHOD |
US8659146B2 (en) | 2006-04-06 | 2014-02-25 | Freescale Semiconductor, Inc. | Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing |
US11229130B2 (en) | 2018-02-09 | 2022-01-18 | Zte Corporation | Heat-insulation device and electronic product |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB1158994A (en) | Header. | |
US2956214A (en) | Diode | |
US3646409A (en) | Heat-sinking package for semiconductor integrated circuit | |
US2985806A (en) | Semiconductor fabrication | |
US3629672A (en) | Semiconductor device having an improved heat sink arrangement | |
US3769560A (en) | Hermetic ceramic power package for high frequency solid state device | |
US2744308A (en) | Semi-conductor translating device and method of manufacture | |
US2866928A (en) | Electric rectifiers employing semi-conductors | |
US3296501A (en) | Metallic ceramic composite contacts for semiconductor devices | |
GB1239634A (ja) | ||
GB1132748A (en) | A semiconductor component including one or more pressure-contact junctions | |
GB862453A (en) | Improvements in or relating to semi-conductor devices | |
GB1038007A (en) | Electrical assembly | |
US3434018A (en) | Heat conductive mounting base for a semiconductor device | |
US3159775A (en) | Semiconductor device and method of manufacture | |
US3337781A (en) | Encapsulation means for a semiconductor device | |
GB1302827A (ja) | ||
US3259804A (en) | Electrical module with means for dissipating heat | |
US3327180A (en) | Mounting for semiconductors | |
GB1244023A (en) | Semiconductor arrangement | |
US2274830A (en) | Resistor and method of manufacturing the same | |
GB1215535A (en) | Improvements in and relating to headers for the envelope of a semiconductor device | |
US3027502A (en) | Semiconductor device | |
GB971703A (en) | A semiconductor device | |
US3416048A (en) | Semi-conductor construction |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |