GB1212362A - Improvements in manufacture of printed circuit boards - Google Patents
Improvements in manufacture of printed circuit boardsInfo
- Publication number
- GB1212362A GB1212362A GB5398267A GB5398267A GB1212362A GB 1212362 A GB1212362 A GB 1212362A GB 5398267 A GB5398267 A GB 5398267A GB 5398267 A GB5398267 A GB 5398267A GB 1212362 A GB1212362 A GB 1212362A
- Authority
- GB
- United Kingdom
- Prior art keywords
- catalytic
- holes
- mask
- conductors
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0236—Plating catalyst as filler in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
1,212,362. Printed circuits. PHOTO-CIRCUITS CORP. 28 Nov., 1967 [1 Dec., 1966], No. 53982/67. Heading H1R. A printed circuit having metallized holes is formed by coating exposed conductor lines on a catalytic base with a permanent insulating mask, forming holes through the mask and base and electrolessly depositing metal on the walls of the holes. In the embodiment of Fig. 10 conductors 14 are formed from a metal-clad catalytic base by a print and etch method and after removal of the etch resist 15 both sides of the base are coated with an insulating non-catalytic permanent mask 17. Holes 22 are then formed through the panel which is then subjected to an electroless plating bath to form deposit 24 on the hole walls. The insulating mask 17 may be deposited so as to leave exposed lands around the holes which are coated with metal during the subsequent electroless plating process, Fig. 12 (not shown). During the plating process the wall coating 24 grows vertically as well as horizontally over the insulating mask so that by choosing the appropriate thickness of the mask the wall coating may or may not creep to the surface of the mask to form eyelets, Figs. 13, 13A, 13B, 13C (not shown). The process shown in Fig. 10 may be extended to form multilayer circuit boards by interspersing catalytic bases in a stack of bases carrying circuit conductors, masking the exposed conductors and forming the metal-lined holes as described above, Fig. 12 (not shown). In the embodiment of Fig. 15, conductors 1202 are formed by a print and etch process on both sides of catalytic base 1000. Catalytic permanent insulating masks 1610 are then deposited over the conductors 1202 after which holes 1500 are provided and metal deposit 1501 formed by an electroless plating process. After superimposing removable insulating masks 2000 on the top and bottom surfaces of the board, the metal deposit 1501 on the hole walls is built up, 2200, by electroplating. Mask 2000 is finally stripped off. In a further embodiment, Fig. 16 (not shown), printed conductors on both sides of a catalytic base are coated with a catalytic insulating layer on which is superimposed a non-catalytic adhesive layer. Holes are formed and electrolessly plated as previously.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59844466A | 1966-12-01 | 1966-12-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1212362A true GB1212362A (en) | 1970-11-18 |
Family
ID=24395560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5398267A Expired GB1212362A (en) | 1966-12-01 | 1967-11-28 | Improvements in manufacture of printed circuit boards |
Country Status (8)
Country | Link |
---|---|
AT (1) | AT294955B (en) |
CH (1) | CH481552A (en) |
DE (1) | DE1665395B1 (en) |
DK (1) | DK142160B (en) |
ES (1) | ES347873A1 (en) |
FR (1) | FR96655E (en) |
GB (1) | GB1212362A (en) |
NL (1) | NL6716431A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2142478A (en) * | 1983-07-01 | 1985-01-16 | Welwyn Electronics Ltd | Printed circuit boards |
GB2227124A (en) * | 1988-12-09 | 1990-07-18 | Hitachi Chemical Co Ltd | Circuit board and process for producing the same |
US5218761A (en) * | 1991-04-08 | 1993-06-15 | Nec Corporation | Process for manufacturing printed wiring boards |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3121131C2 (en) * | 1981-05-27 | 1984-02-16 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Process for the production of circuit boards provided with conductor tracks with metallic vias |
CN113056117B (en) * | 2021-03-15 | 2022-07-29 | 德中(天津)技术发展股份有限公司 | Method for metalizing and electroplating hole wall only |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1144945A (en) * | 1955-03-30 | 1957-10-18 | Improvements to the synchronization of sound tracks with consecutive recording | |
DE1073197B (en) * | 1955-06-28 | 1960-01-14 |
-
1967
- 1967-11-27 AT AT1070567A patent/AT294955B/en not_active IP Right Cessation
- 1967-11-28 GB GB5398267A patent/GB1212362A/en not_active Expired
- 1967-11-28 CH CH1666767A patent/CH481552A/en not_active IP Right Cessation
- 1967-11-29 DE DE19671665395 patent/DE1665395B1/en active Pending
- 1967-11-30 DK DK599467A patent/DK142160B/en unknown
- 1967-12-01 FR FR130620A patent/FR96655E/en not_active Expired
- 1967-12-01 NL NL6716431A patent/NL6716431A/xx not_active Application Discontinuation
- 1967-12-01 ES ES347873A patent/ES347873A1/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2142478A (en) * | 1983-07-01 | 1985-01-16 | Welwyn Electronics Ltd | Printed circuit boards |
GB2227124A (en) * | 1988-12-09 | 1990-07-18 | Hitachi Chemical Co Ltd | Circuit board and process for producing the same |
GB2227124B (en) * | 1988-12-09 | 1993-05-26 | Hitachi Chemical Co Ltd | Wiring board and process for producing the same |
US5243144A (en) * | 1988-12-09 | 1993-09-07 | Hitachi Chemical Company, Ltd. | Wiring board and process for producing the same |
US5218761A (en) * | 1991-04-08 | 1993-06-15 | Nec Corporation | Process for manufacturing printed wiring boards |
Also Published As
Publication number | Publication date |
---|---|
AT294955B (en) | 1971-12-10 |
CH481552A (en) | 1969-11-15 |
ES347873A1 (en) | 1969-02-16 |
FR96655E (en) | 1976-06-04 |
DE1665395B1 (en) | 1971-03-04 |
DK142160B (en) | 1980-09-08 |
DK142160C (en) | 1981-02-02 |
NL6716431A (en) | 1968-06-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |