GB1204795A - Improvements in packaging circuitry - Google Patents

Improvements in packaging circuitry

Info

Publication number
GB1204795A
GB1204795A GB1539968A GB1539968A GB1204795A GB 1204795 A GB1204795 A GB 1204795A GB 1539968 A GB1539968 A GB 1539968A GB 1539968 A GB1539968 A GB 1539968A GB 1204795 A GB1204795 A GB 1204795A
Authority
GB
United Kingdom
Prior art keywords
strip
former
packs
conductors
wound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1539968A
Inventor
John Gordon Dixon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MUIRHEAD Ltd
Original Assignee
MUIRHEAD Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MUIRHEAD Ltd filed Critical MUIRHEAD Ltd
Priority to GB1539968A priority Critical patent/GB1204795A/en
Priority to FR1601945D priority patent/FR1601945A/fr
Priority to NL6902519A priority patent/NL6902519A/xx
Priority to DE19691908445 priority patent/DE1908445A1/en
Publication of GB1204795A publication Critical patent/GB1204795A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/051—Rolled
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing

Abstract

1,204,795. Circuit assemblies. MUIRHEAD Ltd. 20 Dec., 1968 [29 March, 1968], No. 15399/68. Heading H1R. A circuit assembly comprises a can into which is fitted a rolled flexible printed circuit on which electrical component packs are mounted. A strip of insulating material carrying on both sides printed conductors is wound around a former and packs are soldered to the conductors on one of the faces, Fig. 1 (not shown). The sheet is then wound into a scroll, Fig. 2, and placed in a metal can 8 and potted. Connecting wires 7 are connected where desired before potting. In an alternative arrangement the packs are attached to the insulating strip as it is wound stage by stage around a cylindrical former and the former placed on a can with the scroll on it or the former can be removed. The components are provided with curved leads which are in an unstressed condition by being shaped to follow the curvature of the strip in its rolled form before being attached to the connection points on the conductors of the strip.
GB1539968A 1968-03-29 1968-03-29 Improvements in packaging circuitry Expired GB1204795A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB1539968A GB1204795A (en) 1968-03-29 1968-03-29 Improvements in packaging circuitry
FR1601945D FR1601945A (en) 1968-03-29 1968-12-31
NL6902519A NL6902519A (en) 1968-03-29 1969-02-18
DE19691908445 DE1908445A1 (en) 1968-03-29 1969-02-20 Circuit arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1539968A GB1204795A (en) 1968-03-29 1968-03-29 Improvements in packaging circuitry

Publications (1)

Publication Number Publication Date
GB1204795A true GB1204795A (en) 1970-09-09

Family

ID=10058470

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1539968A Expired GB1204795A (en) 1968-03-29 1968-03-29 Improvements in packaging circuitry

Country Status (4)

Country Link
DE (1) DE1908445A1 (en)
FR (1) FR1601945A (en)
GB (1) GB1204795A (en)
NL (1) NL6902519A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3905657A1 (en) * 1989-02-24 1990-08-30 Telefunken Electronic Gmbh Flexible supporting film
EP0801815A1 (en) * 1995-01-06 1997-10-22 Metatech Corporation Electrical circuit suspension system

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3766439A (en) * 1972-01-12 1973-10-16 Gen Electric Electronic module using flexible printed circuit board with heat sink means
US3830979A (en) * 1973-05-02 1974-08-20 Tone Commander Syst Inc Telephone handset amplifier
DE8703172U1 (en) * 1987-03-02 1987-06-11 Franz Kirsten Elektrotechnische Spezialfabrik, 6530 Bingen, De

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3905657A1 (en) * 1989-02-24 1990-08-30 Telefunken Electronic Gmbh Flexible supporting film
EP0801815A1 (en) * 1995-01-06 1997-10-22 Metatech Corporation Electrical circuit suspension system
EP0801815A4 (en) * 1995-01-06 1998-08-19 Metatech Corp Electrical circuit suspension system
US6613979B1 (en) 1995-01-06 2003-09-02 Quell Corporation Electrical circuit suspension system

Also Published As

Publication number Publication date
FR1601945A (en) 1970-09-21
NL6902519A (en) 1969-10-01
DE1908445A1 (en) 1969-11-13

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees