GB1197664A - Semiconductor Devices. - Google Patents
Semiconductor Devices.Info
- Publication number
- GB1197664A GB1197664A GB2285268A GB2285268A GB1197664A GB 1197664 A GB1197664 A GB 1197664A GB 2285268 A GB2285268 A GB 2285268A GB 2285268 A GB2285268 A GB 2285268A GB 1197664 A GB1197664 A GB 1197664A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrode
- bonded
- housing
- semi
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Abstract
1,197,664. Semi-conductor devices. WESTINGHOUSE BRAKE ENGLISH ELECTRIC SEMI-CONDUCTORS Ltd. 24 April, 1969 [14 May, 1968], No. 22852/68. Heading H1K One electrode 8 is held in contact with the surface 2. of a semi-conductor element 1 by resilient means, such as Belleville washers 17, acting between a shoulder 18 of a housing 11 enclosing the element, and an insulating body 19. The body 19 is urged directly on to the electrode 8, and is provided in its lower face with a recess which serves to locate the electrode 8 laterally relative to the element 1. The body 19 is itself located laterally by being a close fit within the walls of the housing. An aperture through the body 19 accommodates leads 9, 5 respectively from the electrode 8 and from a second electrode 4 bonded to the surface 2. As shown, the non-bonded pressurized electrode 8 is annular, but it may instead comprise the central electrode, the outer one then being either bonded or non- bonded. Alternatively, the two electrodes may be disposed side by side. In the embodiment the electrode 8 is of Au-plated Mo and the body 19 is moulded from glass which binds together fine mica particles. An Ag disc 13 lies between the element 1 and the base 12 of the housing to provide a further non-bonded contact.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2285268A GB1197664A (en) | 1968-05-14 | 1968-05-14 | Semiconductor Devices. |
DE19691921310 DE1921310A1 (en) | 1968-05-14 | 1969-04-26 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2285268A GB1197664A (en) | 1968-05-14 | 1968-05-14 | Semiconductor Devices. |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1197664A true GB1197664A (en) | 1970-07-08 |
Family
ID=10186082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2285268A Expired GB1197664A (en) | 1968-05-14 | 1968-05-14 | Semiconductor Devices. |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE1921310A1 (en) |
GB (1) | GB1197664A (en) |
-
1968
- 1968-05-14 GB GB2285268A patent/GB1197664A/en not_active Expired
-
1969
- 1969-04-26 DE DE19691921310 patent/DE1921310A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
DE1921310A1 (en) | 1969-12-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |