GB1197664A - Semiconductor Devices. - Google Patents

Semiconductor Devices.

Info

Publication number
GB1197664A
GB1197664A GB2285268A GB2285268A GB1197664A GB 1197664 A GB1197664 A GB 1197664A GB 2285268 A GB2285268 A GB 2285268A GB 2285268 A GB2285268 A GB 2285268A GB 1197664 A GB1197664 A GB 1197664A
Authority
GB
United Kingdom
Prior art keywords
electrode
bonded
housing
semi
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2285268A
Inventor
Roger Fillmore Calmead Bennett
Anthony Peter Clelford
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Brake English Electric Semi Conductors Ltd
Siemens Mobility Ltd
Original Assignee
Westinghouse Brake English Electric Semi Conductors Ltd
Westinghouse Brake and Signal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake English Electric Semi Conductors Ltd, Westinghouse Brake and Signal Co Ltd filed Critical Westinghouse Brake English Electric Semi Conductors Ltd
Priority to GB2285268A priority Critical patent/GB1197664A/en
Priority to DE19691921310 priority patent/DE1921310A1/en
Publication of GB1197664A publication Critical patent/GB1197664A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

1,197,664. Semi-conductor devices. WESTINGHOUSE BRAKE ENGLISH ELECTRIC SEMI-CONDUCTORS Ltd. 24 April, 1969 [14 May, 1968], No. 22852/68. Heading H1K One electrode 8 is held in contact with the surface 2. of a semi-conductor element 1 by resilient means, such as Belleville washers 17, acting between a shoulder 18 of a housing 11 enclosing the element, and an insulating body 19. The body 19 is urged directly on to the electrode 8, and is provided in its lower face with a recess which serves to locate the electrode 8 laterally relative to the element 1. The body 19 is itself located laterally by being a close fit within the walls of the housing. An aperture through the body 19 accommodates leads 9, 5 respectively from the electrode 8 and from a second electrode 4 bonded to the surface 2. As shown, the non-bonded pressurized electrode 8 is annular, but it may instead comprise the central electrode, the outer one then being either bonded or non- bonded. Alternatively, the two electrodes may be disposed side by side. In the embodiment the electrode 8 is of Au-plated Mo and the body 19 is moulded from glass which binds together fine mica particles. An Ag disc 13 lies between the element 1 and the base 12 of the housing to provide a further non-bonded contact.
GB2285268A 1968-05-14 1968-05-14 Semiconductor Devices. Expired GB1197664A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB2285268A GB1197664A (en) 1968-05-14 1968-05-14 Semiconductor Devices.
DE19691921310 DE1921310A1 (en) 1968-05-14 1969-04-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2285268A GB1197664A (en) 1968-05-14 1968-05-14 Semiconductor Devices.

Publications (1)

Publication Number Publication Date
GB1197664A true GB1197664A (en) 1970-07-08

Family

ID=10186082

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2285268A Expired GB1197664A (en) 1968-05-14 1968-05-14 Semiconductor Devices.

Country Status (2)

Country Link
DE (1) DE1921310A1 (en)
GB (1) GB1197664A (en)

Also Published As

Publication number Publication date
DE1921310A1 (en) 1969-12-04

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees