GB1138976A - Encapsulating epoxy resins - Google Patents
Encapsulating epoxy resinsInfo
- Publication number
- GB1138976A GB1138976A GB2064966A GB2064966A GB1138976A GB 1138976 A GB1138976 A GB 1138976A GB 2064966 A GB2064966 A GB 2064966A GB 2064966 A GB2064966 A GB 2064966A GB 1138976 A GB1138976 A GB 1138976A
- Authority
- GB
- United Kingdom
- Prior art keywords
- parts
- epoxy resin
- epoxy resins
- encapsulating epoxy
- molecular sieve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/307—Other macromolecular compounds
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
1,138,976. Epoxy resin compositions. STANDARD TELEPHONES & CABLES Ltd. 10 May, 1966, No. 20649/66. Heading C3B. [Also in Division H1] An epoxy resin composition comprises chlorinated diphenyl and a molecular sieve for absorption of moisture. The composition suitable for encapsulating electrical components may contain 105 parts by wt. of epoxy resin; 7-32 parts by wt. of chlorinated biphenyl and 3-45 parts by wt. a molecular sieve having a pore size 3-10 Š. Conventional hardeners may be present.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2064966A GB1138976A (en) | 1966-05-10 | 1966-05-10 | Encapsulating epoxy resins |
CH655467A CH493916A (en) | 1966-05-10 | 1967-05-09 | Detachable air-tight locks of plastics material for |
FR105915A FR1522193A (en) | 1966-05-10 | 1967-05-10 | Improvements to epoxy resins for the manufacture of electrical components |
BE698252D BE698252A (en) | 1966-05-10 | 1967-05-10 | |
NL6706510A NL6706510A (en) | 1966-05-10 | 1967-05-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2064966A GB1138976A (en) | 1966-05-10 | 1966-05-10 | Encapsulating epoxy resins |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1138976A true GB1138976A (en) | 1969-01-01 |
Family
ID=10149396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2064966A Expired GB1138976A (en) | 1966-05-10 | 1966-05-10 | Encapsulating epoxy resins |
Country Status (4)
Country | Link |
---|---|
BE (1) | BE698252A (en) |
CH (1) | CH493916A (en) |
GB (1) | GB1138976A (en) |
NL (1) | NL6706510A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2125219A (en) * | 1982-08-12 | 1984-02-29 | Mfd Capacitors Limited | Moisture removal within capacitors |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2117794B (en) * | 1982-04-06 | 1986-05-21 | Standard Telephones Cables Ltd | Electrocoating electrical components |
-
1966
- 1966-05-10 GB GB2064966A patent/GB1138976A/en not_active Expired
-
1967
- 1967-05-09 CH CH655467A patent/CH493916A/en not_active IP Right Cessation
- 1967-05-10 NL NL6706510A patent/NL6706510A/xx unknown
- 1967-05-10 BE BE698252D patent/BE698252A/xx unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2125219A (en) * | 1982-08-12 | 1984-02-29 | Mfd Capacitors Limited | Moisture removal within capacitors |
Also Published As
Publication number | Publication date |
---|---|
NL6706510A (en) | 1967-11-13 |
CH493916A (en) | 1970-07-15 |
BE698252A (en) | 1967-11-10 |
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