GB1120583A - Improvements relating to printed circuits - Google Patents

Improvements relating to printed circuits

Info

Publication number
GB1120583A
GB1120583A GB2123565A GB2123565A GB1120583A GB 1120583 A GB1120583 A GB 1120583A GB 2123565 A GB2123565 A GB 2123565A GB 2123565 A GB2123565 A GB 2123565A GB 1120583 A GB1120583 A GB 1120583A
Authority
GB
United Kingdom
Prior art keywords
printed circuits
improvements relating
relating
printed
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2123565A
Inventor
Leonard John Warren Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
British Aircraft Corp Ltd
Original Assignee
British Aircraft Corp Operating Ltd
British Aircraft Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Aircraft Corp Operating Ltd, British Aircraft Corp Ltd filed Critical British Aircraft Corp Operating Ltd
Priority to GB2123565A priority Critical patent/GB1120583A/en
Publication of GB1120583A publication Critical patent/GB1120583A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
GB2123565A 1965-05-19 1965-05-19 Improvements relating to printed circuits Expired GB1120583A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2123565A GB1120583A (en) 1965-05-19 1965-05-19 Improvements relating to printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2123565A GB1120583A (en) 1965-05-19 1965-05-19 Improvements relating to printed circuits

Publications (1)

Publication Number Publication Date
GB1120583A true GB1120583A (en) 1968-07-17

Family

ID=10159483

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2123565A Expired GB1120583A (en) 1965-05-19 1965-05-19 Improvements relating to printed circuits

Country Status (1)

Country Link
GB (1) GB1120583A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4237607A (en) * 1977-06-01 1980-12-09 Citizen Watch Co., Ltd. Method of assembling semiconductor integrated circuit
GB2141879A (en) * 1983-06-01 1985-01-03 Ferranti Plc Manufacture of printed circuit boards
GB2207558A (en) * 1987-07-11 1989-02-01 Abdul Hamed Perforated printed circuit boards
EP0797380A1 (en) * 1996-03-22 1997-09-24 Macdermid Incorporated Method for enhancing the solderability of a surface
USRE45297E1 (en) 1996-03-22 2014-12-23 Ronald Redline Method for enhancing the solderability of a surface
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
USRE45881E1 (en) 1996-03-22 2016-02-09 Ronald Redline Method for enhancing the solderability of a surface

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4237607A (en) * 1977-06-01 1980-12-09 Citizen Watch Co., Ltd. Method of assembling semiconductor integrated circuit
GB2141879A (en) * 1983-06-01 1985-01-03 Ferranti Plc Manufacture of printed circuit boards
GB2207558A (en) * 1987-07-11 1989-02-01 Abdul Hamed Perforated printed circuit boards
GB2207558B (en) * 1987-07-11 1991-10-30 Abdul Hamed Printed circuit boards
EP0797380A1 (en) * 1996-03-22 1997-09-24 Macdermid Incorporated Method for enhancing the solderability of a surface
US5733599A (en) * 1996-03-22 1998-03-31 Macdermid, Incorporated Method for enhancing the solderability of a surface
US5935640A (en) * 1996-03-22 1999-08-10 Macdermid, Incorporated Method for enhancing the solderability of a surface
EP1391536A3 (en) * 1996-03-22 2009-08-19 MacDermid, Incorporated Composition and process for plating silver onto a metallic substrate
USRE45297E1 (en) 1996-03-22 2014-12-23 Ronald Redline Method for enhancing the solderability of a surface
USRE45881E1 (en) 1996-03-22 2016-02-09 Ronald Redline Method for enhancing the solderability of a surface
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface

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