GB1120575A - Improvements in or relating to insulated conductors - Google Patents

Improvements in or relating to insulated conductors

Info

Publication number
GB1120575A
GB1120575A GB2999166A GB2999166A GB1120575A GB 1120575 A GB1120575 A GB 1120575A GB 2999166 A GB2999166 A GB 2999166A GB 2999166 A GB2999166 A GB 2999166A GB 1120575 A GB1120575 A GB 1120575A
Authority
GB
United Kingdom
Prior art keywords
polyamide
hexamethylene diamine
conductor
printed circuit
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2999166A
Inventor
Johannes Schneider
Arnold Franz
Wolfgang Pungs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dynamit Nobel AG
Original Assignee
Dynamit Nobel AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynamit Nobel AG filed Critical Dynamit Nobel AG
Publication of GB1120575A publication Critical patent/GB1120575A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307Other macromolecular compounds

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

1,120,575. Laminates. DYNAMIT NOBEL A.G. 4 July, 1966 [5 July, 1965], No. 29991/66. Heading B5N. An insulated conductor, suitable for use in the preparation of a printed circuit, comprises an electrically conductive material bonded to an electrically insulating support formed from an amorphous polyamide prepared by the condensation either of terephthalio acid or a methyl ester thereof or of a mixture of terephthalic and isophthalic acids or a methyl ester thereof with hexamethylene diamine or a derivative thereof in which a hydrogen atom attached to a chain carbon atom has been substituted by an alkyl group. The polyamide may be prepared by condensing terephthalic acid or the monomethyl or dimethyl esters thereof with hexamethylene diamine, or an alkyl substituted derivative such as 2,2,4- trimethyl hexamethylene diamine, 2,4,4-trimethyl hexamethylene diamine, or isomerio mixtures of these. The insulating support of polyamide may be a plate or tube formed by extrusion or plate moulding and the conductor material, e.g. copper foil may be applied thereto by light pressing before the polyamide sets. Alternatively copper foil is applied to a polyamide support by heat and pressure and an adhesive may also be used. To form a printed circuit excess copper foil is removed from the insulating conductor. Alternatively a printed circuit is produced by bonding a stamped out conductor matrix to the polyamide support.
GB2999166A 1965-07-05 1966-07-04 Improvements in or relating to insulated conductors Expired GB1120575A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DED0047657 1965-07-05

Publications (1)

Publication Number Publication Date
GB1120575A true GB1120575A (en) 1968-07-17

Family

ID=7050572

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2999166A Expired GB1120575A (en) 1965-07-05 1966-07-04 Improvements in or relating to insulated conductors

Country Status (5)

Country Link
BE (1) BE683615A (en)
CH (1) CH475846A (en)
GB (1) GB1120575A (en)
LU (1) LU51467A1 (en)
NL (1) NL6609324A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0074065A2 (en) * 1981-09-03 1983-03-16 GTE Products Corporation Photoflash array quick-cure laminating process
EP0089387A1 (en) * 1982-03-19 1983-09-28 Uop Inc. Preparation of copper-clad laminates
WO2014033203A1 (en) * 2012-08-30 2014-03-06 Solvay Specialty Polymers Usa, Llc Fuel cell component

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0323671B1 (en) * 1987-12-31 1994-08-17 Dsm N.V. Moulded printed circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0074065A2 (en) * 1981-09-03 1983-03-16 GTE Products Corporation Photoflash array quick-cure laminating process
EP0074065A3 (en) * 1981-09-03 1984-02-22 GTE Products Corporation Photoflash array quick-cure laminating process
US4935090A (en) * 1981-09-03 1990-06-19 Gte Products Corporation Photoflash array quick-cure laminating process
EP0089387A1 (en) * 1982-03-19 1983-09-28 Uop Inc. Preparation of copper-clad laminates
WO2014033203A1 (en) * 2012-08-30 2014-03-06 Solvay Specialty Polymers Usa, Llc Fuel cell component
CN104584298A (en) * 2012-08-30 2015-04-29 索尔维特殊聚合物美国有限责任公司 Fuel cell component

Also Published As

Publication number Publication date
BE683615A (en) 1967-01-04
LU51467A1 (en) 1966-09-06
CH475846A (en) 1969-07-31
NL6609324A (en) 1967-01-06

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