GB1086003A - Mounting arrangements for electronic devices - Google Patents

Mounting arrangements for electronic devices

Info

Publication number
GB1086003A
GB1086003A GB1073764A GB1073764A GB1086003A GB 1086003 A GB1086003 A GB 1086003A GB 1073764 A GB1073764 A GB 1073764A GB 1073764 A GB1073764 A GB 1073764A GB 1086003 A GB1086003 A GB 1086003A
Authority
GB
United Kingdom
Prior art keywords
insert
fragments
conducting
march
electrically insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1073764A
Inventor
William Donald Sinclair
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Associated Electrical Industries Ltd
Original Assignee
Associated Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Associated Electrical Industries Ltd filed Critical Associated Electrical Industries Ltd
Priority to GB1073764A priority Critical patent/GB1086003A/en
Priority to FR8413A priority patent/FR1427391A/en
Publication of GB1086003A publication Critical patent/GB1086003A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1,086,003. Semi-conductor devices. ASSOCIATED ELECTRICAL INDUSTRIES Ltd. March 15, 1965 [March 13, 1964], No. 10737/64. Heading H1K. An insert for location between the conductive casing of an electronic device such as semiconductor rectifier 1 with conducting base 3, and a metal support 6 comprises fragments of electrically insulating, thermally conductive material such as beryllia or aluminia, embedded in resilient electrically insulating material 7 such as silicone or synthetic rubber or epoxy resin, to provide a plurality of heat-conducting paths. The insert may comprise an upstanding resin portion 9 which may be integral or separate, to increase the leakage path or alternatively, the support 6 may be provided with a groove at the periphery of the insert. The fragments may be of circular or hexagonal crosssection arranged in concentric rings and each heat-conducting path may be constituted by a plurality of fragments in contact throughout the depth. The opposite contacting surface of the insert may be coated with a deformable metal and as aluminium, tin or zinc.
GB1073764A 1964-03-13 1964-03-13 Mounting arrangements for electronic devices Expired GB1086003A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB1073764A GB1086003A (en) 1964-03-13 1964-03-13 Mounting arrangements for electronic devices
FR8413A FR1427391A (en) 1964-03-13 1965-03-09 Semiconductor device enhancements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1073764A GB1086003A (en) 1964-03-13 1964-03-13 Mounting arrangements for electronic devices

Publications (1)

Publication Number Publication Date
GB1086003A true GB1086003A (en) 1967-10-04

Family

ID=9973363

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1073764A Expired GB1086003A (en) 1964-03-13 1964-03-13 Mounting arrangements for electronic devices

Country Status (2)

Country Link
FR (1) FR1427391A (en)
GB (1) GB1086003A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4326238A (en) * 1977-12-28 1982-04-20 Fujitsu Limited Electronic circuit packages
US4466483A (en) * 1978-04-14 1984-08-21 Whitfield Fred J Methods and means for conducting heat from electronic components and the like
US4473113A (en) * 1978-04-14 1984-09-25 Whitfield Fred J Methods and materials for conducting heat from electronic components and the like
US4546028A (en) * 1982-04-27 1985-10-08 Compagnie D'informatique Militaire Spatiale & Aeronautique Composite substrate with high heat conduction
GB2219133A (en) * 1988-05-26 1989-11-29 Bergquist Company The Thermally conductive mounting for a semiconductor component
US5377078A (en) * 1993-01-26 1994-12-27 Relm Communications Inc. Apparatus mounting a power semiconductor to a heat sink
US5904796A (en) * 1996-12-05 1999-05-18 Power Devices, Inc. Adhesive thermal interface and method of making the same
US6483707B1 (en) 2001-06-07 2002-11-19 Loctite Corporation Heat sink and thermal interface having shielding to attenuate electromagnetic interference
US6616999B1 (en) 2000-05-17 2003-09-09 Raymond G. Freuler Preapplicable phase change thermal interface pad
US6652705B1 (en) 2000-05-18 2003-11-25 Power Devices, Inc. Graphitic allotrope interface composition and method of fabricating the same
US6672378B2 (en) 2001-06-07 2004-01-06 Loctite Corporation Thermal interface wafer and method of making and using the same

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4326238A (en) * 1977-12-28 1982-04-20 Fujitsu Limited Electronic circuit packages
US4466483A (en) * 1978-04-14 1984-08-21 Whitfield Fred J Methods and means for conducting heat from electronic components and the like
US4473113A (en) * 1978-04-14 1984-09-25 Whitfield Fred J Methods and materials for conducting heat from electronic components and the like
US4546028A (en) * 1982-04-27 1985-10-08 Compagnie D'informatique Militaire Spatiale & Aeronautique Composite substrate with high heat conduction
GB2219133A (en) * 1988-05-26 1989-11-29 Bergquist Company The Thermally conductive mounting for a semiconductor component
DE3836002A1 (en) * 1988-05-26 1989-11-30 Bergquist Co UNDERLAYER WITH A SOFT SURFACE FOR SEMICONDUCTOR COMPONENTS
GB2219133B (en) * 1988-05-26 1991-11-20 Bergquist Company The Thermally conductive mounting for a semiconductor component
US5377078A (en) * 1993-01-26 1994-12-27 Relm Communications Inc. Apparatus mounting a power semiconductor to a heat sink
US5904796A (en) * 1996-12-05 1999-05-18 Power Devices, Inc. Adhesive thermal interface and method of making the same
US6616999B1 (en) 2000-05-17 2003-09-09 Raymond G. Freuler Preapplicable phase change thermal interface pad
US7056566B2 (en) 2000-05-17 2006-06-06 Henkel Corporation Preappliable phase change thermal interface pad
US6652705B1 (en) 2000-05-18 2003-11-25 Power Devices, Inc. Graphitic allotrope interface composition and method of fabricating the same
US6483707B1 (en) 2001-06-07 2002-11-19 Loctite Corporation Heat sink and thermal interface having shielding to attenuate electromagnetic interference
US6672378B2 (en) 2001-06-07 2004-01-06 Loctite Corporation Thermal interface wafer and method of making and using the same
US6901997B2 (en) 2001-06-07 2005-06-07 Loctite Corporation Thermal interface wafer and method of making and using the same
US7004244B2 (en) 2001-06-07 2006-02-28 Henkel Corporation Thermal interface wafer and method of making and using the same

Also Published As

Publication number Publication date
FR1427391A (en) 1966-02-04

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