GB1086003A - Mounting arrangements for electronic devices - Google Patents
Mounting arrangements for electronic devicesInfo
- Publication number
- GB1086003A GB1086003A GB1073764A GB1073764A GB1086003A GB 1086003 A GB1086003 A GB 1086003A GB 1073764 A GB1073764 A GB 1073764A GB 1073764 A GB1073764 A GB 1073764A GB 1086003 A GB1086003 A GB 1086003A
- Authority
- GB
- United Kingdom
- Prior art keywords
- insert
- fragments
- conducting
- march
- electrically insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012634 fragment Substances 0.000 abstract 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 239000012777 electrically insulating material Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920002379 silicone rubber Polymers 0.000 abstract 1
- 239000004945 silicone rubber Substances 0.000 abstract 1
- 229920003051 synthetic elastomer Polymers 0.000 abstract 1
- 239000005061 synthetic rubber Substances 0.000 abstract 1
- 239000011135 tin Substances 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- 239000011701 zinc Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
1,086,003. Semi-conductor devices. ASSOCIATED ELECTRICAL INDUSTRIES Ltd. March 15, 1965 [March 13, 1964], No. 10737/64. Heading H1K. An insert for location between the conductive casing of an electronic device such as semiconductor rectifier 1 with conducting base 3, and a metal support 6 comprises fragments of electrically insulating, thermally conductive material such as beryllia or aluminia, embedded in resilient electrically insulating material 7 such as silicone or synthetic rubber or epoxy resin, to provide a plurality of heat-conducting paths. The insert may comprise an upstanding resin portion 9 which may be integral or separate, to increase the leakage path or alternatively, the support 6 may be provided with a groove at the periphery of the insert. The fragments may be of circular or hexagonal crosssection arranged in concentric rings and each heat-conducting path may be constituted by a plurality of fragments in contact throughout the depth. The opposite contacting surface of the insert may be coated with a deformable metal and as aluminium, tin or zinc.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1073764A GB1086003A (en) | 1964-03-13 | 1964-03-13 | Mounting arrangements for electronic devices |
FR8413A FR1427391A (en) | 1964-03-13 | 1965-03-09 | Semiconductor device enhancements |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1073764A GB1086003A (en) | 1964-03-13 | 1964-03-13 | Mounting arrangements for electronic devices |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1086003A true GB1086003A (en) | 1967-10-04 |
Family
ID=9973363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1073764A Expired GB1086003A (en) | 1964-03-13 | 1964-03-13 | Mounting arrangements for electronic devices |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR1427391A (en) |
GB (1) | GB1086003A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4326238A (en) * | 1977-12-28 | 1982-04-20 | Fujitsu Limited | Electronic circuit packages |
US4466483A (en) * | 1978-04-14 | 1984-08-21 | Whitfield Fred J | Methods and means for conducting heat from electronic components and the like |
US4473113A (en) * | 1978-04-14 | 1984-09-25 | Whitfield Fred J | Methods and materials for conducting heat from electronic components and the like |
US4546028A (en) * | 1982-04-27 | 1985-10-08 | Compagnie D'informatique Militaire Spatiale & Aeronautique | Composite substrate with high heat conduction |
GB2219133A (en) * | 1988-05-26 | 1989-11-29 | Bergquist Company The | Thermally conductive mounting for a semiconductor component |
US5377078A (en) * | 1993-01-26 | 1994-12-27 | Relm Communications Inc. | Apparatus mounting a power semiconductor to a heat sink |
US5904796A (en) * | 1996-12-05 | 1999-05-18 | Power Devices, Inc. | Adhesive thermal interface and method of making the same |
US6483707B1 (en) | 2001-06-07 | 2002-11-19 | Loctite Corporation | Heat sink and thermal interface having shielding to attenuate electromagnetic interference |
US6616999B1 (en) | 2000-05-17 | 2003-09-09 | Raymond G. Freuler | Preapplicable phase change thermal interface pad |
US6652705B1 (en) | 2000-05-18 | 2003-11-25 | Power Devices, Inc. | Graphitic allotrope interface composition and method of fabricating the same |
US6672378B2 (en) | 2001-06-07 | 2004-01-06 | Loctite Corporation | Thermal interface wafer and method of making and using the same |
-
1964
- 1964-03-13 GB GB1073764A patent/GB1086003A/en not_active Expired
-
1965
- 1965-03-09 FR FR8413A patent/FR1427391A/en not_active Expired
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4326238A (en) * | 1977-12-28 | 1982-04-20 | Fujitsu Limited | Electronic circuit packages |
US4466483A (en) * | 1978-04-14 | 1984-08-21 | Whitfield Fred J | Methods and means for conducting heat from electronic components and the like |
US4473113A (en) * | 1978-04-14 | 1984-09-25 | Whitfield Fred J | Methods and materials for conducting heat from electronic components and the like |
US4546028A (en) * | 1982-04-27 | 1985-10-08 | Compagnie D'informatique Militaire Spatiale & Aeronautique | Composite substrate with high heat conduction |
GB2219133A (en) * | 1988-05-26 | 1989-11-29 | Bergquist Company The | Thermally conductive mounting for a semiconductor component |
DE3836002A1 (en) * | 1988-05-26 | 1989-11-30 | Bergquist Co | UNDERLAYER WITH A SOFT SURFACE FOR SEMICONDUCTOR COMPONENTS |
GB2219133B (en) * | 1988-05-26 | 1991-11-20 | Bergquist Company The | Thermally conductive mounting for a semiconductor component |
US5377078A (en) * | 1993-01-26 | 1994-12-27 | Relm Communications Inc. | Apparatus mounting a power semiconductor to a heat sink |
US5904796A (en) * | 1996-12-05 | 1999-05-18 | Power Devices, Inc. | Adhesive thermal interface and method of making the same |
US6616999B1 (en) | 2000-05-17 | 2003-09-09 | Raymond G. Freuler | Preapplicable phase change thermal interface pad |
US7056566B2 (en) | 2000-05-17 | 2006-06-06 | Henkel Corporation | Preappliable phase change thermal interface pad |
US6652705B1 (en) | 2000-05-18 | 2003-11-25 | Power Devices, Inc. | Graphitic allotrope interface composition and method of fabricating the same |
US6483707B1 (en) | 2001-06-07 | 2002-11-19 | Loctite Corporation | Heat sink and thermal interface having shielding to attenuate electromagnetic interference |
US6672378B2 (en) | 2001-06-07 | 2004-01-06 | Loctite Corporation | Thermal interface wafer and method of making and using the same |
US6901997B2 (en) | 2001-06-07 | 2005-06-07 | Loctite Corporation | Thermal interface wafer and method of making and using the same |
US7004244B2 (en) | 2001-06-07 | 2006-02-28 | Henkel Corporation | Thermal interface wafer and method of making and using the same |
Also Published As
Publication number | Publication date |
---|---|
FR1427391A (en) | 1966-02-04 |
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