GB1018623A - Improvements in or relating to electronic assemblies - Google Patents
Improvements in or relating to electronic assembliesInfo
- Publication number
- GB1018623A GB1018623A GB606062A GB606062A GB1018623A GB 1018623 A GB1018623 A GB 1018623A GB 606062 A GB606062 A GB 606062A GB 606062 A GB606062 A GB 606062A GB 1018623 A GB1018623 A GB 1018623A
- Authority
- GB
- United Kingdom
- Prior art keywords
- channels
- air
- channel
- modules
- obstruction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
1,018,623. Circuit assemblies. GENERAL ELECTRIC CO. Ltd., and P. A. BARNET. Feb. 15, 1963 [Feb. 16, 1962], No. 6060/62. Heading H1R. In an assembly of circuit modules 2, Fig. I, which may be of the kind described in Specification 1,018,621, the modules are mounted in rows on a plate 1, passages being left between the rows for a coolant such as air. The air may pass unrestrictedly through a channel, as through channel 3, or it may be diverted, as by an obstruction 9 in channel 8, towards modules generating a comparatively large amount of heat. Where modules generate little heat, the quantity of air in a channel, such as 5, may be limited by an obstruction 6 having narrow bore orifices. The channels may be arranged in meander-shaped series fashion. Fig. 3 shows module mounting plates 23-30 defining channels 32-38. To provide additional cooling in region 39, air is diverted from channels 33, 34, 36, 37 into channels 35 by means of obstructions 40, each with a narrow bore, and orifices 41 in plates 25-28. Beyond region 39, the air is returned to its original channels by means of an obstruction 42 and orifices 43. Additional cooling of a particular module may be effected by the provision of cooling fins which may be disposed in one or more channels. Moreover, a cold plate having tubes through which coolant is passed may be interposed between two adjacent module mounting plates. In order to pass cooling liquid through the assembly channels, the latter may be lined with impermeable material such as varnish, synthetic rubber, or adhesive-backed plastic; or plastic pipes or sleeves may be provided in the channels.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA795886A CA795886A (en) | 1962-02-16 | Electronic assemblies | |
GB606062A GB1018623A (en) | 1962-02-16 | 1962-02-16 | Improvements in or relating to electronic assemblies |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB606062A GB1018623A (en) | 1962-02-16 | 1962-02-16 | Improvements in or relating to electronic assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1018623A true GB1018623A (en) | 1966-01-26 |
Family
ID=9807686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB606062A Expired GB1018623A (en) | 1962-02-16 | 1962-02-16 | Improvements in or relating to electronic assemblies |
Country Status (2)
Country | Link |
---|---|
CA (1) | CA795886A (en) |
GB (1) | GB1018623A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3794886A (en) * | 1972-06-26 | 1974-02-26 | W Goldman | Fluid cooled semiconductor socket |
WO1986003648A1 (en) * | 1984-12-07 | 1986-06-19 | Telefonaktiebolaget L M Ericsson | Arrangement in cooling circuit boards |
GB2296132A (en) * | 1994-12-12 | 1996-06-19 | Siemens Plessey Electronic | Cooling electrical apparatus |
US5676198A (en) * | 1994-11-15 | 1997-10-14 | Sundstrand Corporation | Cooling apparatus for an electronic component |
GB2358464A (en) * | 2000-01-21 | 2001-07-25 | 3Com Corp | A cooling apparatus |
US6304447B1 (en) * | 1998-12-31 | 2001-10-16 | Lucent Technologies, Inc. | Arrangement for cooling an electrical assembly |
US6330154B1 (en) | 1999-02-02 | 2001-12-11 | 3Com Corporation | Cooling equipment |
US6364009B1 (en) | 1999-11-24 | 2002-04-02 | 3Com Corporation | Cooling devices |
EP2114116A1 (en) * | 2008-04-29 | 2009-11-04 | Agie Sa | Hybrid cooling |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2157094A5 (en) * | 1971-10-18 | 1973-06-01 | Thomson Csf | |
DE2335735A1 (en) * | 1973-07-13 | 1975-01-30 | Forster Electronic Gmbh | TEXT EDITING DEVICE FOR REMOTE CONTROLLED TYPINGWRITERS |
US4631636A (en) * | 1984-03-26 | 1986-12-23 | Harris Corporation | High density packaging technique for electronic systems |
-
0
- CA CA795886A patent/CA795886A/en not_active Expired
-
1962
- 1962-02-16 GB GB606062A patent/GB1018623A/en not_active Expired
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3794886A (en) * | 1972-06-26 | 1974-02-26 | W Goldman | Fluid cooled semiconductor socket |
WO1986003648A1 (en) * | 1984-12-07 | 1986-06-19 | Telefonaktiebolaget L M Ericsson | Arrangement in cooling circuit boards |
AU587215B2 (en) * | 1984-12-07 | 1989-08-10 | Telefonaktiebolaget Lm Ericsson (Publ) | Cooling circuit boards |
US5950714A (en) * | 1994-11-15 | 1999-09-14 | Sundstrand Corporation | Cooling apparatus for an electronic component |
US5676198A (en) * | 1994-11-15 | 1997-10-14 | Sundstrand Corporation | Cooling apparatus for an electronic component |
GB2296132A (en) * | 1994-12-12 | 1996-06-19 | Siemens Plessey Electronic | Cooling electrical apparatus |
GB2296132B (en) * | 1994-12-12 | 1999-02-24 | Siemens Plessey Electronic | Improvements in or relating to cooling systems |
US6304447B1 (en) * | 1998-12-31 | 2001-10-16 | Lucent Technologies, Inc. | Arrangement for cooling an electrical assembly |
US6330154B1 (en) | 1999-02-02 | 2001-12-11 | 3Com Corporation | Cooling equipment |
US6364009B1 (en) | 1999-11-24 | 2002-04-02 | 3Com Corporation | Cooling devices |
GB2358464A (en) * | 2000-01-21 | 2001-07-25 | 3Com Corp | A cooling apparatus |
GB2358463A (en) * | 2000-01-21 | 2001-07-25 | 3Com Corp | A cooling apparatus |
EP2114116A1 (en) * | 2008-04-29 | 2009-11-04 | Agie Sa | Hybrid cooling |
Also Published As
Publication number | Publication date |
---|---|
CA795886A (en) | 1968-10-01 |
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