GB1018120A - Improvements in the electrodeposition of copper - Google Patents

Improvements in the electrodeposition of copper

Info

Publication number
GB1018120A
GB1018120A GB3905063A GB3905063A GB1018120A GB 1018120 A GB1018120 A GB 1018120A GB 3905063 A GB3905063 A GB 3905063A GB 3905063 A GB3905063 A GB 3905063A GB 1018120 A GB1018120 A GB 1018120A
Authority
GB
United Kingdom
Prior art keywords
compounds
triazine
electrodeposition
copper
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3905063A
Inventor
Tony Eugene Such
Apoloniusz Wyszynski
Colin Baldwin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Europe Ltd
Original Assignee
W Canning PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by W Canning PLC filed Critical W Canning PLC
Priority to GB3905063A priority Critical patent/GB1018120A/en
Publication of GB1018120A publication Critical patent/GB1018120A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

An acid copper sulphate plating bath includes two classes of compounds, (1) compounds having a group <FORM:1018120/C6-C7/1> e.g. thiourea or thocarbamic acid, and (2) compounds derived from triazine of formula in which R1=R2= an alkyl group of 4 C atoms or less and X=halogen. Examples are: 2,4-bis-(ethylamino) 6-chloro-1,3,5-triazine, and the 4-isopropylamino-derivatives. Current densities of 8-50 A.S.Ft. are applied. About 0.03-0.5 g. per litre of the second compound and substantially less of the first are used.
GB3905063A 1963-10-03 1963-10-03 Improvements in the electrodeposition of copper Expired GB1018120A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3905063A GB1018120A (en) 1963-10-03 1963-10-03 Improvements in the electrodeposition of copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3905063A GB1018120A (en) 1963-10-03 1963-10-03 Improvements in the electrodeposition of copper

Publications (1)

Publication Number Publication Date
GB1018120A true GB1018120A (en) 1966-01-26

Family

ID=10407323

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3905063A Expired GB1018120A (en) 1963-10-03 1963-10-03 Improvements in the electrodeposition of copper

Country Status (1)

Country Link
GB (1) GB1018120A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2669406A1 (en) * 2012-05-31 2013-12-04 Rohm and Haas Electronic Materials LLC Electrolytic copper plating solution and method of electrolytic copper plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2669406A1 (en) * 2012-05-31 2013-12-04 Rohm and Haas Electronic Materials LLC Electrolytic copper plating solution and method of electrolytic copper plating

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