GB1006930A - Improved semiconductor device encapsulation and cooling structure therefor - Google Patents
Improved semiconductor device encapsulation and cooling structure thereforInfo
- Publication number
- GB1006930A GB1006930A GB3656961A GB3656961A GB1006930A GB 1006930 A GB1006930 A GB 1006930A GB 3656961 A GB3656961 A GB 3656961A GB 3656961 A GB3656961 A GB 3656961A GB 1006930 A GB1006930 A GB 1006930A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semi
- heat sink
- heat dissipating
- envelope
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
1,006,930. Semi-conductor devices. CLEVITE CORPORATION. Oct. 11, 1961 [Nov. 3, 19601, No. 36569/61. Heading H1K. An encapsulation for a semi-conductor device has a heat dissipating structure with a well into which fits a cylindrical envelope containing the device, and has a post in thermal contact with the heat dissipating structure adjacent the envelope but spaced therefrom and which extends into the envelope to support and make thermal contact with the semi-conductor device. The embodiment shown in Fig. 1 comprises a diode substantially as described in Specification 934,301 mounted within an annularly finned heat sink which may be force cooled. A longitudinally finned heat sink may instead by used. Another form of heat sink is threaded so that it may be screwed into a metal chassis and the heat dissipating capacity thus increased. The invention is not restricted to the use of the diode structures of Specification 934,301 and another form is shown in Fig. 5 in which the semi-conductor device 16 is soldered to its two leads.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US6707660A | 1960-11-03 | 1960-11-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1006930A true GB1006930A (en) | 1965-10-06 |
Family
ID=22073559
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3656961A Expired GB1006930A (en) | 1960-11-03 | 1961-10-11 | Improved semiconductor device encapsulation and cooling structure therefor |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1006930A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10184235B2 (en) | 2013-05-28 | 2019-01-22 | Falcon Waterfree Technologies, Llc | Directional fluid inlet |
US10182688B2 (en) | 2013-05-28 | 2019-01-22 | Falcon Waterfree Technologies, Llc | Splash-reducing and velocity-increasing cartridge exit |
US10197430B2 (en) | 2014-01-20 | 2019-02-05 | Falcon Waterfree Technologies, Llc | Visual indicator |
US10273675B2 (en) | 2013-04-26 | 2019-04-30 | Falcon Waterfree Technologies, Llc | Hybrid trap with water injection |
-
1961
- 1961-10-11 GB GB3656961A patent/GB1006930A/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10273675B2 (en) | 2013-04-26 | 2019-04-30 | Falcon Waterfree Technologies, Llc | Hybrid trap with water injection |
US10975560B2 (en) | 2013-04-26 | 2021-04-13 | Falcon Water Technologies, LLC | Hybrid trap with water injection |
US10184235B2 (en) | 2013-05-28 | 2019-01-22 | Falcon Waterfree Technologies, Llc | Directional fluid inlet |
US10182688B2 (en) | 2013-05-28 | 2019-01-22 | Falcon Waterfree Technologies, Llc | Splash-reducing and velocity-increasing cartridge exit |
US10197430B2 (en) | 2014-01-20 | 2019-02-05 | Falcon Waterfree Technologies, Llc | Visual indicator |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB921251A (en) | Semiconductor mounting | |
US2887628A (en) | Semiconductor device construction | |
GB1393666A (en) | Heat dissipation for power integrated circuit devices | |
GB943860A (en) | Semi-conductor device | |
GB1022329A (en) | Semiconductor device container | |
GB1007598A (en) | Semi-conductor devices | |
GB1006930A (en) | Improved semiconductor device encapsulation and cooling structure therefor | |
GB1071130A (en) | Improvements in or relating to the mounting of semi-conductor components | |
GB1216090A (en) | Semiconductor devices | |
GB1273175A (en) | Semi-conductor devices | |
GB1139345A (en) | Semi-conductor devices | |
GB985672A (en) | A semiconductor transistor or rectifier | |
GB956934A (en) | Sealed semiconductor devices and mounting means therefor | |
GB1157042A (en) | Semiconductor Device Assembly | |
GB1229474A (en) | ||
GB1210584A (en) | Semiconductor device and method of manufacturing the same | |
GB1052449A (en) | ||
GB989370A (en) | Improvements in or relating to semiconductor devices | |
GB1188179A (en) | Semiconductor Devices | |
GB932136A (en) | Heat dissipating shields for electronic components | |
GB831295A (en) | Improvements in or relating to semiconductor devices | |
GB1026606A (en) | Improvements in or relating to semiconductor devices | |
GB1319573A (en) | Semiconductor devices | |
FR1389182A (en) | Electrical device with heat sink, including semiconductor electrical device | |
GB983623A (en) | Improvements relating to semi-conductor devices |