GB0811941D0 - Coated thermoexpandable microspheres - Google Patents

Coated thermoexpandable microspheres

Info

Publication number
GB0811941D0
GB0811941D0 GBGB0811941.4A GB0811941A GB0811941D0 GB 0811941 D0 GB0811941 D0 GB 0811941D0 GB 0811941 A GB0811941 A GB 0811941A GB 0811941 D0 GB0811941 D0 GB 0811941D0
Authority
GB
United Kingdom
Prior art keywords
coated
thermoexpandable microspheres
thermoexpandable
microspheres
coated thermoexpandable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0811941.4A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
De Bonding Ltd
Original Assignee
De Bonding Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by De Bonding Ltd filed Critical De Bonding Ltd
Priority to GBGB0811941.4A priority Critical patent/GB0811941D0/en
Publication of GB0811941D0 publication Critical patent/GB0811941D0/en
Priority to GB0911312A priority patent/GB2462169A/en
Priority to PCT/GB2009/050759 priority patent/WO2010001157A2/en
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • B01J13/20—After-treatment of capsule walls, e.g. hardening
    • B01J13/22—Coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B67/00—Influencing the physical, e.g. the dyeing or printing properties of dyestuffs without chemical reactions, e.g. by treating with solvents grinding or grinding assistants, coating of pigments or dyes; Process features in the making of dyestuff preparations; Dyestuff preparations of a special physical nature, e.g. tablets, films
    • C09B67/0097—Dye preparations of special physical nature; Tablets, films, extrusion, microcapsules, sheets, pads, bags with dyes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dispersion Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
GBGB0811941.4A 2008-07-01 2008-07-01 Coated thermoexpandable microspheres Ceased GB0811941D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GBGB0811941.4A GB0811941D0 (en) 2008-07-01 2008-07-01 Coated thermoexpandable microspheres
GB0911312A GB2462169A (en) 2008-07-01 2009-06-30 Thermoexpandable microspheres with conductive coating
PCT/GB2009/050759 WO2010001157A2 (en) 2008-07-01 2009-06-30 Coated thermoexpandable microspheres

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0811941.4A GB0811941D0 (en) 2008-07-01 2008-07-01 Coated thermoexpandable microspheres

Publications (1)

Publication Number Publication Date
GB0811941D0 true GB0811941D0 (en) 2008-07-30

Family

ID=39683388

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB0811941.4A Ceased GB0811941D0 (en) 2008-07-01 2008-07-01 Coated thermoexpandable microspheres
GB0911312A Withdrawn GB2462169A (en) 2008-07-01 2009-06-30 Thermoexpandable microspheres with conductive coating

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB0911312A Withdrawn GB2462169A (en) 2008-07-01 2009-06-30 Thermoexpandable microspheres with conductive coating

Country Status (2)

Country Link
GB (2) GB0811941D0 (en)
WO (1) WO2010001157A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010073169A1 (en) * 2008-12-22 2010-07-01 Koninklijke Philips Electronics N.V. Easily removable tape
CN109847664B (en) * 2019-04-09 2021-11-12 贵州师范大学 Conductive thermal expansion type microcapsule and preparation method thereof
CN111072958A (en) * 2019-12-03 2020-04-28 天津圣工科技有限公司 Polypyrrole/melamine resin double-shell structure microcapsule and preparation method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3318697A (en) * 1964-04-28 1967-05-09 Minnesota Mining & Mfg Copy sheet having a layer of thermally rupturable hollow microcapsules on a conductive backing and the method of use
FR1555753A (en) * 1966-11-29 1969-01-31
US4496627A (en) * 1981-11-25 1985-01-29 Fujimori Kogyo Co., Ltd. Electrical conductive foam beads and molded electrical conductive foamed articles obtained therefrom
US5378533A (en) * 1989-07-17 1995-01-03 Fujii Kinzoku Kako Co., Ltd. Electrically conductive exothermic composition comprising non-magnetic hollow particles and heating unit made thereof
JPH0570750A (en) * 1991-09-10 1993-03-23 Fujitsu Ltd Conductive adhesive
JPH11302614A (en) * 1998-04-23 1999-11-02 Nitto Denko Corp Thermally releasable pressure-sensitive adhesive sheet
JP2000268634A (en) * 1999-03-15 2000-09-29 Canon Inc Conductive expansion particle and manufacture thereof
GB9912694D0 (en) * 1999-06-02 1999-08-04 Bain Peter S Adhesive

Also Published As

Publication number Publication date
WO2010001157A2 (en) 2010-01-07
GB0911312D0 (en) 2009-08-12
WO2010001157A3 (en) 2010-05-27
GB2462169A (en) 2010-02-03

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)