GB0516622D0 - Circuit module system and method - Google Patents
Circuit module system and methodInfo
- Publication number
- GB0516622D0 GB0516622D0 GBGB0516622.8A GB0516622A GB0516622D0 GB 0516622 D0 GB0516622 D0 GB 0516622D0 GB 0516622 A GB0516622 A GB 0516622A GB 0516622 D0 GB0516622 D0 GB 0516622D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- circuit module
- module system
- circuit
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0822085A GB2452880B (en) | 2004-09-03 | 2005-08-12 | Circuit module system and method |
GB0822086A GB2453064A (en) | 2004-09-03 | 2005-08-12 | Circuit module for memory expansion |
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/934,027 US20060050492A1 (en) | 2004-09-03 | 2004-09-03 | Thin module system and method |
US11/005,992 US7480152B2 (en) | 2004-09-03 | 2004-12-07 | Thin module system and method |
US11/007,551 US7511968B2 (en) | 2004-09-03 | 2004-12-08 | Buffered thin module system and method |
US11/058,979 US7468893B2 (en) | 2004-09-03 | 2005-02-16 | Thin module system and method |
US11/068,688 US7324352B2 (en) | 2004-09-03 | 2005-03-01 | High capacity thin module system and method |
US11/123,721 US20060053345A1 (en) | 2004-09-03 | 2005-05-06 | Thin module system and method |
US11/125,018 US7606049B2 (en) | 2004-09-03 | 2005-05-09 | Module thermal management system and method |
US11/173,450 US20060049512A1 (en) | 2004-09-03 | 2005-07-01 | Thin module system and method with skew reduction |
US11/193,954 US20060049513A1 (en) | 2004-09-03 | 2005-07-29 | Thin module system and method with thermal management |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0516622D0 true GB0516622D0 (en) | 2005-09-21 |
GB2417836A GB2417836A (en) | 2006-03-08 |
GB2417836B GB2417836B (en) | 2009-08-26 |
Family
ID=35098242
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0516622A Expired - Fee Related GB2417836B (en) | 2004-09-03 | 2005-08-12 | Circuit module system and method |
GB0822085A Expired - Fee Related GB2452880B (en) | 2004-09-03 | 2005-08-12 | Circuit module system and method |
GB0822086A Withdrawn GB2453064A (en) | 2004-09-03 | 2005-08-12 | Circuit module for memory expansion |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0822085A Expired - Fee Related GB2452880B (en) | 2004-09-03 | 2005-08-12 | Circuit module system and method |
GB0822086A Withdrawn GB2453064A (en) | 2004-09-03 | 2005-08-12 | Circuit module for memory expansion |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP2006074031A (en) |
KR (1) | KR100880054B1 (en) |
AU (1) | AU2005203591A1 (en) |
CA (1) | CA2515714A1 (en) |
DE (1) | DE102005038254A1 (en) |
FR (1) | FR2878118A1 (en) |
GB (3) | GB2417836B (en) |
WO (1) | WO2006028643A2 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100837276B1 (en) | 2006-12-20 | 2008-06-11 | 삼성전자주식회사 | Printed circuit board and semiconductor memory module using the same |
US7715200B2 (en) | 2007-09-28 | 2010-05-11 | Samsung Electronics Co., Ltd. | Stacked semiconductor module, method of fabricating the same, and electronic system using the same |
JP2011035345A (en) | 2009-08-06 | 2011-02-17 | Fujitsu Ltd | Semiconductor device module, electronic circuit unit, electronic device, and method of manufacturing semiconductor device module |
JP2011090441A (en) * | 2009-10-21 | 2011-05-06 | Elpida Memory Inc | Memory module |
US8536697B2 (en) | 2011-11-30 | 2013-09-17 | Freescale Semiconductor, Inc. | Packaged die for heat dissipation and method therefor |
TW201347051A (en) | 2012-01-27 | 2013-11-16 | Mosaid Technologies Inc | Method and apparatus for connecting memory dies to form a memory system |
US9516755B2 (en) | 2012-12-28 | 2016-12-06 | Intel Corporation | Multi-channel memory module |
DE102016115665B3 (en) * | 2016-08-24 | 2018-01-18 | Harting Electric Gmbh & Co. Kg | Connectors |
US10679722B2 (en) | 2016-08-26 | 2020-06-09 | Sandisk Technologies Llc | Storage system with several integrated components and method for use therewith |
JP6597810B2 (en) * | 2018-02-02 | 2019-10-30 | 日本電気株式会社 | Mounting structure, structural component, and manufacturing method of mounting structure |
US20190314083A1 (en) * | 2018-04-11 | 2019-10-17 | Biosense Webster (Israel) Ltd. | Flexible Multi-Arm Catheter with Diametrically Opposed Sensing Electrodes |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57193094A (en) * | 1981-05-18 | 1982-11-27 | Matsushita Electric Ind Co Ltd | Electronic circuit part and method of mounting same |
FR2538989B1 (en) * | 1982-12-30 | 1985-10-04 | Thomson Csf | ASSEMBLY STRUCTURE FOR COMPLEX ELECTRONIC CIRCUITS, AND METHOD FOR IMPROVING THE RELIABILITY OF SUCH AN ASSEMBLY |
US5252857A (en) * | 1991-08-05 | 1993-10-12 | International Business Machines Corporation | Stacked DCA memory chips |
US5731633A (en) * | 1992-09-16 | 1998-03-24 | Gary W. Hamilton | Thin multichip module |
JPH113955A (en) * | 1997-06-12 | 1999-01-06 | Shinko Electric Ind Co Ltd | Semiconductor chip mounting board |
US5963427A (en) * | 1997-12-11 | 1999-10-05 | Sun Microsystems, Inc. | Multi-chip module with flexible circuit board |
US6219243B1 (en) * | 1999-12-14 | 2001-04-17 | Intel Corporation | Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units |
US6444921B1 (en) * | 2000-02-03 | 2002-09-03 | Fujitsu Limited | Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like |
US6449159B1 (en) * | 2000-05-03 | 2002-09-10 | Rambus Inc. | Semiconductor module with imbedded heat spreader |
JP2002151648A (en) * | 2000-11-07 | 2002-05-24 | Mitsubishi Electric Corp | Semiconductor module |
EP1306900A3 (en) * | 2000-12-28 | 2005-07-06 | Texas Instruments Incorporated | Chip-scale packages stacked on folded interconnector for vertical assembly on substrates |
WO2005104324A2 (en) * | 2004-04-15 | 2005-11-03 | Smith Gary W | Folded, fully buffered memory module |
-
2005
- 2005-08-10 WO PCT/US2005/028547 patent/WO2006028643A2/en active Application Filing
- 2005-08-11 AU AU2005203591A patent/AU2005203591A1/en not_active Abandoned
- 2005-08-11 FR FR0508522A patent/FR2878118A1/en not_active Withdrawn
- 2005-08-11 CA CA002515714A patent/CA2515714A1/en not_active Abandoned
- 2005-08-12 GB GB0516622A patent/GB2417836B/en not_active Expired - Fee Related
- 2005-08-12 GB GB0822085A patent/GB2452880B/en not_active Expired - Fee Related
- 2005-08-12 DE DE102005038254A patent/DE102005038254A1/en not_active Withdrawn
- 2005-08-12 GB GB0822086A patent/GB2453064A/en not_active Withdrawn
- 2005-08-15 JP JP2005235451A patent/JP2006074031A/en active Pending
- 2005-08-16 KR KR1020050074824A patent/KR100880054B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE102005038254A1 (en) | 2006-03-23 |
GB2453064A (en) | 2009-03-25 |
GB0822085D0 (en) | 2009-01-07 |
WO2006028643A3 (en) | 2006-11-30 |
CA2515714A1 (en) | 2006-03-03 |
WO2006028643A2 (en) | 2006-03-16 |
GB0822086D0 (en) | 2009-01-07 |
AU2005203591A1 (en) | 2006-03-23 |
GB2452880B (en) | 2009-07-29 |
JP2006074031A (en) | 2006-03-16 |
GB2417836A (en) | 2006-03-08 |
GB2452880A (en) | 2009-03-18 |
GB2417836B (en) | 2009-08-26 |
FR2878118A1 (en) | 2006-05-19 |
KR100880054B1 (en) | 2009-01-22 |
KR20060050487A (en) | 2006-05-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20110812 |