GB0423032D0 - Methods and apparatus for sputtering - Google Patents

Methods and apparatus for sputtering

Info

Publication number
GB0423032D0
GB0423032D0 GBGB0423032.2A GB0423032A GB0423032D0 GB 0423032 D0 GB0423032 D0 GB 0423032D0 GB 0423032 A GB0423032 A GB 0423032A GB 0423032 D0 GB0423032 D0 GB 0423032D0
Authority
GB
United Kingdom
Prior art keywords
sputtering
methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0423032.2A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trikon Technologies Ltd
Original Assignee
Trikon Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trikon Technologies Ltd filed Critical Trikon Technologies Ltd
Priority to GBGB0423032.2A priority Critical patent/GB0423032D0/en
Publication of GB0423032D0 publication Critical patent/GB0423032D0/en
Priority to US11/247,199 priority patent/US8585873B2/en
Priority to JP2005299954A priority patent/JP5290496B2/en
Priority to DE102005049233A priority patent/DE102005049233A1/en
Priority to GB0521001A priority patent/GB2419138B/en
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
GBGB0423032.2A 2004-10-16 2004-10-16 Methods and apparatus for sputtering Ceased GB0423032D0 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GBGB0423032.2A GB0423032D0 (en) 2004-10-16 2004-10-16 Methods and apparatus for sputtering
US11/247,199 US8585873B2 (en) 2004-10-16 2005-10-12 Methods and apparatus for sputtering
JP2005299954A JP5290496B2 (en) 2004-10-16 2005-10-14 Method and apparatus for sputtering
DE102005049233A DE102005049233A1 (en) 2004-10-16 2005-10-14 Method and device for atomizing
GB0521001A GB2419138B (en) 2004-10-16 2005-10-17 Methods and apparatus for sputtering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0423032.2A GB0423032D0 (en) 2004-10-16 2004-10-16 Methods and apparatus for sputtering

Publications (1)

Publication Number Publication Date
GB0423032D0 true GB0423032D0 (en) 2004-11-17

Family

ID=33462860

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB0423032.2A Ceased GB0423032D0 (en) 2004-10-16 2004-10-16 Methods and apparatus for sputtering
GB0521001A Active GB2419138B (en) 2004-10-16 2005-10-17 Methods and apparatus for sputtering

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB0521001A Active GB2419138B (en) 2004-10-16 2005-10-17 Methods and apparatus for sputtering

Country Status (3)

Country Link
JP (1) JP5290496B2 (en)
DE (1) DE102005049233A1 (en)
GB (2) GB0423032D0 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010287300A (en) * 2009-06-15 2010-12-24 Wd Media Singapore Pte Ltd Method for manufacturing magnetic recording medium

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4714536A (en) * 1985-08-26 1987-12-22 Varian Associates, Inc. Planar magnetron sputtering device with combined circumferential and radial movement of magnetic fields
JP3238459B2 (en) * 1992-03-12 2001-12-17 株式会社半導体エネルギー研究所 Manufacturing method of aluminum nitride thin film
JPH0913165A (en) * 1995-06-28 1997-01-14 Asahi Glass Co Ltd Radio wave transmissive heat ray cut-off film and its film formation
JPH09176852A (en) * 1995-12-21 1997-07-08 Sony Disc Technol:Kk Magnetron sputtering device
JPH10195649A (en) * 1996-12-27 1998-07-28 Sony Corp Magnetron sputter device and manufacture of semiconductor device
JP4213777B2 (en) * 1997-12-26 2009-01-21 パナソニック株式会社 Sputtering apparatus and method
JP2000192239A (en) * 1998-12-22 2000-07-11 Matsushita Electric Ind Co Ltd Sputtering method and sputtering device
GB2386128B (en) * 2000-12-05 2004-08-04 Trikon Holdings Ltd Magnetron sputtering apparatus
GB2393321B (en) * 2002-04-06 2005-06-29 Gencoa Ltd Plasma generation
GB0409337D0 (en) * 2004-04-27 2004-06-02 Trikon Technologies Ltd Methods and apparatus for controlling rotating magnetic fields
JP4040607B2 (en) * 2004-06-14 2008-01-30 芝浦メカトロニクス株式会社 Sputtering apparatus and method, and sputtering control program

Also Published As

Publication number Publication date
JP5290496B2 (en) 2013-09-18
GB0521001D0 (en) 2005-11-23
GB2419138B (en) 2009-08-19
DE102005049233A1 (en) 2006-04-20
JP2006138010A (en) 2006-06-01
GB2419138A (en) 2006-04-19

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)