GB0405844D0 - "Microelectronic and optoelectronic device packaging" - Google Patents
"Microelectronic and optoelectronic device packaging"Info
- Publication number
- GB0405844D0 GB0405844D0 GBGB0405844.2A GB0405844A GB0405844D0 GB 0405844 D0 GB0405844 D0 GB 0405844D0 GB 0405844 A GB0405844 A GB 0405844A GB 0405844 D0 GB0405844 D0 GB 0405844D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- microelectronic
- optoelectronic device
- device packaging
- packaging
- optoelectronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000004377 microelectronic Methods 0.000 title 1
- 230000005693 optoelectronics Effects 0.000 title 1
- 238000004806 packaging method and process Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/03—Processes for manufacturing substrate-free structures
- B81C2201/034—Moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0405844.2A GB0405844D0 (en) | 2004-03-16 | 2004-03-16 | "Microelectronic and optoelectronic device packaging" |
PCT/GB2005/000654 WO2005091352A1 (en) | 2004-03-16 | 2005-02-22 | Packaging of microelectronic, optoelectronic and other devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0405844.2A GB0405844D0 (en) | 2004-03-16 | 2004-03-16 | "Microelectronic and optoelectronic device packaging" |
Publications (1)
Publication Number | Publication Date |
---|---|
GB0405844D0 true GB0405844D0 (en) | 2004-04-21 |
Family
ID=32117750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB0405844.2A Ceased GB0405844D0 (en) | 2004-03-16 | 2004-03-16 | "Microelectronic and optoelectronic device packaging" |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB0405844D0 (en) |
WO (1) | WO2005091352A1 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0314245A (en) * | 1989-06-13 | 1991-01-22 | Toshiba Corp | Resin-sealing method for semiconductor device |
JP2994171B2 (en) * | 1993-05-11 | 1999-12-27 | 株式会社東芝 | Method for manufacturing semiconductor device and method for manufacturing sealing member |
JPH11105474A (en) * | 1997-10-03 | 1999-04-20 | Tsutsunaka Plast Ind Co Ltd | Non-contact type ic card and its manufacture |
FR2793054B1 (en) * | 1999-04-29 | 2001-06-29 | Schlumberger Systems & Service | METHOD FOR MANUFACTURING CONTACTLESS CARDS BY LAMINATION AND CONTACTLESS CARD MANUFACTURED ACCORDING TO SUCH A PROCESS |
-
2004
- 2004-03-16 GB GBGB0405844.2A patent/GB0405844D0/en not_active Ceased
-
2005
- 2005-02-22 WO PCT/GB2005/000654 patent/WO2005091352A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2005091352A1 (en) | 2005-09-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) |