GB0404459D0 - "Connecting method and connecting structure of printed circuit boards" - Google Patents
"Connecting method and connecting structure of printed circuit boards"Info
- Publication number
- GB0404459D0 GB0404459D0 GBGB0404459.0A GB0404459A GB0404459D0 GB 0404459 D0 GB0404459 D0 GB 0404459D0 GB 0404459 A GB0404459 A GB 0404459A GB 0404459 D0 GB0404459 D0 GB 0404459D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- printed circuit
- circuit boards
- connecting structure
- connecting method
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000242784A JP3767346B2 (en) | 2000-08-04 | 2000-08-04 | Connection method of printed wiring board |
JP2000397994A JP3800958B2 (en) | 2000-12-27 | 2000-12-27 | Printed wiring board connection method and connection structure |
GB0118814A GB2368471B (en) | 2000-08-04 | 2001-08-01 | Connecting method and connecting structure of printed circuit boards |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0404459D0 true GB0404459D0 (en) | 2004-03-31 |
GB2398936A GB2398936A (en) | 2004-09-01 |
GB2398936B GB2398936B (en) | 2005-03-02 |
Family
ID=32830353
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0404460A Expired - Fee Related GB2398937B (en) | 2000-08-04 | 2001-08-01 | Connecting method and connecting structure of printed circuit boards |
GB0404459A Expired - Fee Related GB2398936B (en) | 2000-08-04 | 2001-08-01 | Connecting method and connecting structure of printed circuit boards |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0404460A Expired - Fee Related GB2398937B (en) | 2000-08-04 | 2001-08-01 | Connecting method and connecting structure of printed circuit boards |
Country Status (1)
Country | Link |
---|---|
GB (2) | GB2398937B (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2667744B2 (en) * | 1991-02-28 | 1997-10-27 | ローム株式会社 | Display device electrode connection method |
JPH06342976A (en) * | 1993-06-01 | 1994-12-13 | Nippondenso Co Ltd | Connecting method for board |
US6089442A (en) * | 1996-04-10 | 2000-07-18 | Canon Kabushiki Kaisha | Electrode connection method |
-
2001
- 2001-08-01 GB GB0404460A patent/GB2398937B/en not_active Expired - Fee Related
- 2001-08-01 GB GB0404459A patent/GB2398936B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2398937A (en) | 2004-09-01 |
GB2398937B (en) | 2005-03-02 |
GB2398936B (en) | 2005-03-02 |
GB2398936A (en) | 2004-09-01 |
GB0404460D0 (en) | 2004-03-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2368471B (en) | Connecting method and connecting structure of printed circuit boards | |
SG108290A1 (en) | Printed wiring board and method of manufacturing printed wiring board | |
GB9918909D0 (en) | Printed circuit board and method of producing the same | |
EP1164823A3 (en) | Printed circuit board and method of manufacturing the same | |
SG86345A1 (en) | Circuit board and method of manufacturing the same | |
SG115480A1 (en) | Printed circuit board and its manufacturing method | |
SG108830A1 (en) | Printed wiring board and method for manufacturing printed wiring board | |
SG73469A1 (en) | Solder resist composition and printed circuit boards | |
SG82007A1 (en) | Compositions for use in the fabrication of circuit components and printed wire boards | |
IL142354A0 (en) | Multi-layer printed circuit board fabrication system and method | |
AU2283501A (en) | Method of manufacture of printed wiring boards and flexible circuitry | |
SG44314A1 (en) | Printed circuit board and method of connecting electronic parts | |
TW539392U (en) | Fixation structure of circuit board and information process device using the same | |
DE69935566D1 (en) | Printed circuit board and method of making the same | |
EP0692927A3 (en) | Improved printed circuit board and method | |
GB9820932D0 (en) | Circuit board and connection method | |
GB9927232D0 (en) | Printed wiring board and method of manufacturing the same | |
SG80603A1 (en) | Printed circuit boards with cavity and method of producing the same | |
SG109405A1 (en) | Printed circuit boards with solid interconnect and method of producing the same | |
GB0404459D0 (en) | "Connecting method and connecting structure of printed circuit boards" | |
EP1042092A4 (en) | Component of printed circuit boards | |
TW443704U (en) | Separation post of printed circuit board | |
SG97854A1 (en) | Method of fabricating printed wiring board | |
GB9826264D0 (en) | Circuit board architecture and method of manufacture | |
GB2338347B (en) | Production of printed circuit boards |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
746 | Register noted 'licences of right' (sect. 46/1977) |
Effective date: 20051205 |
|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20180801 |