GB0403011D0 - Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition - Google Patents

Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition

Info

Publication number
GB0403011D0
GB0403011D0 GBGB0403011.0A GB0403011A GB0403011D0 GB 0403011 D0 GB0403011 D0 GB 0403011D0 GB 0403011 A GB0403011 A GB 0403011A GB 0403011 D0 GB0403011 D0 GB 0403011D0
Authority
GB
United Kingdom
Prior art keywords
adhesive composition
cationic polymerizable
carbon atoms
anisotropically electroconductive
stabilizer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0403011.0A
Other versions
GB2393730B (en
GB2393730A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of GB0403011D0 publication Critical patent/GB0403011D0/en
Publication of GB2393730A publication Critical patent/GB2393730A/en
Application granted granted Critical
Publication of GB2393730B publication Critical patent/GB2393730B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)

Abstract

A cationic polymerizable adhesive composition comprising a cationic polymerizable monomer selected from an epoxy monomer, a vinyl ether monomer and a mixture thereof, a cationic polymerization catalyst and a stabilizer, wherein the stabilizer is at least one acid amide represented by the following Formula (I) wherein R<1> is an alkyl group having from 1 to 30 carbon atoms or an alkenyl group containing one or two unsaturated bond(s) and having from 2 to 30 carbon atoms, and each R<2> is independently hydrogen or an alkyl group having from 1 to 10 carbon atoms.
GB0403011A 2001-09-13 2002-07-19 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition Expired - Fee Related GB2393730B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001278507A JP2003082318A (en) 2001-09-13 2001-09-13 Cationically polymerizable adhesive composition and anisotropically electroconductive adhesive composition
PCT/US2002/022998 WO2003022949A1 (en) 2001-09-13 2002-07-19 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition

Publications (3)

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GB0403011D0 true GB0403011D0 (en) 2004-03-17
GB2393730A GB2393730A (en) 2004-04-07
GB2393730B GB2393730B (en) 2005-05-18

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CN (1) CN1289621C (en)
GB (1) GB2393730B (en)
WO (1) WO2003022949A1 (en)

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WO2005002002A1 (en) * 2003-06-25 2005-01-06 Hitachi Chemical Co., Ltd. Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
JP5323310B2 (en) * 2005-11-10 2013-10-23 日立化成株式会社 Connection structure and manufacturing method thereof
JP2007214533A (en) * 2006-01-16 2007-08-23 Hitachi Chem Co Ltd Conductive bonding film and solar cell module
JP2011049612A (en) * 2006-01-16 2011-03-10 Hitachi Chem Co Ltd Method of manufacturing solar cell module
US9173302B2 (en) 2006-08-29 2015-10-27 Hitachi Chemical Company, Ltd. Conductive adhesive film and solar cell module
WO2008044357A1 (en) * 2006-10-10 2008-04-17 Hitachi Chemical Company, Ltd. Connected structure and method for manufacture thereof
CN100402620C (en) * 2006-11-13 2008-07-16 浙江理工大学 Method of preparing high performance conductive glue
JP2008135654A (en) * 2006-11-29 2008-06-12 Sanyo Electric Co Ltd Solar battery module
JP4564977B2 (en) * 2007-04-05 2010-10-20 東京応化工業株式会社 Photosensitive resin composition, method for producing resist pattern, laminate, and device
JP6047437B2 (en) * 2012-03-30 2016-12-21 積水化学工業株式会社 Conductive material, connection structure, and manufacturing method of connection structure
CN102719199A (en) * 2012-04-23 2012-10-10 苏州异导光电材料科技有限公司 Preparation method of three-dimensional anisotropic conductive film
CN106947409B (en) * 2012-06-29 2018-12-11 大自达电线股份有限公司 Conductive adhesive composition, conductive adhesive film, adhesive method and circuit base plate
KR101706818B1 (en) * 2014-04-30 2017-02-15 제일모직주식회사 A composition for use of anisotropic conductive film, anisotropic conductive film, and semiconductor device
KR101712703B1 (en) * 2014-07-18 2017-03-06 삼성에스디아이 주식회사 Adhesive composition, anisotropic conductive film and the semiconductor device using thereof
KR101706821B1 (en) * 2014-09-01 2017-02-14 삼성에스디아이 주식회사 An anisotropic conductive film and a semi-conductive device connected by the film
JP7013638B2 (en) * 2016-05-31 2022-02-01 昭和電工マテリアルズ株式会社 Adhesive composition and film-like adhesive composition
TWI672351B (en) 2018-08-21 2019-09-21 財團法人工業技術研究院 Photosensitive adhesive composition, photosensitive conductive adhesive composition and electrical device employing the photosensitive conductive adhesive composition

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US3386955A (en) * 1966-01-14 1968-06-04 American Cyanamid Co Substituted ureas as low temperature epoxy curing agents
DE3508601A1 (en) * 1985-03-11 1986-09-11 Dynamit Nobel Ag, 5210 Troisdorf Metal foil having an adhesive-agent coating for base materials for printed circuits, and a method for producing the base material
EP0200678B1 (en) * 1985-04-02 1990-09-12 Ciba-Geigy Ag Method for glueing surfaces with a curable epoxy resin composition
JPH05262815A (en) * 1992-03-18 1993-10-12 Nippon Oil & Fats Co Ltd Reactive composition

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WO2003022949A1 (en) 2003-03-20
CN1289621C (en) 2006-12-13
CN1555405A (en) 2004-12-15
GB2393730B (en) 2005-05-18
GB2393730A (en) 2004-04-07
JP2003082318A (en) 2003-03-19

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