GB0212030D0 - Method of producing ceramic laminates,laminated electronic parts and method of producing the same - Google Patents
Method of producing ceramic laminates,laminated electronic parts and method of producing the sameInfo
- Publication number
- GB0212030D0 GB0212030D0 GBGB0212030.1A GB0212030A GB0212030D0 GB 0212030 D0 GB0212030 D0 GB 0212030D0 GB 0212030 A GB0212030 A GB 0212030A GB 0212030 D0 GB0212030 D0 GB 0212030D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- producing
- same
- electronic parts
- laminated electronic
- ceramic laminates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
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- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
- B32B2309/022—Temperature vs pressure profiles
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- B32B2311/22—Nickel or cobalt
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
- C04B2235/661—Multi-step sintering
- C04B2235/662—Annealing after sintering
- C04B2235/663—Oxidative annealing
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/345—Refractory metal oxides
- C04B2237/346—Titania or titanates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/405—Iron metal group, e.g. Co or Ni
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/706—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0419635A GB2402103B (en) | 2001-05-25 | 2002-05-24 | Method of producing ceramic laminates, laminated electronic parts and method of producing the same. |
GB0419632A GB2402102B (en) | 2001-05-25 | 2002-05-24 | Laminated electronic parts and method of producing the same |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001157699A JP3726035B2 (en) | 2001-05-25 | 2001-05-25 | Manufacturing method of ceramic laminate |
JP2001197119A JP3527899B2 (en) | 2001-06-28 | 2001-06-28 | Laminated electronic component and method of manufacturing the same |
JP2001236376A JP4663173B2 (en) | 2001-08-03 | 2001-08-03 | Manufacturing method of ceramic laminate |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0212030D0 true GB0212030D0 (en) | 2002-07-03 |
GB2376207A GB2376207A (en) | 2002-12-11 |
GB2376207B GB2376207B (en) | 2005-03-30 |
Family
ID=27346788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0212030A Expired - Fee Related GB2376207B (en) | 2001-05-25 | 2002-05-24 | Method of producing ceramic laminates,laminated electronic parts and method of producing the same |
Country Status (3)
Country | Link |
---|---|
US (1) | US7089659B2 (en) |
CN (2) | CN1949420B (en) |
GB (1) | GB2376207B (en) |
Cited By (1)
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CN112341191A (en) * | 2020-10-26 | 2021-02-09 | 同济大学 | Lead-free ceramic dielectric with high energy storage density and high energy storage efficiency and preparation method thereof |
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GB2376207B (en) * | 2001-05-25 | 2005-03-30 | Kyocera Corp | Method of producing ceramic laminates,laminated electronic parts and method of producing the same |
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US7638010B2 (en) * | 2003-07-09 | 2009-12-29 | Tdk Corporation | Multilayer ceramic device and the production method thereof |
CN101019196B (en) * | 2004-10-13 | 2010-07-28 | 松下电器产业株式会社 | Production method for laminated ceramic electronic components and production device therefor |
JP2006324637A (en) * | 2005-04-21 | 2006-11-30 | Tdk Corp | Co-existent material particle and its method for manufacturing, method for manufacturing electrode paste, electronic parts |
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US20070193675A1 (en) * | 2006-02-22 | 2007-08-23 | Abhijit Gurav | Process of manufacturing a multilayer device and device manufactured thereby |
US20070227641A1 (en) * | 2006-04-04 | 2007-10-04 | Skamser Daniel J | Flowable compensation layer for multilayer devices |
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US7875140B2 (en) * | 2007-11-20 | 2011-01-25 | Seiko Epson Corporation | Method for manufacturing multilayer ceramic substrate |
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JP2015156470A (en) * | 2014-01-14 | 2015-08-27 | Tdk株式会社 | Laminated ceramic electronic component |
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JP2020031152A (en) * | 2018-08-23 | 2020-02-27 | 太陽誘電株式会社 | Multilayer ceramic electronic component, multilayer ceramic electronic component mounting substrate, multilayer ceramic electronic component packing body, and manufacturing method of the multilayer ceramic electronic component |
US11667585B2 (en) | 2018-09-19 | 2023-06-06 | Apple, Inc. | Ceramic substrate with glass fill for decoration and housing materials |
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KR20190116138A (en) * | 2019-07-18 | 2019-10-14 | 삼성전기주식회사 | Multilayered capacitor and board having the same mounted thereon |
TWI766181B (en) * | 2019-08-16 | 2022-06-01 | 興勤電子工業股份有限公司 | Use of ceramic composition for thermistor, use of ceramic sintered body for thermistor, thermistor and method for producing the same |
CN112408975B (en) * | 2019-08-23 | 2022-11-04 | 兴勤电子工业股份有限公司 | Ceramic composition, ceramic sintered body, multilayer ceramic electronic component and method for producing the same |
KR20210084284A (en) * | 2019-12-27 | 2021-07-07 | 가부시키가이샤 무라타 세이사쿠쇼 | Multilayer ceramic capacitor |
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JP2022083832A (en) * | 2020-11-25 | 2022-06-06 | Tdk株式会社 | Multilayer electronic component |
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JPH0266916A (en) * | 1988-08-31 | 1990-03-07 | Nec Corp | Manufacture of laminated ceramic capacitor |
JPH0310502A (en) * | 1989-06-08 | 1991-01-18 | Oki Electric Ind Co Ltd | Voltage controlled oscillator |
JPH03105905A (en) | 1989-09-19 | 1991-05-02 | Tokin Corp | Manufacture of laminated ceramic capacitor |
JP3470812B2 (en) * | 1992-02-05 | 2003-11-25 | 株式会社村田製作所 | Manufacturing method of ceramic laminated electronic component |
DE4334059A1 (en) * | 1993-10-06 | 1995-04-13 | Philips Patentverwaltung | Laminated film, multi-color screen printing process for their production and their use |
US5480503A (en) * | 1993-12-30 | 1996-01-02 | International Business Machines Corporation | Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof |
JP3146872B2 (en) * | 1994-08-31 | 2001-03-19 | 株式会社村田製作所 | Method of forming electrodes on ceramic green sheet and method of manufacturing multilayer ceramic electronic component |
JPH09153429A (en) * | 1995-11-30 | 1997-06-10 | Murata Mfg Co Ltd | Manufacture of laminated ceramic electronic component |
JP3166693B2 (en) | 1997-12-22 | 2001-05-14 | 松下電器産業株式会社 | Manufacturing method of multilayer ceramic electronic component |
US5935358A (en) * | 1998-04-17 | 1999-08-10 | New Create Corporation | Method of producing a laminate ceramic capacitor |
JP3758442B2 (en) * | 1999-02-23 | 2006-03-22 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic capacitor |
JP3767362B2 (en) * | 1999-12-13 | 2006-04-19 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic electronic component |
GB2376207B (en) * | 2001-05-25 | 2005-03-30 | Kyocera Corp | Method of producing ceramic laminates,laminated electronic parts and method of producing the same |
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2002
- 2002-05-24 GB GB0212030A patent/GB2376207B/en not_active Expired - Fee Related
- 2002-05-24 US US10/155,702 patent/US7089659B2/en not_active Expired - Fee Related
- 2002-05-25 CN CN2006100069267A patent/CN1949420B/en not_active Expired - Fee Related
- 2002-05-25 CN CNB021303932A patent/CN1308978C/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112341191A (en) * | 2020-10-26 | 2021-02-09 | 同济大学 | Lead-free ceramic dielectric with high energy storage density and high energy storage efficiency and preparation method thereof |
Also Published As
Publication number | Publication date |
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CN1949420B (en) | 2011-01-19 |
CN1308978C (en) | 2007-04-04 |
GB2376207B (en) | 2005-03-30 |
US20030016484A1 (en) | 2003-01-23 |
CN1949420A (en) | 2007-04-18 |
CN1423288A (en) | 2003-06-11 |
GB2376207A (en) | 2002-12-11 |
US7089659B2 (en) | 2006-08-15 |
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PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20140524 |