GB0209663D0 - None available at this present time - Google Patents
None available at this present timeInfo
- Publication number
- GB0209663D0 GB0209663D0 GBGB0209663.4A GB0209663A GB0209663D0 GB 0209663 D0 GB0209663 D0 GB 0209663D0 GB 0209663 A GB0209663 A GB 0209663A GB 0209663 D0 GB0209663 D0 GB 0209663D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- present time
- none available
- none
- available
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001091298A JP2002289489A (en) | 2001-03-27 | 2001-03-27 | Apparatus for forming end face electrode of electronic component |
PCT/JP2002/002822 WO2002078027A1 (en) | 2001-03-27 | 2002-03-25 | End surface electrode forming device for electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0209663D0 true GB0209663D0 (en) | 2002-06-05 |
GB2400492A GB2400492A (en) | 2004-10-13 |
Family
ID=18945941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0209663A Withdrawn GB2400492A (en) | 2001-03-27 | 2002-03-25 | End surface electrode forming device for electronic parts |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP2002289489A (en) |
KR (1) | KR20030005159A (en) |
CN (1) | CN1291431C (en) |
GB (1) | GB2400492A (en) |
TW (1) | TW541697B (en) |
WO (1) | WO2002078027A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113286665A (en) * | 2019-01-11 | 2021-08-20 | 新烯科技有限公司 | Slurry coating device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7500307B2 (en) * | 2004-09-22 | 2009-03-10 | Avery Dennison Corporation | High-speed RFID circuit placement method |
CN109904012B (en) * | 2019-03-15 | 2021-05-18 | 广东星耀光大智能装备有限公司 | Multi-terminal component end sealing machine |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0616474B2 (en) * | 1984-12-06 | 1994-03-02 | 松下電器産業株式会社 | Electrode forming method for chip electronic components |
JPH0922843A (en) * | 1995-07-07 | 1997-01-21 | Taiyo Yuden Co Ltd | Method of forming outer electrode of chip component |
-
2001
- 2001-03-27 JP JP2001091298A patent/JP2002289489A/en active Pending
-
2002
- 2002-03-25 KR KR1020027006910A patent/KR20030005159A/en not_active Application Discontinuation
- 2002-03-25 GB GB0209663A patent/GB2400492A/en not_active Withdrawn
- 2002-03-25 CN CNB028006801A patent/CN1291431C/en not_active Expired - Fee Related
- 2002-03-25 WO PCT/JP2002/002822 patent/WO2002078027A1/en active Application Filing
- 2002-03-26 TW TW091105881A patent/TW541697B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113286665A (en) * | 2019-01-11 | 2021-08-20 | 新烯科技有限公司 | Slurry coating device |
CN113286665B (en) * | 2019-01-11 | 2023-01-03 | 新烯科技有限公司 | Slurry coating device |
Also Published As
Publication number | Publication date |
---|---|
CN1291431C (en) | 2006-12-20 |
TW541697B (en) | 2003-07-11 |
KR20030005159A (en) | 2003-01-17 |
GB2400492A (en) | 2004-10-13 |
CN1459118A (en) | 2003-11-26 |
JP2002289489A (en) | 2002-10-04 |
WO2002078027A1 (en) | 2002-10-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |