GB0115623D0 - Electronic apparatus housing - Google Patents
Electronic apparatus housingInfo
- Publication number
- GB0115623D0 GB0115623D0 GBGB0115623.1A GB0115623A GB0115623D0 GB 0115623 D0 GB0115623 D0 GB 0115623D0 GB 0115623 A GB0115623 A GB 0115623A GB 0115623 D0 GB0115623 D0 GB 0115623D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- electronic apparatus
- apparatus housing
- housing
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0115623A GB2377085A (en) | 2001-06-27 | 2001-06-27 | Electronic apparatus housing with heating/cooling system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0115623A GB2377085A (en) | 2001-06-27 | 2001-06-27 | Electronic apparatus housing with heating/cooling system |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0115623D0 true GB0115623D0 (en) | 2001-08-15 |
GB2377085A GB2377085A (en) | 2002-12-31 |
Family
ID=9917391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0115623A Withdrawn GB2377085A (en) | 2001-06-27 | 2001-06-27 | Electronic apparatus housing with heating/cooling system |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2377085A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2333855A1 (en) * | 2009-12-11 | 2011-06-15 | Alcatel Lucent | Energy recuperation for outside plant deployments |
FI127872B (en) * | 2010-10-14 | 2019-04-30 | Compusteel Oy | Peltier-type cooler |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5067040A (en) * | 1990-09-24 | 1991-11-19 | Joel Fallik | Expandable refrigerated enclosure for computer boards |
US5655375A (en) * | 1996-06-24 | 1997-08-12 | Y.B.S. Enterprises, Inc. | Antenna mast-top mountable thermo-electrically cooled amplifier enclosure system |
US5934079A (en) * | 1997-09-09 | 1999-08-10 | Samsung Electronics Co., Ltd. | Base station heat management system |
US5987890A (en) * | 1998-06-19 | 1999-11-23 | International Business Machines Company | Electronic component cooling using a heat transfer buffering capability |
US6094919A (en) * | 1999-01-04 | 2000-08-01 | Intel Corporation | Package with integrated thermoelectric module for cooling of integrated circuits |
-
2001
- 2001-06-27 GB GB0115623A patent/GB2377085A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB2377085A (en) | 2002-12-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |