FR3122803B1 - Boitier comportant une paroi composite integrant au moins un conduit de refroidissement - Google Patents

Boitier comportant une paroi composite integrant au moins un conduit de refroidissement Download PDF

Info

Publication number
FR3122803B1
FR3122803B1 FR2104913A FR2104913A FR3122803B1 FR 3122803 B1 FR3122803 B1 FR 3122803B1 FR 2104913 A FR2104913 A FR 2104913A FR 2104913 A FR2104913 A FR 2104913A FR 3122803 B1 FR3122803 B1 FR 3122803B1
Authority
FR
France
Prior art keywords
composite wall
housing
cooling duct
heat transfer
transfer device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2104913A
Other languages
English (en)
Other versions
FR3122803A1 (fr
Inventor
Muriel Sabah
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Safran Electronics and Defense SAS
Original Assignee
Safran Electronics and Defense SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Safran Electronics and Defense SAS filed Critical Safran Electronics and Defense SAS
Priority to FR2104913A priority Critical patent/FR3122803B1/fr
Priority to US17/738,905 priority patent/US20220361370A1/en
Publication of FR3122803A1 publication Critical patent/FR3122803A1/fr
Application granted granted Critical
Publication of FR3122803B1 publication Critical patent/FR3122803B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H05K7/20672—Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263—Heat dissipaters releasing heat from coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention porte sur un boîtier (10) comportant: - au moins une paroi composite (12) comportant des fibres de carbone (15) tissées ou tressées recouvertes par une résine (16) thermoplastique ou thermodurcissable, - une carte électronique (18) portant des composants électroniques (19), et - un dispositif de transfert de chaleur (24) ayant au moins une portion disposée en regard d'un composant électronique (19) à refroidir de la carte électronique (18), ledit dispositif de transfert de chaleur (24) étant inséré à l'intérieur de la paroi composite (12), - le dispositif de transfert de chaleur (24) comportant au moins un conduit de refroidissement (25) contenant un fluide de refroidissement. Figure 3
FR2104913A 2021-05-10 2021-05-10 Boitier comportant une paroi composite integrant au moins un conduit de refroidissement Active FR3122803B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR2104913A FR3122803B1 (fr) 2021-05-10 2021-05-10 Boitier comportant une paroi composite integrant au moins un conduit de refroidissement
US17/738,905 US20220361370A1 (en) 2021-05-10 2022-05-06 Housing comprising a composite wall integrating at least one cooling conduit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2104913A FR3122803B1 (fr) 2021-05-10 2021-05-10 Boitier comportant une paroi composite integrant au moins un conduit de refroidissement
FR2104913 2021-05-10

Publications (2)

Publication Number Publication Date
FR3122803A1 FR3122803A1 (fr) 2022-11-11
FR3122803B1 true FR3122803B1 (fr) 2023-07-21

Family

ID=77180115

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2104913A Active FR3122803B1 (fr) 2021-05-10 2021-05-10 Boitier comportant une paroi composite integrant au moins un conduit de refroidissement

Country Status (2)

Country Link
US (1) US20220361370A1 (fr)
FR (1) FR3122803B1 (fr)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2803166B1 (fr) * 1999-12-28 2002-05-31 Thomson Csf Sextant Module electronique a haut pouvoir de refroidissement
JP3726152B2 (ja) * 2000-10-13 2005-12-14 富士重工業株式会社 複合材表皮熱輸送パネルおよびそれを適用したハニカムパネル
FR2969379B1 (fr) * 2010-12-17 2013-02-15 Thales Sa Refroidissement d'un equipement electronique
FR3008921B1 (fr) * 2013-07-23 2015-12-25 Safran Piece en materiau composite avec portion de conductivite thermique et electrique et procede de fabrication d'une telle piece
TWI565373B (zh) * 2014-09-29 2017-01-01 先豐通訊股份有限公司 相變化導熱式之電路板模組及其電路板結構
US9750127B2 (en) * 2015-12-04 2017-08-29 General Electric Company Circuit card assembly including heat transfer assembly and method of manufacturing such
FR3091140B1 (fr) 2018-12-19 2020-12-11 Safran Electronics & Defense Boîtier comportant un dispositif de transfert de chaleur a base de picots metalliques inseres dans une paroi du boitier
US11324143B2 (en) * 2019-12-30 2022-05-03 GM Cruise Holdings, LLC Embedded and immersed heat pipes in automated driving system computers

Also Published As

Publication number Publication date
US20220361370A1 (en) 2022-11-10
FR3122803A1 (fr) 2022-11-11

Similar Documents

Publication Publication Date Title
RU2738736C2 (ru) Световая головка для использования при футеровке труб
BR0207264A (pt) Sistema de fluxo para avaliação e produção de dispositivo médico
FR3122803B1 (fr) Boitier comportant une paroi composite integrant au moins un conduit de refroidissement
DE3377342D1 (en) The lining of pipelines or passageways
DK200000242A (da) Fleksibel armeret rørledning, samt anvendelse af samme
ES2276645T1 (es) Valvula con fuga controlada para surtidor de refrigeracion del piston.
FR2693252B1 (fr) Dispositif pour adapter un élément chaud sur un corps creux en matière thermoplastique comportant au moins une arrivée de fluide froid, et corps creux comportant un tel dispositif.
ATE411497T1 (de) Klimaanlage mit wärmetausch zwischen einer natürlichen wärmequelle und der klimatisierten luft
BR0009216A (pt) Aparelho de têmpera
NO20031690D0 (no) Ventileringsinnretning for fôret rörledning
AR108730A1 (es) Equipo filtrante para instalaciones de calefacción y similares
BR0105298B1 (pt) condutor de fornecimento de fluido e amortecimento de pulsaÇÕes de pressço.
US7213409B1 (en) Reconfigurable hydrogen transfer heating/cooling system
DE3162296D1 (en) Heating system in combination with a i.c. engine
KR101720249B1 (ko) 유체 확인용 사이트 글라스
CN105765280A (zh) 用于调节环路中液体的***
CN206972944U (zh) 一种可调节的不锈钢波纹煤气管
CN208608889U (zh) 模块冷却机构和变频器
US2206258A (en) Impeller
CN108286653A (zh) 一种液膜润滑的泥料管道输送***
FR3091140B1 (fr) Boîtier comportant un dispositif de transfert de chaleur a base de picots metalliques inseres dans une paroi du boitier
WO2021036951A1 (fr) Appareil à cycle frigorifique portable
US1267702A (en) Cooling of pistons.
KR20100072868A (ko) 배관 역류방지용 판 체크밸브
CN206669132U (zh) 一种多功能连续复合材料管道

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20221111

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4