FR3113793B1 - OCXO or OCMO type oscillator and corresponding manufacturing process - Google Patents

OCXO or OCMO type oscillator and corresponding manufacturing process Download PDF

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Publication number
FR3113793B1
FR3113793B1 FR2008874A FR2008874A FR3113793B1 FR 3113793 B1 FR3113793 B1 FR 3113793B1 FR 2008874 A FR2008874 A FR 2008874A FR 2008874 A FR2008874 A FR 2008874A FR 3113793 B1 FR3113793 B1 FR 3113793B1
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France
Prior art keywords
ocmo
ocxo
type oscillator
manufacturing process
micro
Prior art date
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Active
Application number
FR2008874A
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French (fr)
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FR3113793A1 (en
Inventor
Nicolas Vorobyev
Cyril Boissy
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Syrlinks SAS
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Syrlinks SAS
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Priority to FR2008874A priority Critical patent/FR3113793B1/en
Publication of FR3113793A1 publication Critical patent/FR3113793A1/en
Application granted granted Critical
Publication of FR3113793B1 publication Critical patent/FR3113793B1/en
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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
    • H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
    • H03L1/04—Constructional details for maintaining temperature constant
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/08—Holders with means for regulating temperature

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Oscillators With Electromechanical Resonators (AREA)

Abstract

Un oscillateur de type OCXO ou OCMO (100, 300) comprend une structure de thermorégulation dans laquelle sont disposés un résonateur (3), une sonde de température (4) et un élément chauffant (5). La structure de thermorégulation comprend elle-même : une partie formant four (1), réalisée dans un matériau thermo-conducteur et micro-usinable, et comprenant une cavité micro-usinée (6) dans laquelle sont logés le résonateur, la sonde de température et l’élément chauffant ; et une partie formant couvercle (2), réalisée dans un matériau thermo-isolant, et fermant la cavité micro-usinée (6) en étant scellée hermétiquement sur la partie formant four (1). Figure 1An OCXO or OCMO type oscillator (100, 300) comprises a thermoregulation structure in which a resonator (3), a temperature probe (4) and a heating element (5) are arranged. The thermoregulation structure itself comprises: an oven part (1), made of a thermally conductive and micro-machinable material, and comprising a micro-machined cavity (6) in which the resonator, the temperature probe are housed and the heating element; and a cover part (2), made of a heat-insulating material, and closing the micro-machined cavity (6) by being hermetically sealed on the oven part (1). Figure 1

FR2008874A 2020-09-01 2020-09-01 OCXO or OCMO type oscillator and corresponding manufacturing process Active FR3113793B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR2008874A FR3113793B1 (en) 2020-09-01 2020-09-01 OCXO or OCMO type oscillator and corresponding manufacturing process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2008874 2020-09-01
FR2008874A FR3113793B1 (en) 2020-09-01 2020-09-01 OCXO or OCMO type oscillator and corresponding manufacturing process

Publications (2)

Publication Number Publication Date
FR3113793A1 FR3113793A1 (en) 2022-03-04
FR3113793B1 true FR3113793B1 (en) 2023-10-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
FR2008874A Active FR3113793B1 (en) 2020-09-01 2020-09-01 OCXO or OCMO type oscillator and corresponding manufacturing process

Country Status (1)

Country Link
FR (1) FR3113793B1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6060692A (en) * 1998-09-02 2000-05-09 Cts Corporation Low power compact heater for piezoelectric device
US6627814B1 (en) * 2002-03-22 2003-09-30 David H. Stark Hermetically sealed micro-device package with window
JP2017139682A (en) * 2016-02-05 2017-08-10 セイコーエプソン株式会社 Vibration piece, manufacturing method for the same, oscillator, electronic apparatus, movable body, and base station

Also Published As

Publication number Publication date
FR3113793A1 (en) 2022-03-04

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