FR3113221B1 - Système pour refroidir des cartes serveurs dans un centre de données - Google Patents
Système pour refroidir des cartes serveurs dans un centre de données Download PDFInfo
- Publication number
- FR3113221B1 FR3113221B1 FR2008131A FR2008131A FR3113221B1 FR 3113221 B1 FR3113221 B1 FR 3113221B1 FR 2008131 A FR2008131 A FR 2008131A FR 2008131 A FR2008131 A FR 2008131A FR 3113221 B1 FR3113221 B1 FR 3113221B1
- Authority
- FR
- France
- Prior art keywords
- circuit
- server
- pipe
- server boards
- branch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 title abstract 3
- 239000012530 fluid Substances 0.000 abstract 2
- 230000000630 rising effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1497—Rooms for data centers; Shipping containers therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Système de refroidissement pour refroidir une pluralité de cartes serveurs (3), le système comprenant au moins un circuit de fluide diphasique principal (12), avec une conduite descendante (1), une conduite remontante (2), un raccord bas de boucle (63) et une portion supérieure (64) couplée thermiquement avec au moins un échangeur de restitution de chaleur (4, 4’, 4’’, 4’’’); au moins un évaporateur (5) couplé à une source chaude à refroidir (51-56) dans les cartes serveurs; une pluralité de circuits locaux (14) desservant respectivement une des cartes serveur et fonctionnant en dérivation par rapport au circuit principal (12), chaque circuit local comprenant d’une part une première branche (61), formant une alimentation sur la conduite descendante, et d’autre part une seconde branche (62) formant restitution de fluide dans la conduite remontante (2) du circuit principal, ainsi qu’un circuit auxiliaire interne (65) à la carte serveur raccordé à un ou plusieurs évaporateurs. Figure de l’abrégé : Figure 1
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2008131A FR3113221B1 (fr) | 2020-07-30 | 2020-07-30 | Système pour refroidir des cartes serveurs dans un centre de données |
DE102021118687.0A DE102021118687A1 (de) | 2020-07-30 | 2021-07-20 | System zur kühlung von serverkarten in einem rechenzentrum |
US17/388,495 US11997832B2 (en) | 2020-07-30 | 2021-07-29 | System for cooling server boards in a data center |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2008131A FR3113221B1 (fr) | 2020-07-30 | 2020-07-30 | Système pour refroidir des cartes serveurs dans un centre de données |
FR2008131 | 2020-07-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3113221A1 FR3113221A1 (fr) | 2022-02-04 |
FR3113221B1 true FR3113221B1 (fr) | 2023-04-07 |
Family
ID=73138957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR2008131A Active FR3113221B1 (fr) | 2020-07-30 | 2020-07-30 | Système pour refroidir des cartes serveurs dans un centre de données |
Country Status (3)
Country | Link |
---|---|
US (1) | US11997832B2 (fr) |
DE (1) | DE102021118687A1 (fr) |
FR (1) | FR3113221B1 (fr) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4199018B2 (ja) * | 2003-02-14 | 2008-12-17 | 株式会社日立製作所 | ラックマウントサーバシステム |
US8164901B2 (en) * | 2008-04-16 | 2012-04-24 | Julius Neudorfer | High efficiency heat removal system for rack mounted computer equipment |
US9179574B2 (en) * | 2011-05-24 | 2015-11-03 | International Business Machines Corporation | Cooling unit for container-type data center |
US20130032310A1 (en) * | 2011-08-02 | 2013-02-07 | Power Distribution Inc. | Transportable, environmentally-controlled equipment enclosure |
JP5836029B2 (ja) * | 2011-09-20 | 2015-12-24 | 株式会社日立製作所 | サーバラックの冷却システム及びサーバ機器 |
WO2014132592A1 (fr) * | 2013-02-26 | 2014-09-04 | 日本電気株式会社 | Système de refroidissement d'appareil électronique et procédé de fabrication de système de refroidissement d'appareil électronique |
US10448543B2 (en) * | 2015-05-04 | 2019-10-15 | Google Llc | Cooling electronic devices in a data center |
WO2017066993A1 (fr) * | 2015-10-23 | 2017-04-27 | 华为技术有限公司 | Système de refroidissement par caloduc et équipement énergétique |
IT201600108608A1 (it) * | 2016-10-27 | 2018-04-27 | Rodolfo Caciolli | Sistema di raffreddamento di componenti elettronici produttori di calore |
US10912229B1 (en) * | 2019-08-15 | 2021-02-02 | Baidu Usa Llc | Cooling system for high density racks with multi-function heat exchangers |
CN114762469A (zh) * | 2019-12-05 | 2022-07-15 | 波威特斯金属加工有限责任公司 | 电子***、特别是用于数据中心的冷却*** |
US11406041B1 (en) * | 2020-03-26 | 2022-08-02 | Amazon Technologies, Inc. | Modular liquid cooling assembly |
EP3958659A1 (fr) * | 2020-08-19 | 2022-02-23 | Nokia Technologies Oy | Appareil et systèmes de refroidissement |
US11612083B2 (en) * | 2021-03-05 | 2023-03-21 | Baidu Usa Llc | System and method for phase-change cooling of an electronic rack |
-
2020
- 2020-07-30 FR FR2008131A patent/FR3113221B1/fr active Active
-
2021
- 2021-07-20 DE DE102021118687.0A patent/DE102021118687A1/de active Pending
- 2021-07-29 US US17/388,495 patent/US11997832B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
FR3113221A1 (fr) | 2022-02-04 |
US11997832B2 (en) | 2024-05-28 |
DE102021118687A1 (de) | 2022-02-03 |
US20220039296A1 (en) | 2022-02-03 |
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