FR3112972B1 - Dispositif et procede de depot de revetements epais de nitrures metaliques par la voie fluides supercritique - Google Patents
Dispositif et procede de depot de revetements epais de nitrures metaliques par la voie fluides supercritique Download PDFInfo
- Publication number
- FR3112972B1 FR3112972B1 FR2008073A FR2008073A FR3112972B1 FR 3112972 B1 FR3112972 B1 FR 3112972B1 FR 2008073 A FR2008073 A FR 2008073A FR 2008073 A FR2008073 A FR 2008073A FR 3112972 B1 FR3112972 B1 FR 3112972B1
- Authority
- FR
- France
- Prior art keywords
- enclosure
- volume
- supercritical fluid
- metal nitrides
- depositing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1291—Process of deposition of the inorganic material by heating of the substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/54—Improvements relating to the production of bulk chemicals using solvents, e.g. supercritical solvents or ionic liquids
Abstract
Dispositif et procédé de dépôt de revêtements épais de nitrures métalliques par la voie fluides supercritiques Dispositif (100) de dépôt d’un nitrure métallique épais sur un échantillon (104) par la voie fluides supercritiques comprenant : Une première enceinte (110) formant un premier volume fermé (V1) ; Une deuxième enceinte (120) placé dans la première enceinte et délimitée par des parois internes (102) transparentes aux rayonnements électromagnétiques formant un second volume fermé (V2) destiné à comprendre un fluide en conditions supercritiques ; Un fluide diélectrique caloporteur circulant dans le premier volume autour de la deuxième enceinte ; Un porte-échantillon (105) présent dans le second volume ; Un dispositif de chauffage par induction (103) entourant la deuxième enceinte ; Des entrées (150, 151) pour introduire dans la deuxième enceinte un fluide et au moins un matériau précurseur ; et Une sortie (152) pour purger le second volume. Figure pour l’abrégé : Fig. 1
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2008073A FR3112972B1 (fr) | 2020-07-30 | 2020-07-30 | Dispositif et procede de depot de revetements epais de nitrures metaliques par la voie fluides supercritique |
US18/006,840 US20230304159A1 (en) | 2020-07-30 | 2021-07-21 | Device and method for depositing thick metal nitride coatings by the supercritical fluid route |
CN202180059156.5A CN116157553A (zh) | 2020-07-30 | 2021-07-21 | 通过超临界流体路径沉积厚金属氮化物涂层的装置和方法 |
PCT/FR2021/051364 WO2022023647A1 (fr) | 2020-07-30 | 2021-07-21 | Dispositif et procede de depot de revetements epais de nitrures metalliques par la voie fluides supercritiques |
EP21752089.9A EP4189137A1 (fr) | 2020-07-30 | 2021-07-21 | Dispositif et procede de depot de revetements epais de nitrures metalliques par la voie fluides supercritiques |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2008073A FR3112972B1 (fr) | 2020-07-30 | 2020-07-30 | Dispositif et procede de depot de revetements epais de nitrures metaliques par la voie fluides supercritique |
FR2008073 | 2020-07-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3112972A1 FR3112972A1 (fr) | 2022-02-04 |
FR3112972B1 true FR3112972B1 (fr) | 2022-11-04 |
Family
ID=73643017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR2008073A Active FR3112972B1 (fr) | 2020-07-30 | 2020-07-30 | Dispositif et procede de depot de revetements epais de nitrures metaliques par la voie fluides supercritique |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230304159A1 (fr) |
EP (1) | EP4189137A1 (fr) |
CN (1) | CN116157553A (fr) |
FR (1) | FR3112972B1 (fr) |
WO (1) | WO2022023647A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3139144A1 (fr) | 2022-08-30 | 2024-03-01 | Safran | Procédé de dépôt d'un revêtement en oxyde d'aluminium |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7119418B2 (en) * | 2001-12-31 | 2006-10-10 | Advanced Technology Materials, Inc. | Supercritical fluid-assisted deposition of materials on semiconductor substrates |
US20080220244A1 (en) * | 2004-01-21 | 2008-09-11 | Chien M Wai | Supercritical Fluids in the Formation and Modification of Nanostructures and Nanocomposites |
FR2915753B1 (fr) * | 2007-05-02 | 2009-09-04 | Commissariat Energie Atomique | Procede et dispositif de preparation d'un revetement multicouche sur un substrat |
CN106222707B (zh) * | 2014-12-11 | 2018-02-06 | 江苏理工学院 | 基于超临界流体3d电沉积加工装置 |
-
2020
- 2020-07-30 FR FR2008073A patent/FR3112972B1/fr active Active
-
2021
- 2021-07-21 WO PCT/FR2021/051364 patent/WO2022023647A1/fr active Application Filing
- 2021-07-21 US US18/006,840 patent/US20230304159A1/en active Pending
- 2021-07-21 CN CN202180059156.5A patent/CN116157553A/zh active Pending
- 2021-07-21 EP EP21752089.9A patent/EP4189137A1/fr active Pending
Also Published As
Publication number | Publication date |
---|---|
CN116157553A (zh) | 2023-05-23 |
FR3112972A1 (fr) | 2022-02-04 |
US20230304159A1 (en) | 2023-09-28 |
WO2022023647A1 (fr) | 2022-02-03 |
EP4189137A1 (fr) | 2023-06-07 |
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