FR3102771B1 - Procédé de collage de deux surfaces hydrophiles - Google Patents

Procédé de collage de deux surfaces hydrophiles Download PDF

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Publication number
FR3102771B1
FR3102771B1 FR1912269A FR1912269A FR3102771B1 FR 3102771 B1 FR3102771 B1 FR 3102771B1 FR 1912269 A FR1912269 A FR 1912269A FR 1912269 A FR1912269 A FR 1912269A FR 3102771 B1 FR3102771 B1 FR 3102771B1
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FR
France
Prior art keywords
substrate
hydrophilic surface
hydrophilic
covered
bonding process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1912269A
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English (en)
Other versions
FR3102771A1 (fr
Inventor
Frank Fournel
Aziliz Calvez
Gaëlle Eleouet
Vincent Larrey
Christophe Morales
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR1912269A priority Critical patent/FR3102771B1/fr
Priority to TW109132945A priority patent/TW202119472A/zh
Priority to PCT/FR2020/051888 priority patent/WO2021084188A1/fr
Priority to US17/755,450 priority patent/US20240150617A1/en
Priority to CN202080076923.9A priority patent/CN114641546A/zh
Priority to JP2022525410A priority patent/JP2023500279A/ja
Priority to EP20804618.5A priority patent/EP4051743A1/fr
Publication of FR3102771A1 publication Critical patent/FR3102771A1/fr
Application granted granted Critical
Publication of FR3102771B1 publication Critical patent/FR3102771B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/31—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive effect being based on a Gecko structure

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

Procédé de collage direct comprenant les étapes suivantes :- fourniture d’un premier substrat (10) et d’un deuxième substrat (20), le premier substrat (10) étant recouvert par une première surface hydrophile (11) et le deuxième substrat (20) étant recouvert par une deuxième surface hydrophile (21),- dépôt d’une molécule spécifique (30) sur la première surface hydrophile (11) et/ou sur la deuxième surface hydrophile (21), la molécule spécifique (30) comprenant un groupe fonctionnel hydrophile et un groupe fonctionnel basique, séparés par au moins un atome,- mise en contact de la première surface hydrophile (11) et de la deuxième surface hydrophile (21), moyennant quoi on colle les deux surfaces hydrophiles (11, 21) l’une avec l’autre, et le premier substrat (10) et le deuxième substrat (20) sont assemblés,- éventuellement, application d’un traitement thermique de recuit de collage, de préférence à une température inférieure ou égale à 500°C. Figure pour l’abrégé : figure 3.
FR1912269A 2019-10-31 2019-10-31 Procédé de collage de deux surfaces hydrophiles Active FR3102771B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR1912269A FR3102771B1 (fr) 2019-10-31 2019-10-31 Procédé de collage de deux surfaces hydrophiles
TW109132945A TW202119472A (zh) 2019-10-31 2020-09-23 接合兩個親水性表面之方法
US17/755,450 US20240150617A1 (en) 2019-10-31 2020-10-20 Method for bonding two hydrophilic surfaces
CN202080076923.9A CN114641546A (zh) 2019-10-31 2020-10-20 接合两个亲水性表面的方法
PCT/FR2020/051888 WO2021084188A1 (fr) 2019-10-31 2020-10-20 Procédé de collage de deux surfaces hydrophiles
JP2022525410A JP2023500279A (ja) 2019-10-31 2020-10-20 ２つの親水性表面を結合する方法
EP20804618.5A EP4051743A1 (fr) 2019-10-31 2020-10-20 Procédé de collage de deux surfaces hydrophiles

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1912269A FR3102771B1 (fr) 2019-10-31 2019-10-31 Procédé de collage de deux surfaces hydrophiles
FR1912269 2019-10-31

Publications (2)

Publication Number Publication Date
FR3102771A1 FR3102771A1 (fr) 2021-05-07
FR3102771B1 true FR3102771B1 (fr) 2021-10-08

Family

ID=69375579

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1912269A Active FR3102771B1 (fr) 2019-10-31 2019-10-31 Procédé de collage de deux surfaces hydrophiles

Country Status (7)

Country Link
US (1) US20240150617A1 (fr)
EP (1) EP4051743A1 (fr)
JP (1) JP2023500279A (fr)
CN (1) CN114641546A (fr)
FR (1) FR3102771B1 (fr)
TW (1) TW202119472A (fr)
WO (1) WO2021084188A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3136106B1 (fr) * 2022-05-25 2024-05-31 Commissariat Energie Atomique Procédé de collage direct assisté par une molécule basique
FR3136108B1 (fr) * 2022-05-25 2024-04-19 Commissariat Energie Atomique Procédé de collage direct assisté par des élements cationiques
FR3136107B1 (fr) * 2022-05-25 2024-05-31 Commissariat Energie Atomique Procédé de collage direct assisté par une base forte

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0649847B2 (ja) * 1986-11-18 1994-06-29 株式会社スリ−ボンド α−シアノアクリレ−ト系樹脂組成物用プライマ−
US7919391B2 (en) * 2004-12-24 2011-04-05 S.O.I.Tec Silicon On Insulator Technologies Methods for preparing a bonding surface of a semiconductor wafer
FR2981940B1 (fr) * 2011-10-26 2014-06-06 Commissariat Energie Atomique Procede de collage direct d'une couche d'oxyde de silicium
FR3000092B1 (fr) * 2012-12-26 2015-01-16 Commissariat Energie Atomique Traitement de surface par plasma chlore dans un procede de collage
EP2762535A1 (fr) * 2013-02-04 2014-08-06 Sika Technology AG Prétraitement avec adhérence et stabilité en stockage améliorées
FR3016474A1 (fr) * 2014-01-14 2015-07-17 Commissariat Energie Atomique Procede de placement et de collage de puces sur un substrat recepteur

Also Published As

Publication number Publication date
CN114641546A (zh) 2022-06-17
US20240150617A1 (en) 2024-05-09
TW202119472A (zh) 2021-05-16
FR3102771A1 (fr) 2021-05-07
JP2023500279A (ja) 2023-01-05
WO2021084188A1 (fr) 2021-05-06
EP4051743A1 (fr) 2022-09-07

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