FR3099023B1 - Structure de connexion pressée - Google Patents

Structure de connexion pressée Download PDF

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Publication number
FR3099023B1
FR3099023B1 FR1914708A FR1914708A FR3099023B1 FR 3099023 B1 FR3099023 B1 FR 3099023B1 FR 1914708 A FR1914708 A FR 1914708A FR 1914708 A FR1914708 A FR 1914708A FR 3099023 B1 FR3099023 B1 FR 3099023B1
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FR
France
Prior art keywords
connection structure
chip module
pressed connection
circuit board
mounting plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1914708A
Other languages
English (en)
Other versions
FR3099023A1 (fr
Inventor
Long Zhang
Jinming Liu
Binxi Chen
Zhaohua Liu
Xingchao Xi
Hui Sun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United Automotive Electronic Systems Co Ltd
Original Assignee
United Automotive Electronic Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Automotive Electronic Systems Co Ltd filed Critical United Automotive Electronic Systems Co Ltd
Publication of FR3099023A1 publication Critical patent/FR3099023A1/fr
Application granted granted Critical
Publication of FR3099023B1 publication Critical patent/FR3099023B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Structure de connexion pressée La présente demande fournit une structure de connexion pressée relevant du domaine des technologies de l’électronique de puissance. La structure de connexion pressée comprend : une plaque de montage sur laquelle sont prévus au moins deux éléments de support ; un module de puce disposé sur la plaque de montage et entouré par les au moins deux éléments de support, le module de puce comprenant au moins une tige s’étendant en partant de la plaque de montage ; et une carte de circuit disposée sur les au moins deux éléments de support et recouvrant le module de puce, l’au moins une tige pénétrant dans la carte de circuit pour connecter électriquement la carte de circuit au module de puce. La structure de connexion pressée fournie dans ce mode de réalisation permet une connexion stable entre le module de puce et la carte de circuit, assurant ainsi les performances et la stabilité de la structure de connexion pressée. Figure pour l'abrégé : figure 2
FR1914708A 2019-07-16 2019-12-18 Structure de connexion pressée Active FR3099023B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201921112136.6U CN210110745U (zh) 2019-07-16 2019-07-16 压接结构
CN201921112136.6 2019-07-16

Publications (2)

Publication Number Publication Date
FR3099023A1 FR3099023A1 (fr) 2021-01-22
FR3099023B1 true FR3099023B1 (fr) 2022-09-30

Family

ID=69566564

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1914708A Active FR3099023B1 (fr) 2019-07-16 2019-12-18 Structure de connexion pressée

Country Status (3)

Country Link
CN (1) CN210110745U (fr)
DE (1) DE202019107246U1 (fr)
FR (1) FR3099023B1 (fr)

Also Published As

Publication number Publication date
CN210110745U (zh) 2020-02-21
DE202019107246U1 (de) 2020-04-29
FR3099023A1 (fr) 2021-01-22

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