FR3081994B1 - PROCESS FOR CHARACTERIZING THE CONDITION OF A PART BY MEANS OF A DEFORMATION SENSOR OF THE EXTENSOMETRY GAUGE TYPE - Google Patents
PROCESS FOR CHARACTERIZING THE CONDITION OF A PART BY MEANS OF A DEFORMATION SENSOR OF THE EXTENSOMETRY GAUGE TYPE Download PDFInfo
- Publication number
- FR3081994B1 FR3081994B1 FR1854648A FR1854648A FR3081994B1 FR 3081994 B1 FR3081994 B1 FR 3081994B1 FR 1854648 A FR1854648 A FR 1854648A FR 1854648 A FR1854648 A FR 1854648A FR 3081994 B1 FR3081994 B1 FR 3081994B1
- Authority
- FR
- France
- Prior art keywords
- cutting
- deformation sensor
- characterizing
- condition
- observation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title abstract 2
- 230000007547 defect Effects 0.000 abstract 3
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
- G01N2001/2873—Cutting or cleaving
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/022—Environment of the test
- G01N2203/0244—Tests performed "in situ" or after "in situ" use
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/022—Environment of the test
- G01N2203/0248—Tests "on-line" during fabrication
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/0617—Electrical or magnetic indicating, recording or sensing means
- G01N2203/0623—Electrical or magnetic indicating, recording or sensing means using piezoelectric gauges
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
L'invention concerne un procédé de caractérisation de l'état d'une pièce par une découpe de la pièce, de préférence en tronçons, selon une trajectoire de découpe de manière à obtenir un plan d'observation et par analyse de ce plan d'observation. Il comprend en outre : - avant la découpe, la fixation, sur une surface de la pièce, d'au moins un capteur de déformation, ledit capteur étant configuré pour émettre des signaux de sortie dépendant de déformations associées à des contraintes subies par la pièce au cours de la découpe ; -pendant la découpe, l'acquisition des signaux émis par le capteur de déformation ; -la détermination, à partir des signaux acquis, d'au moins une contrainte d'intérêt dont la valeur est supérieure à un seuil fixé ; - la localisation, sur la trajectoire de découpe, de ladite au moins une contrainte d'intérêt, de manière à obtenir une carte de défauts attribuables à la découpe ; - la mise en correspondance de la carte de défauts avec le plan d'observation, de manière à pouvoir exclure de l'analyse du plan d'observation les défauts attribuables à la découpe.The invention relates to a method for characterizing the state of a part by cutting the part, preferably into sections, along a cutting path so as to obtain an observation plane and by analyzing this plane of. observation. It further comprises: - before cutting, fixing, on a surface of the part, of at least one deformation sensor, said sensor being configured to emit output signals depending on deformations associated with stresses undergone by the part during cutting; during cutting, the acquisition of the signals emitted by the deformation sensor; the determination, from the signals acquired, of at least one constraint of interest, the value of which is greater than a fixed threshold; the location, on the cutting path, of said at least one constraint of interest, so as to obtain a map of defects attributable to the cutting; - the matching of the defect map with the observation plane, so as to be able to exclude from the analysis of the observation plane the defects attributable to the cutting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1854648A FR3081994B1 (en) | 2018-05-30 | 2018-05-30 | PROCESS FOR CHARACTERIZING THE CONDITION OF A PART BY MEANS OF A DEFORMATION SENSOR OF THE EXTENSOMETRY GAUGE TYPE |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1854648 | 2018-05-30 | ||
FR1854648A FR3081994B1 (en) | 2018-05-30 | 2018-05-30 | PROCESS FOR CHARACTERIZING THE CONDITION OF A PART BY MEANS OF A DEFORMATION SENSOR OF THE EXTENSOMETRY GAUGE TYPE |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3081994A1 FR3081994A1 (en) | 2019-12-06 |
FR3081994B1 true FR3081994B1 (en) | 2020-08-14 |
Family
ID=62816831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1854648A Active FR3081994B1 (en) | 2018-05-30 | 2018-05-30 | PROCESS FOR CHARACTERIZING THE CONDITION OF A PART BY MEANS OF A DEFORMATION SENSOR OF THE EXTENSOMETRY GAUGE TYPE |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR3081994B1 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7549345B2 (en) * | 2004-06-14 | 2009-06-23 | Surface Technology Holdings, Ltd. | Method and apparatus for sensing distortion |
US8635026B2 (en) * | 2010-09-07 | 2014-01-21 | Saudi Arabian Oil Company | Determination of rock mechanics from applied force to area measures while slabbing core samples |
JP6562670B2 (en) * | 2015-03-23 | 2019-08-21 | 株式会社ディスコ | Workpiece cutting method |
-
2018
- 2018-05-30 FR FR1854648A patent/FR3081994B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
FR3081994A1 (en) | 2019-12-06 |
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Legal Events
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PLFP | Fee payment |
Year of fee payment: 2 |
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PLSC | Publication of the preliminary search report |
Effective date: 20191206 |
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Year of fee payment: 3 |
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Year of fee payment: 4 |
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PLFP | Fee payment |
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